TECHNICAL FIELD OF THE INVENTION

This invention relates in general to clamping devices and methods, and in particular to a bellows clamp actuator and method for holding a silicon semiconductor slice cassette.

BACKGROUND OF THE INVENTION

In semiconductor vacuum processing, semiconductor slices are stored in cassettes formed from plastic or other suitable material. The plastic cassettes are then placed in a vacuum container, and the semiconductor slices are removed, often byrobot arms, from the cassettes for various processing steps to form complete semiconductor devices. Over time, these cassettes can become warped from exposure to heat or damaged from handling. When damage to the cassette occurs, it becomes difficult toprogram an automatic robot arm to accurately locate and remove the slice from the cassette, as robot arms require exact alignment of the semiconductor slices. It is, therefore, desirable to ensure that the cassette is positioned so that thesemiconductor slices are very accurately aligned. To achieve accurate positioning of a slice, it is necessary to force the cassette square, i.e., vertical surfaces vertical and horizontal surfaces horizontal, to remove the effects of any bending orwarping that has occurred to the cassette.

In an attempt to properly position and hold the cassettes in a vacuum container, several unsatisfactory alternatives have heretofore been developed. One alternative involves the use of hydraulically or pneumatically activated clamp fingers whichare used to grip the vertical sidewalls of the cassette and force them against the walls of the vacuum container in which they are positioned for use. The use of these fingers generally suffice to secure the cassette in place, but will not compensatefor any warpage or bend in the cassette. Therefore, the semiconductor slices may not be accurately positioned in case of damage to the cassette.

Another alternative heretofore developed involves the use of a hydraulically or pneumatically activated cylinder having an attached push plate. When the cassette is placed in position in a vacuum, the hydraulic or pneumatic cylinder is activatedto press the plate against the back of the cassette, forcing the cassette against the wall of the vacuum container. Again, this method will suffice to secure the cassette in place, but does not compensate for any warpage or bend in the cassette and thesemiconductor slice may thus not be accurately positioned.

Other alternatives have been developed that will compensate for warpage or bend as well as secure the cassette in place. These methods are complex devices that include hydraulic or pneumatic cylinders that pass through the walls of the vacuumcontainer. Any device that passes through the walls of the container will create an opening that must be sealed to keep the vacuum. These alternative methods have not provided a simple device that compensates for warpage or bend and still provides aneffective seal. Thus, a need has arisen for a holding and clamping device that will properly position the cassette and compensate for any warpage or bend in the cassette so that the semiconductor slices are very accurately positioned for removal by anautomatic robot arm or device and still maintain a vacuum within the container.

SUMMARY OF THE INVENTION

The present invention disclosed and claimed herein describes a method and apparatus for securing and accurately positioning a semiconductor slice cassette which substantially eliminates problems associated with prior holding and clamping devices. The present invention allows the holding of a cassette in an evacuated container so as to position a semiconductor slice in the cassette in a precise attitude for removal by an automatic device.

In accordance with one aspect of the present invention, a clamp is attached to a bellows, which is in-turn attached to a support structure. The clamp is designed to contact and hold a work station, such as a semiconductor slice cassette. Theclamp and the bellows are extended so as to contact the work station, which is thus secured in position.

In accordance with another aspect of the present invention, a pair of guide posts are installed in a semiconductor slice processing container or load lock. The guide posts are a metal which is selected to prevent the generation of any unwantedstray particles which may contaminate the evacuated container and the semiconductor slice. The guide posts are designed to receive the vertical front sidewalls of the cassette in the precise vertical and parallel attitude required to level thesemiconductor slices in the cassette.

The cassette is forced against the guide posts and, therefore, squared into position by a bellows clamp actuator. The bellows clamp actuator comprises a V-bar clamp which contacts the top rear horizontal edge of the cassette. The V-bar clamp isattached to a bellows which is in turn secured to the back wall of the load lock. The interior of the bellows communicates through a hole in the back of the container with the outside atmosphere. The cassette is placed in the container which is closedand a vacuum is drawn within the container. As the vacuum is drawn, the bellows expands due to the difference in internal and external pressure which forces the V-bar clamp against the top rear horizontal edge of the cassette. The cassette is thusforced into the guide posts squaring the cassette and compensating for any warpage or bending.

It is a technical advantage of the present invention that it compensates for any warpage that may have occurred to a cassette over time. By removing the warpage, it is possible to provide a level cassette, a level semiconductor slice and, thus awork station that is adaptable to automatic handling devices. It is another technical advantage of the present invention that no extra openings are created that may compromise the integrity of the vacuum within the load lock. It is another technicaladvantage that no mechanisms, such as cylinders and their associated controls passing through the walls of the container, are required.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention and for further advantages thereof, reference is now made to the following Detailed Description taken in conjunction with the accompanying Drawings in which:

FIG. 1 is a cross-sectional side view of the preferred embodiment of the present invention; and

FIG. 2 is a top view of the guide posts and cassette of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, the bellows clamp actuator of the present invention is generally identified by the reference numeral 10. The bellows clamp actuator 10 is used in combination with an evacuated load lock or container 12 which is used forreceiving and holding a work station such as a conventional semiconductor slice cassette 14. The container 12 is designed to create a clean, particle free environment for the semiconductor slice. It is desirable to maintain a clean, particle freeenvironment for the semiconductor slice, because the circuitry on the slice is so small it can be shorted out or otherwise negatively affected by submicron particles, such as dirt or dust in the air.

