Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence to the bonding contact area, wherein the knife is mounted so as to be yielding with respect to the movement component perpendicular to the substrate surface, so that the force acting on the cutting edge of the knife when the knife encounters the substrate is limited to a prespecified peak value.

A bonding machine chip-transferring station, with a multi-axial positioning mechanism and a suction-needle module mounted and positionable thereon, with a housing, a suction needle connected to a vacuum conduit, and a suction-needle conveyance unit, including a drive motor, a belt transmission coupled thereto, and a suction-needle reversal means driven by the transmission, wherein the suction-needle reversal means includes a suction-needle holder seated on an axle and a pulley nonrotatably connected to the axle, where the suction-needle holder includes a guide block on which is mounted a suction-needle carriage movable only in the Z direction, supports the suction needle, and bears a carrier bolt oriented parallel to the axle, and an actuator fork nonrotatably connected to the pulley, via the axle, with which is engaged the carrier bolt extending from the suction-needle carriage and by means of which the suction-needle carriage is driven and constrained exclusively in the .+-.Z directions.