A system is provided that simultaneously gathers three-dimensional and two-dimensional data for use in inspecting objects such as chip carriers for defects. Specifically, a source laser beam is directed to an object and forms a spot at the point of impingement at a known X-Y position on the object. The laser beam is reflected at the spot and light reflected off-axially with respect to the source laser beam is detected by two position sensing detectors (PSDs). Simultaneous to detecting off-axially reflected light, retro-reflected light (i.e., the light reflected approximately co-axial with the source laser) is detected by a photo diode array.