The container 12 is made of a metallic substance, for example aluminum, which is selected to prevent particle emission into the atmosphere. The container 12 includes a door 18 which swings open on a hinge 20 and is sealed with an air seal 22. The container 12 is also provided with a gate 26 which has a seal 28. Although not shown, the container 12 is normally secured to another evacuated container which is accessed through the gate 26. When the container 12 is evacuated, the gate 26 slidesdownward in the direction of arrow 32 for access from the other evacuated container, not shown.

Secured to the floor 34 of the container 12 is a pair of vertical guide posts 36, one of which is shown in FIG. 1. The guide posts 36 are perpendicular to the floor 34 and are parallel to each other. The guide posts 36 may be integral with orsecured to a horizontal support piece (not shown) which would, in-turn, be secured or integral with the floor 34. The guide posts 36 are constructed and arranged so as to receive the semiconductor slice cassette 14, as will be described more fullybelow, and to form an opening through which a semiconductor slice may be removed.

The bellows clamp actuator 10 comprises a hollow bellows 38. The bellows 38 is fixably attached at one end to a V-bar clamp 40 which is designed to fit the top rear horizontal edge 42 of the cassette 14. Although not shown, the clamp 40 couldhave various other shapes to include a flat bar. A shaft 44 is integral with the clamp 40. The bellows 38 has holes 46 and 48 through which the shaft 44 passes. When the shaft 44 is passed through the hole 48, a washer 50 is secured to the shaft by aretaining ring 52. The shaft 44 and the washer 50 prevent overextension of the bellows 38 by acting as a stop. Integral with the bottom plate 53 of the bellows 38 is a support cylinder 54 which is provided to prevent excessive side-to-side movement ofthe bellows 38.

The bellows 38 is connected to the clamp 40 by any appropriate method, such as, for example, bolts 58 through holes 60, and is sealed by 0-ring 61. The bellows 38 is then connected to a mounting device 56 by any appropriate method, such as,bolts 62 through holes 64, and sealed by 0-ring 65. The mounting device 56 is hollow and forms a void 66. The mounting device 56 is in turn secured to the door 18 by any appropriate means such as, for example, bolts 68 through holes 70, and is sealedby O-ring 71. A hole 72 is drilled through the door 18 to connect the void 66 to the open atmosphere exterior the container 12. The void 66 is connected to a chamber 67 through the hole 48. The chamber 67 is formed by the hollow interior of thebellows 38.

Referring to FIG. 2, the guide posts 36 and the cassette 14 are seen in a top view. Shown in dotted lines is a silicon semiconductor slice 80. The guide posts 36 are seen to be generally L-shaped and are mirror images of each other. The guideposts 36 have sloping surfaces 82 which lead to notched portions 84. Notched portions 84 are constructed and arranged so as to match the front edges 86 and the side edges 88 of the cassette 14. The guide posts 36 are spaced apart a distance X so thatthe notched portions 84 correspond precisely with the width of the cassette 14. Thus, it can be seen that when pressure is applied to the back edge 42 by the clamp 40, the cassette 14 is firmly wedged into and against the guide posts 36. This actionforces the cassette 14 square, allowing the semiconductor slice 80 to be accurately positioned in the desired horizontal orientation.

In the operation of the present invention, the container 12 is opened by swinging the door 18 about hinge 20. An operator (or an automatic device) places a cassette 14 in the container 12 by positioning it against the guide post 36. At thistime, it should be noted that the gate 26 would be in its closed position. The door 18 is then swung downward about hinge 20 and secured in place. A vacuum is now drawn within the container 12 (vacuum pump and associated connections not shown). Apressure differential is created by evacuating the container 12. Due to the hole 72 in the door 18, atmospheric pressure remains within the chamber 67 and the bellows 38. This pressure differential is transmitted to the surface of the clamp 40.

Atmospheric pressure, approximately 14.7 pounds per square inch, is transmitted to the clamp 40 and results in an extension of the clamp actuator 10 in the direction of an arrow 74. The extension of clamp actuator 10 in the direction of thearrow 74 results in pressure against the cassette 14 at the edge 42. This pressure in the direction of the arrow 74 results in a horizontal pressure as indicated by arrow 76 and a vertical pressure as indicated by arrow 78. These pressures, asindicated by arrows 76 and 78, force the cassette 14 into the guide posts 36 which in turn, squares the cassette 14 and removes any warpage in the cassette 14. The cassette 14 is now properly positioned and the semiconductor slices are maintained in aprecise level position. The gate 26 may now be opened in the direction of the arrow 32, and the semiconductor slices may be removed from the cassette 14 by an automatic device (not shown).

Although the present invention has been described with respect to a specific preferred embodiment thereof, various changes and modifications may be suggested to one skilled in the art and it is intended that the present invention encompass suchchanges and modifications as fall within the scope of the appended claims.

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