Methods of packaging devices such as MEMS devices are disclosed. An illustrative method of packaging a device in accordance with an illustrative embodiment of the present invention can include the steps of providing a substrate having an device provided therein or thereon, attaching a cap to the substrate and sealing the device within an interior cavity of the capped substrate, inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity, and then injection molding a package about the capped substrate in the vacuum chamber. A number of small-sized openings disposed through the cap can be utilized to create a controlled vacuum pressure within the interior cavity of the device when the device is in the vacuum chamber, prior to injection molding the package about the capped substrate. In some embodiments, an inert gas can be injected into the evacuated interior cavity to create a partial pressure for the inertial sensor, prior to injection molding the package about the capped substrate.
Systems and methods for automatically attaching preforms to substrates. An example system includes a nest, a first component that places a substrate into the nest, a second component that places a preform on the substrate in the nest, a tacking device that tacks the preform to the substrate, a plurality of sensors that sense operational states of the components and the tacking device, and a controller that automatically controls operations of the components and the tacking device based on the sensed operational states.
A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.
A method and a fused compound wafer including at least one first MEMS sensor and at least second MEMS sensor includes a first wafer. The first wafer includes at least one first MEMS sensor first subassembly and at least one second MEMS sensor first subassembly. A second wafer includes at least one first MEMS sensor second subassembly, at least one second MEMS sensor second assembly, and a fusing matrix. The fusing matrix includes a first joint configured to encapsulate each of the at least one first MEMS sensor first assembly and each of the at least one first MEMS sensor second assembly forming each at least one first MEMS sensor. A second joint is configured to encapsulate each of the at least one second MEMS first subassembly and each of the at least one second MEMS second subassembly forming each at least one second MEMS sensor.
A package for packaging one or more MEMS devices is disclosed. A package in accordance with an illustrative embodiment of the present invention can include a packaging structure having a base section, a top section, and an interior cavity adapted to contain a number of MEMS devices therein. In some embodiments, the packaging structure can include a first side, a second side, a third side, and a top end, which, in certain embodiments, may form a pinout plane surface that can be used to connect the packaging structure to other external components. In some embodiments, a number of MEMS-type inertial sensors contained within the interior cavity of the packaging structure can be used to detect and measure motion in multiple dimensions, if desired.