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Patent # Description
2017/0186840 NANOCRYSTALS WITH HIGH EXTINCTION COEFFICIENTS AND METHODS OF MAKING AND USING SUCH NANOCRYSTALS
A population of bright and stable nanocrystals is provided. The nanocrystals include a semiconductor core and a thick semiconductor shell and can exhibit high...
2017/0186839 OFF-STATE LEAKAGE CURRENT SUPPRESSION
A transistor device includes a channel, a first source/drain region positioned on a first side of the channel, a second source/drain region positioned on a...
2017/0186838 METHOD OF FORMING A SEMICONDUCTOR DEVICE
A method of forming a semiconductor device is provided such that a trench is formed in a semiconductor body at a first surface of the semiconductor body....
2017/0186837 DEEP TRENCH CAPACITOR WITH SCALLOP PROFILE
The present disclosure relates to an integrated chip having a deep trench capacitor with serrated sidewalls defining curved depressions, and a method of...
2017/0186836 DISPLAY DEVICE WITH DURABLE WIRING
Provided is a display device which has a rectangular display region with four sides. The display region includes a gate line, a signal line, a first sub-pixel...
2017/0186835 ORGANIC LIGHT-EMITTING DIODE DISPLAY
An organic light-emitting diode (OLED) display is disclosed. In one aspect, the display includes a substrate and an active pattern formed over the substrate...
2017/0186834 DISPLAY DEVICE
In view of the problem that a reduced thickness of an EL film causes a short circuit between an anode and a cathode and malfunction of a transistor, the...
2017/0186833 ORGANIC ELECTROLUMINESCENT DEVICE AND ELECTRONIC APPARATUS
An organic electroluminescent device includes a first transistor, a power supply line layer connected to one current terminal of the first transistor, a...
2017/0186832 DISPLAY APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS
A display apparatus includes: a light emitting device in which a first electrode, a light emitting layer, and a second electrode are laminated; a pixel...
2017/0186831 ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
An organic light-emitting display device and a method of fabricating the same are provided. The organic light-emitting display device includes a substrate...
2017/0186830 DISPLAY DEVICE
A display device includes a circuit substrate that is formed of a plurality of layers stacked on each other and including a self-luminous element layer that...
2017/0186829 FLEXIBLE DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHODS THEREOF
A flexible device is manufactured at low temperatures. A second substrate is bonded to a first substrate by a first adhesive layer. A first insulating layer, a...
2017/0186827 ORGANIC LIGHT EMITTING DISPLAY DEVICE
A display device may include a substrate, a first light emitting structure, a second light emitting structure, and a support structure. The first light...
2017/0186826 ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
Disclosed are an organic light emitting display device improving opening ratio and a method of fabricating the same. The organic light emitting display device...
2017/0186825 DISPLAY DEVICE AND METHOD OF MANUFACTURING A DISPLAY DEVICE
A display device, which includes a plurality of unit pixels, includes a plurality of first electrodes respectively corresponding to the plurality of unit...
2017/0186824 DISPLAY PANEL AND DISPLAY DEVICE COMPRISING THE SAME
Disclosed herein are a display panel capable of reducing the amount of reflected light in a non-display area where an alignment key is disposed, and a display...
2017/0186823 ORGANIC LIGHT EMITTING DISPLAY PANEL AND ORGANIC LIGHT EMITTING DISPLAY DEVICE COMPRISING THE SAME
An organic light-emitting display panel can improve the color purity and color gamut by reducing optical interference between adjacent pixel areas. A black...
2017/0186822 LIGHT EMITTING DIODE, DISPLAY SUBSTRATE AND DISPLAY APPARATUS HAVING THE SAME, AND FABRICATING METHOD THEREOF
The present application discloses a light emitting diode, comprising a pixel unit comprising at least a first sub-pixel in a first region, a second sub-pixel...
2017/0186821 ORGANIC LIGHT EMITTING DISPLAY DEVICE AND ORGANIC LIGHT EMITTING STACKED STRUCTURE
Disclosed is an organic light emitting display device. The organic light emitting display device includes an emission part which is disposed between an anode...
2017/0186820 ORGANIC LIGHT-EMITTING DIODES TOUCH DISPLAY PANEL AND ELECTRONIC DEVICE USING SAME
An OLED touch display panel capable of detecting and reacting to touches on the display includes a signal sending element emitting ultrasonic signals, a...
2017/0186819 ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
An organic light-emitting display apparatus includes a substrate; a pixel electrode over the substrate; a pixel-defining layer including an opening that...
2017/0186818 IMAGE SENSOR
An image sensor is provided. The image sensor includes a pixel sensing circuit corresponding to at least a first pixel region and a second pixel region...
2017/0186817 Manufacturing Methods of JFET-Type Compact Three-Dimensional Memory
Manufacturing methods of JFET-type compact three-dimensional memory (3D-M.sub.C) are disclosed. In a memory level stacked above the substrate, an x-line...
