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US6896763 Method and apparatus for monitoring a process by employing principal component analysis - May 24, 2005

US20030136511 Method and apparatus for monitoring a process by employing principal component analysis - Jul 24, 2003

US6589869 Film thickness control using spectral interferometry - Jul 08, 2003

US6521080 Method and apparatus for monitoring a process by employing principal component analysis - Feb 18, 2003

US6455437 Method and apparatus for monitoring the process state of a semiconductor device fabrication process - Sep 24, 2002

US20020119660 Film thickness control using spectral interferometry - Aug 29, 2002

US6413867 Film thickness control using spectral interferometry - Jul 02, 2002

US20020055259 Method and apparatus for monitoring a process by employing principal component analysis - May 09, 2002

US6368975 Method and apparatus for monitoring a process by employing principal component analysis - Apr 09, 2002

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