Hot melt coating composition, particularly suitable for low viscosity requiring application techniques, the composition having a Tg below 5.degree. C., preferably below -20.degree. C., and a viscosity below 2,000 mPa.s, preferably below 600 mPa.s, measured at 70.degree. C. at a shear rate of 10 s.sup.-1. The composition includes at least one amorphous binder having a Tg below 5.degree. C., preferably below -20.degree. C., and/or at least one crystalline or semi-crystalline binder having a melting point or melting range below 150.degree. C. The composition can be a one component system comprising an epoxy-functional resin, a polyamine having cyanamide groups, preferably dicyandiamide, and a blocked catalyst which is unblocked at an elevated temperature below the curing temperature. Alternatively, the composition may be one component of a two-component system based on isocyanate/polyol crosslinking.