2017/0186816 CROSS-POINT MEMORY AND METHODS FOR FABRICATION OF SAME
The disclosed technology relates generally to integrated circuit devices, and in particular to cross-point memory arrays and methods for fabricating the same....
2017/0186814 MEMORY DEVICES
Memory devices are provided. The memory device includes a substrate. A dielectric layer is disposed on the substrate and a plurality of resistive memory cells...
2017/0186813 THRESHOLD SWITCHING DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
A threshold switching device may include: a first electrode layer; a second electrode layer; an insulating layer interposed between the first and second...
2017/0186812 THRESHOLD SWITCHING DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME
A threshold switching device may include: a first electrode layer; a second electrode layer; a first insulating layer interposed between the first and second...
2017/0186811 Compact Three-Dimensional Mask-Programmed Read-Only Memory
A compact three-dimensional mask-programmed read-only memory (3D-MPROM.sub.c) is disclosed. Its memory array and a decoding stage thereof are formed on a same...
2017/0186810 LIGHT EMITTING DEVICE
A light emitting device includes a substrate and a plurality of light emitting cells disposed on the substrate. Each light emitting cell includes a first...
2017/0186809 TFT AND MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, X-RAY DETECTOR AND...
A TFT and manufacturing method thereof, an array substrate and manufacturing method thereof, an X-ray detector and a display device are disclosed. The...
2017/0186808 METHOD OF USING A SURFACTANT-CONTAINING SHRINKAGE MATERIAL TO PREVENT PHOTORESIST PATTERN COLLAPSE CAUSED BY...
A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second...
2017/0186807 MODULAR IMAGING DETECTOR ASIC
An imaging system detector array (112) includes a detector tile (116). The detector tile includes a photosensor array (202), including a plurality of...
2017/0186806 HIGH-DYNAMIC-RANGE PIXEL
A pixel including a photodiode having a first pole coupled through a transfer MOS transistor to a node for sensing charges of a first type stored in the...
2017/0186805 Image Sensors Including Non-Aligned Grid Patterns
An image sensor includes a substrate including a first surface and a second surface, a first device isolation layer disposed in the substrate and defining a...
2017/0186804 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An improvement is achieved in the performance of a semiconductor device. A semiconductor device includes an n.sup.--type semiconductor region formed in a...
2017/0186803 SOLID-STATE IMAGE PICKUP DEVICE
A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device...
2017/0186802 VIA SUPPORT STRUCTURE UNDER PAD AREAS FOR BSI BONDABILITY IMPROVEMENT
Some embodiments of the present disclosure relate to an integrated chip having a via support structure underlying a bond pad. The integrated chip has an image...
2017/0186801 MICROELECTRONIC PACKAGE WITH HORIZONTAL AND VERTICAL INTERCONNECTIONS
In a microelectronic package, a first wire bond wire is coupled to an upper surface of a substrate. A first bond mass is coupled to another end of the first...
2017/0186800 IMAGING DEVICE AND ELECTRONIC DEVICE
An imaging device having a three-dimensional integration structure is provided. A first structure including a transistor including silicon in an active layer...
2017/0186798 STACKED SPAD IMAGE SENSOR
The present disclosure relates to a stacked SPAD image sensor with a CMOS Chip and an imaging chip bonded together, to improve the fill factor of the SPAD...
2017/0186797 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
A chip package includes a chip, an insulating layer and a conductive layer. The chip includes a substrate, an epitaxy layer, a device region and a conductive...
2017/0186796 FRONTSIDE ILLUMINATED (FSI) IMAGE SENSOR WITH A REFLECTOR
A frontside illuminated (FSI) image sensor with a reflector is provided. A photodetector is buried in a sensor substrate. A support substrate is arranged under...
2017/0186795 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
An image sensor is provided in the present invention. The image sensor includes a continuous microlens including a plurality of top sub lenses connected with...
2017/0186794 DIELECTRIC MIRROR BASED MULTISPECTRAL FILTER ARRAY
An optical sensor device may include a set of optical sensors. The optical sensor device may include a substrate. The optical sensor device may include a...
2017/0186793 METAL MIRROR BASED MULTISPECTRAL FILTER ARRAY
A device may include a multispectral filter array disposed on the substrate. The multi spectral filter array may include a first metal mirror disposed on the...
2017/0186792 METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES
A method of forming image sensor packages may include performing a molding process. Mold material may be formed either on a transparent substrate in between...
2017/0186791 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield...
2017/0186790 SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING SOLID-STATE IMAGE SENSOR
A method of manufacturing a solid-state image sensor, including a first transistor for transferring charges from a charge accumulation region to a first charge...
2017/0186789 BACK-SIDE ILLUMINATED PIXEL
A back-side illuminated pixel including a semiconductor substrate of a first conductivity type coated, on the front side of the pixel, with a three-layer...
2017/0186788 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
An image sensor and a manufacturing method thereof are provided. The image sensor includes a pixel sensing circuit, a pixel electrode, and an opto-electrical...
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