The method of forming a pattern on a substrate is described which includes first applying a film of thermo plastic material under pressure to a substrate. Energy is then supplied to dissipate heat at the surface of the film facing the substrate thereby to bond the film to the substrate. Next, areas of the film are selectively dry etched to form a predetermined pattern on the substrate and this is followed by depositing on the substrate in the areas where the film has been dry etched, a layer of patterning material. Finally, dry removal from the substrate is effected of the film remaining thereon. There is also described the application of this method to the manufacture of an array, drop-on-demand ink jet printer.
An integral abrasive cutting tool comprising a multiplicity of equally spaced parallel coaxial abrasive cutting discs is formed by rotating a cylindrical mandrel coated with a matrix of abrasive powder in a metal in a fluid bath. A wire is aligned tangentially with the coating and voltage pulses are applied therebetween while the wire is fed in its lengthwise direction past the coating. The wire is translated axially to each of a plurality of disc spacing locations and, at each such location, translated radially to effect electro erosion of the coating forming a channel therein. An abrasive cutting disc is thereby provided between each pair of successive channels.