A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction.

A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.