The present invention relates to a creosote resistant epoxy adhesive system comprising (A) a low viscosity primer comprising (a) a resin component comprising diglycidyl ether of Bisphenol A, diglycidyl ether of butanediol, and epoxy silane; and (b) a hardener component comprising an aliphatic amine; and (B) an adhesive component comprising (a) a resin component comprising diglycidyl ether of Bisphenol A, a diluent, a filler, and epoxy silane; and (b) a hardener component comprising a combination of (i) an aliphatic or aromatic amine and (ii) a polyamide or an adducted amine with diglycidyl ether of Bisphenol, and a filler and wherein a flexibilizer is present in either component (a) or component (b) of said adhesive component.

The present invention relates to a thermoplastic hot melt adhesive comprising (a) a block copolymer, said block copolymer being prepared utilizing a bromide based coupling agent, said block copolymer comprising at least two monoalkenyl arene polymer end blocks A and at least one elastomeric conjugated diene polymer mid block B, and said block copolymer having about 8 to about 65 percent by weight of said monoalkenyl arene polymer block content, each polymer block A having an average molecular weight of between about 5,000 and about 125,000, and each polymer block B having an average molecular weight of between about 10,000 and about 300,000, (b) a polyisobutylene rubber, (c) a partially cross-linked polyisobutylene rubber (d) a compatible tackifying resin, (e) a phenolic antioxidant, (f) a non-reactive phenolic resin, (g) a fluorocarbon surface active agent, and (h) a petroleum derived wax.