Multiple capacitors of different values are formed in multi-layer printed circuit boards. Mirror image plates are formed on facing internal copper layers of printed circuit boards. The plates are coated with a dielectric material, preferably a liquid "ink," such as a titanium dioxide liquid. At least one layer of bonding material is placed between the circuit board layers, having cut-outs to receive the plates, and to encapsulate the dielectric material. The cured package can contain multiple capacitors of different values in a single layer.