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Patent # Description
2017/0148853 PROCESSES FOR FABRICATING ORGANIC X-RAY DETECTORS, RELATED ORGANIC X-RAY DETECTORS AND SYSTEMS
A process for fabricating an organic x-ray detector is presented. The process includes forming a layered structure that includes disposing a first electrode...
2017/0148852 Memory Arrays and Methods of Forming Memory Arrays
Some embodiments include a memory array having a first memory cell adjacent to a second memory cell along a lateral direction. The second memory cell is...
2017/0148851 3D VERTICAL MEMORY ARRAY CELL STRUCTURES AND PROCESSES
Three-dimensional vertical memory array cell structures and processes. In an exemplary embodiment, a cell structure includes a word line, a selector layer, and...
2017/0148850 MEMORY DEVICE STRUCTURE
A memory device structure includes a wafer substrate and a magnetic tunnel junction (MTJ) positioned above an upper surface of the wafer substrate. The MTJ...
2017/0148849 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
The present disclosure provides a semiconductor structure, including a logic region and a memory region adjacent to the logic region. The memory region...
2017/0148848 MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
An MRAM device includes a lower electrode on a substrate, an MTJ structure on the lower electrode, a metal oxide pattern on the MTJ structure, a conductive...
2017/0148847 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device may include: a substrate; a first mold layer formed over the substrate and comprising a plurality of bottom conductive patterns...
2017/0148846 LIGHT EMITTING APPARATUS
A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at...
2017/0148845 LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR AND METHOD OF FABRICATING THE SAME
A light-emitting diode package including a body and leads. The body comprising a mounting surface. The light emitting diode package also includes a light...
2017/0148844 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
A chip package includes a chip, an adhesive layer, and a dam element. The chip has a sensing area, a first surface, and a second surface that is opposite to...
2017/0148843 IMAGING PANEL AND X-RAY IMAGING SYSTEM PROVIDED WITH SAID IMAGING PANEL
An aim of the present invention is to improve the conversion efficiency of scintillation light into electric charge by a photoelectric conversion element in an...
2017/0148842 IMAGE SENSOR AND MONITORING SYSTEM
The present invention proposes an image sensor, a monitoring system and a method for designing an image sensor, the image sensor including: a color filter,...
2017/0148841 SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
The present disclosure relates to a solid-state image sensor and an electronic device enabling prevention of entrance of incident light from adjacent pixels...
2017/0148840 SOLID-STATE IMAGING ELEMENT, METHOD OF MANUFACTURING THE SAME, AND IMAGING DEVICE
In pixels that are two-dimensionally arranged in a matrix fashion in the pixel array unit of a solid-state imaging element, a photoelectric conversion film...
2017/0148839 SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further...
2017/0148838 SOLID-STATE IMAGE CAPTURING ELEMENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
The present disclosure relates to a solid-state image capturing element capable of suppressing a dark current, a manufacturing method thereof, and an...
2017/0148837 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT
A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of...
2017/0148836 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND CAMERA WITH ARRANGED PIXEL COMBINATIONS ALTERNATIVELY
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the...
2017/0148835 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND CAMERA WITH ARRANGED PIXEL COMBINATIONS ALTERNATIVELY
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the...
2017/0148834 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
The present invention has an object of improving the operation stability of a semiconductor device that detects radiations without decreasing the yield...
2017/0148833 SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE
A solid-state imaging device includes: a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face...
2017/0148832 SOLID-STATE IMAGE PICKUP DEVICE AND METHOD OF DRIVING THE SAME
Imaging sensors, imaging apparatuses, and methods of driving an image sensor are provided. An image sensor can include a semiconductor substrate with a...
2017/0148831 IMAGE SENSOR INCLUDING HYBRID PIXEL STRUCTURE
Provided is an image sensor having a hybrid pixel structure in which pixels that sense visible light and pixels that sense ultraviolet light or infrared light...
2017/0148830 CMOS THREE-DIMENSIONAL IMAGE SENSOR DETECTORS HAVING REDUCED INTER-GATE CAPACITANCE, AND ENHANCED MODULATION...
A CMOS detector with pairs of interdigitated elongated finger-like collection gates includes p+ implanted regions that create charge barrier regions that can...
2017/0148829 SOLID-STATE IMAGING APPARATUS, SOLID-STATE IMAGING APPARATUS MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
There is provided a solid-state imaging apparatus including a plurality of photoelectric conversion regions which photoelectrically convert light incident from...
2017/0148828 SOLID-STATE IMAGE PICKUP APPARATUS AND ELECTRONIC APPARATUS
Provided is a solid-state image pickup apparatus including a crosstalk suppression mechanism included in each pixel arranged in a pixel array, the crosstalk...
2017/0148827 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
It is an object of the present invention to provide a method for preventing a breaking and poor contact, without increasing the number of steps, thereby...
2017/0148826 FLEXIBLE DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
The present disclosure provides, for realization of a flexible display apparatus capable of implementing a slim bezel and a method of manufacturing the same, a...
