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| Patent # | Description |
|---|---|
| 2017/0133259 |
System and Method for Peeling a Semiconductor Chip From a Tape Using a
Multistage Ejector A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural... |
| 2017/0133258 |
ELECTROSTATIC CHUCK An electrostatic chuck includes an anisotropic heat conductor which is disposed between an attraction substrate and a first heater member, and has an upper... |
| 2017/0133257 |
METHOD OF TRANSFERRING MICRO-DEVICE A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the... |
| 2017/0133256 |
INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND EXPOSURE
ALIGNMENT SYSTEM In some embodiments, an interconnection structure, an exposure alignment system, and a fabricating method thereof are provided. The method comprises: providing... |
| 2017/0133255 |
STACKED WAFER CASSETTE LOADING SYSTEM A substrate cassette loading system for docking substrate cassettes to a substrate processing system is provided. A plurality of ports passes substrates into... |
| 2017/0133254 |
PURGE DEVICE, PURGE SYSTEM, PURGE METHOD, AND CONTROL METHOD IN PURGE
SYSTEM A purge device configured to purge the inside of a storage container storing a product with purge gas includes a plurality of placing units, each configured to... |
| 2017/0133253 |
Method and Apparatus for Use in Wafer Processing A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light... |
| 2017/0133252 |
TECHNIQUES FOR COMBINING CMP PROCESS TRACKING DATA WITH 3D PRINTED CMP
CONSUMABLES Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads,... |
| 2017/0133250 |
PRINTING TRANSFERABLE COMPONENTS USING MICROSTRUCTURED ELASTOMERIC
SURFACES WITH PRESSURE MODULATED REVERSIBLE... In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface... |
| 2017/0133249 |
APPARATUS FOR LAMINATING A TAPE FILM ON A SUBSTRATE AND A SYSTEM OF
FABRICATING A SEMICONDUCTOR DEVICE USING... A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder... |
| 2017/0133248 |
PRINTING TRANSFERABLE COMPONENTS USING MICROSTRUCTURED ELASTOMERIC
SURFACES WITH PRESSURE MODULATED REVERSIBLE... In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface... |
| 2017/0133247 |
HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR HEATING SUBSTRATE
BY IRRADIATING SUBSTRATE WITH FLASH OF... A flash heating part in a heat treatment apparatus includes 30 built-in flash lamps, and irradiates a semiconductor wafer held by a holder in a chamber with a... |
| 2017/0133246 |
METHOD AND APPARATUS FOR FORMING A TRANSPARENT CONDUCTIVE OXIDE USING
HYDROGEN A method and apparatus for forming a crystalline cadmium stannate layer of a photovoltaic device by heating an amorphous layer in the presence of hydrogen gas. |
| 2017/0133245 |
SUBSTRATE MOUNTING MECHANISM AND SUBSTRATE PROCESSING APPARATUS A substrate mounting mechanism, for heating and cooling a substrate mounted thereon, includes a heating member having a heating unit configured to heat a... |
| 2017/0133244 |
COOLING BASE WITH SPIRAL CHANNELS FOR ESC Implementations described herein provide a cooling base and a substrate support assembly having the same. In one example, a cooling base is provided that... |
| 2017/0133243 |
SAMPLE HOLDER, DEVICE AND METHOD FOR DETACHING OF A FIRST SUBSTRATE A method and device for detaching a first substrate, which is connected to a second substrate by an interconnect layer, from the second substrate by... |
| 2017/0133242 |
METHOD OF PRIMING AND DRYING SUBSTRATES A method of priming and drying substrates having high-aspect ratio trenches. In one aspect, the method comprises: a) supporting at least one substrate having... |
| 2017/0133241 |
DRY SEPARATION APPARATUS, NOZZLE FOR GENERATING HIGH-SPEED PARTICLE BEAM
FOR DRY SEPARATION A dry separation method is a dry separation method for ashing a photoresist, including a spraying and separating step of spraying sublimation particles on the... |
| 2017/0133240 |
Silicon Heat-Dissipation Package For Compact Electronic Devices Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover... |
| 2017/0133239 |
SEMICONDUCTOR DEVICE WITH HIGH THERMAL CONDUCTIVITY SUBSTRATE AND PROCESS
FOR MAKING THE SAME The present disclosure relates to a process of forming a high thermal conductivity substrate for an Aluminum/Gallium/Indium (III)-Nitride semiconductor device.... |
| 2017/0133237 |
POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING
LIQUID Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group,... |
| 2017/0133236 |
Composite Abrasive Particles For Chemical Mechanical Planarization
Composition And Method Of Use Thereof Polishing compositions comprising ceria coated silica particles offer minimal topography, reduced oxide and nitride losses, while providing high oxide polish... |
| 2017/0133235 |
SUBSTRATE TREATMENT METHOD, COMPUTER READABLE STORAGE MEDIUM AND SUBSTRATE
TREATMENT SYSTEM A substrate treatment method includes: forming a plurality of circular patterns of a resist film on a substrate; thereafter applying a first block copolymer;... |
| 2017/0133233 |
METHOD FOR PROCESSING OBJECT TO BE PROCESSED In a method according to one embodiment, a first processing gas is supplied into a processing container of a plasma processing apparatus, and a plasma of the... |
| 2017/0133232 |
METHODS FOR SELECTIVE ETCHING OF A SILICON MATERIAL The present disclosure provides methods for etching features in a silicon material includes performing a remote plasma process formed from an etching gas... |
| 2017/0133231 |
METHOD FOR DEPOSITING EXTREMELY LOW RESISTIVITY TUNGSTEN Methods for depositing extremely low resistivity tungsten in semiconductor processing are disclosed herein. Methods involve annealing the substrate at various... |
