A resin-coated carrier having a sheet-like base, the sheet-like base corresponding to the shape of a PC board substrate on a relatively smaller scale, and a resin of a predetermined thickness covered over one side of the sheet-like base for bonding to a PC board substrate for making a PC board without causing an overflow of the resin.

A resin coated carrier fabrication method and the related apparatus in which a metered material feeder is controlled to apply a bonding agent to the periphery of a continuously rotated material-transferring cylinder subject to a predetermined thickness and simultaneously a tape of carrier is extended over an impression cylinder, and then a driving mechanism is controlled to adjust the gap between the material-transferring cylinder and the impression cylinder for enabling the bonding agent to be transferred to the tape of carrier, leaving a blank area around the applied layer of bonding agent on the tape of carrier.