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N&K Technology. Inc.

City: Santa Clara
State/Country: CA US

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The present invention provides a method for monitoring a modifying-process taking place in a thin-film sample and thereby characterizing the sample thus modified, wherein the modifying-process is performed for purpose of improving physical properties of the sample. The present invention further provides a monitoring tool for characterizing various thin-film processes. Advantages of the method of the present invention are manifest in its non-intrusive nature, fast (or real-time) response, robust sensitivity, and versatility in a variety of thin-film processes. Another inherent advantage of the present invention is that an assortment of the "n&k" parameters can be obtained by using only measurement tool, in contrast to two (or more) simultaneous measurement tools used in the prior art.

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