A forming apparatus for bending the leads of a semiconductor package including a body portion, and a plurality of leads extending from the sides of the body portion to a predetermined configuration. The forming die includes a series of walls arranged in a predetermined pattern having a seat for the body portion of the semiconductor package and a series of stepped outer wall portions. A plurality of a elongated spaced rigid portions on the outer surface of the wall portion define a series of grooves for receiving the leads of the semiconductor package. A punch adapted for reciprocating movement relative to the forming die engages and presses the leads into the grooves so that the leads conform to the outer wall portions of the die.