| 2017/0133230 |
SEMICONDUCTOR DEVICE HAVING VERTICAL SILICON PILLAR TRANSISTOR A semiconductor device includes a transistor disposed on a substrate, a first insulation layer, a second insulation layer, an epitaxy and a conductive... |
| 2017/0133229 |
Memory Devices and Method of Fabricating Same A method comprises forming a control gate structure over a substrate, depositing a memory gate layer over the substrate, applying a first etching process to... |
| 2017/0133228 |
SYSTEM AND METHOD FOR MITIGATING OXIDE GROWTH IN A GATE DIELECTRIC Oxide growth of a gate dielectric layer that occurs between processes used in the fabrication of a gate dielectric structure can be reduced. The reduction in... |
| 2017/0133227 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE To improve accuracy and shielding capabilities of impurity implantation, a method of manufacturing a semiconductor device is provided, the method including... |
| 2017/0133226 |
DIAMOND SEMICONDUCTOR SYSTEM AND METHOD Disclosed herein is a new and improved system and method for fabricating diamond semiconductors. The method may include the steps of selecting a diamond... |
| 2017/0133225 |
Apparatus and Method for FinFETs A method comprises performing a surface treatment on a plurality of recesses in a substrate to form a first cloak-shaped recess, a second cloak-shaped recess... |
| 2017/0133224 |
INTEGRATED PROCESS AND STRUCTURE TO FORM III-V CHANNEL FOR SUB-7NM CMOS
DEVICES Embodiments described herein generally relate to methods and structures for forming precise fins comprising Group III-V elements on a silicon substrate. A... |
| 2017/0133223 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE In accordance with an embodiment of the present disclosure, a method of manufacturing a semiconductor device may include forming an opening passing-through a... |
| 2017/0133222 |
Fabrication and Structures of Crystalline Material A surface of the first semiconductor crystalline material has a reduced roughness. A semiconductor device includes a low defect, strained second semiconductor... |
| 2017/0133221 |
BUFFER STACK FOR GROUP IIIA-N DEVICES A method of fabricating a multi-layer epitaxial buffer layer stack for transistors includes depositing a buffer stack on a substrate. A first voided Group... |
| 2017/0133220 |
METHOD OF MATERIAL DEPOSITION A method and apparatus for material deposition onto a sample to form a protective layer composed of at least two materials that have been formulated and... |
| 2017/0133219 |
MATERIAL LAYERS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, AND METHODS OF
FABRICATING MATERIAL LAYERS AND... A material layer, a semiconductor device including the material layer, and methods of forming the material layer and the semiconductor device are provided... |
| 2017/0133218 |
APPARATUS AND METHOD FOR WAFER CLEANING A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct... |
| 2017/0133217 |
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE A semiconductor substrate including: substrate; buffer layer provided on substrate; high-resistance layer provided on buffer layer, high-resistance layer being... |
| 2017/0133216 |
Si PRECURSORS FOR DEPOSITION OF SiN AT LOW TEMPERATURES Methods and precursors for depositing silicon nitride films by atomic layer deposition (ALD) are provided. In some embodiments the silicon precursors comprise... |
| 2017/0133214 |
MASS SPECTROMETERS HAVING REAL TIME ION ISOLATION SIGNAL GENERATORS Apparatuses, systems, and methods for performing mass analysis are disclosed. One such apparatus may include an ion trap device for use in a mass analysis... |
| 2017/0133213 |
Method of Transmitting Ions Through an Aperture A mass spectrometer is disclosed comprising: an ion source; an aperture; a flight region arranged between the ion source and aperture for separating ions... |
| 2017/0133212 |
PORTABLE ELECTRONIC DEVICE FOR THE ANALYSIS OF A GASEOUS COMPOSITION An electronic device 1 for analyzing a gas composition, which is present in an environment A at an environment pressure Pa, is described. The device 1 is... |
| 2017/0133211 |
Time Shift for Improved Ion Mobility Spectrometry or Separation
Digitisation A method of analysing ions is disclosed comprising: (i) separating ions according to a physico-chemical property in a separator; (ii) transmitting ions which... |
| 2017/0133210 |
Laminated Ultra-High Vacuum Forming Device Provided is an ultra-high vacuum forming device containing an ion pump having a compact size in the central axis direction. The ultra-high vacuum forming... |
| 2017/0133209 |
SPUTTERING TARGET A target, in particular a sputtering target, includes a target plate of a brittle material and a back plate. The back plate is connected to the target plate... |
| 2017/0133208 |
HALL EFFECT ENHANCED CAPACITIVELY COUPLED PLASMA SOURCE, AN ABATEMENT
SYSTEM, AND VACUUM PROCESSING SYSTEM Embodiments disclosed herein include a method for abating compounds produced in semiconductor processes. The method includes energizing an abating agent,... |
| 2017/0133207 |
RARE-EARTH OXIDE BASED COATINGS BASED ON ION ASSISTED DEPOSITION A component for a semiconductor processing chamber includes a ceramic body having at least one surface with a first average surface roughness of approximately... |
| 2017/0133206 |
METHOD OF PROCESSING WORKPIECE Provided is a method of processing a wafer, which is performed in a processing container of a plasma processing apparatus. This method is a plasma etching... |
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