2017/0148825 METHOD FOR MANUFACTURING ARRAY SUBSTRATE, AND ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
A method for manufacturing an array substrate, and an array substrate, a display panel and a display device are provided. The method may include: forming, on...
2017/0148824 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
It is an object to manufacture and provide a highly reliable display device including a thin film transistor with a high aperture ratio which has stable...
2017/0148823 WIRE GRID POLARIZER AND DISPLAY DEVICE INCLUDING THE SAME
A wire grid polarizer includes a substrate, and a plurality of wire grid patterns arranged on the substrate at regular intervals, each of the wire grid...
2017/0148822 THIN-FILM-TRANSISTOR (TFT) ARRAY PANEL AND METHOD OF MANUFACTURING THE SAME
The present invention provides a thin-film-transistor (TFT) array panel and manufacturing method of the same. The TFT array panel comprises a flexible...
2017/0148821 THIN-FILM-TRANSISTOR, THIN-FILM-TRANSISTOR ARRAY SUBSTRATE, FABRICATING METHODS THEREOF, AND DISPLAY PANEL
In accordance with some embodiments of the disclosed subject matter, a TFT, a related TFT array substrate, fabricating methods thereof, a display panel and a...
2017/0148820 Array Substrate And Method of Manufacturing the Same, And Display Apparatus
The present disclosure provides an array substrate and a method of manufacturing the same and a display apparatus in which the array substrate is applied. In...
2017/0148819 PREPARATION METHOD OF CONDUCTIVE VIA HOLE STRUCTURE, ARRAY SUBSTRATE AND DISPLAY DEVICE
A preparation method of a conductive via hole structure, a preparation method of an array substrate and a preparation method of a display device, the...
2017/0148818 PIXEL STRUCTURE, DISPLAY PANEL AND MANUFACTURING METHOD OF PIXEL STRUCTURE
A pixel structure, a display panel and a manufacturing method of the pixel structure are disclosed. The pixel structure includes: gate lines extending in...
2017/0148817 METHOD FOR MANUFACTURING TFT SUBSTRATE AND STRUCTURE THEREOF
The present invention provides a method for manufacturing a TFT substrate and a structure thereof. The method for manufacturing the TFT substrate arranges a...
2017/0148816 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
According to one embodiment, the stacked body includes a plurality of stacked units and a first intermediate layer. Each of the stacked units includes a...
2017/0148815 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of insulating films alternately stacked with a plurality...
2017/0148814 U-SHAPED COMMON-BODY TYPE CELL STRING
A flash device comprising a well and a U-shaped flash cell string, the U-shaped flash cell string built directly on a substrate adjacent the well. The U-shaped...
2017/0148813 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device according to an embodiment of the invention includes a pipe channel layer including a first portion and a second portion protruding from...
2017/0148812 METHODS AND APPARATUS FOR A 3D ARRAY INSIDE A SUBSTRATE TRENCH
A 3D array inside a substrate trench. In one aspect, an apparatus includes a substrate, a trench region in the substrate that is defined by a trench wall, and...
2017/0148811 THREE-DIMENSIONAL NAND DEVICE CONTAINING SUPPORT PEDESTAL STRUCTURES FOR A BURIED SOURCE LINE AND METHOD OF...
A three-dimensional memory device includes an alternating stack of electrically conductive layers and insulating layers located over a substrate, an array of...
2017/0148810 THREE-DIMENSIONAL NAND DEVICE CONTAINING SUPPORT PEDESTAL STRUCTURES FOR A BURIED SOURCE LINE AND METHOD OF...
A three-dimensional memory device includes an alternating stack of electrically conductive layers and insulating layers located over a substrate, an array of...
2017/0148809 SPLIT MEMORY CELLS WITH UNSPLIT SELECT GATES IN A THREE-DIMENSIONAL MEMORY DEVICE
Split memory cells can be provided within an alternating stack of insulating layers and word lines. At least one lower-select-gate-level electrically...
2017/0148808 WITHIN ARRAY REPLACEMENT OPENINGS FOR A THREE-DIMENSIONAL MEMORY DEVICE
An alternating stack of sacrificial material layers and insulating layers is formed over a substrate. Replacement of sacrificial material layers with...
2017/0148807 SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a substrate; a stacked body; a columnar portion; a plate portion; and a sidewall insulating film....
2017/0148806 SEMICONDUCTOR MEMORY DEVICE
According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, and a columnar part. The stacked body is provided on the...
2017/0148805 3D SEMICIRCULAR VERTICAL NAND STRING WITH RECESSED INACTIVE SEMICONDUCTOR CHANNEL SECTIONS
A vertical memory device including dual memory cells per level in each memory opening can have dielectric separator dielectric structures that protrude into a...
2017/0148804 Three-Dimensionally Integrated Circuit Devices Including Oxidation Suppression Layers
A vertically integrated circuit device can include a substrate having a first region reserved for first functional circuits of the vertically integrated...
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