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Patent # Description
2017/0207409 SCREEN-PRINTING MASK, RELATED PACKAGING METHOD, DISPLAY PANEL, DISPLAY APPARATUS, AND METHOD FOR FABRICATING...
The present disclosure provides a screen-printing mask for packaging organic light-emitting diode (OLED) products. The screen-printing mask includes a screen...
2017/0207396 ORGANIC ELECTROLUMINESCENT DEVICE
The present invention relates to an organic electroluminescent device. The organic electroluminescent device of the present invention shows high luminous...
2017/0207386 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device according to an embodiment comprises a memory cell array configured from a plurality of row lines and column lines that intersect...
2017/0207376 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND OPTICAL-SEMICONDUCTOR-MOUNTING SUBSTRATE
A semiconductor light-emitting device including at least a substrate, a reflector having a concave cavity, and an optical semiconductor element, wherein the...
2017/0207366 ULTRATHIN SOLID STATE DIES AND METHODS OF MANUFACTURING THE SAME
Various embodiments of SST dies and solid state lighting ("SSL") devices with SST dies, assemblies, and methods of manufacturing are described herein. In one...
2017/0207364 PRINTABLE INORGANIC SEMICONDUCTOR STRUCTURES
The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be...
2017/0207355 High-performance image sensors including those providing global electronic shutter
In various embodiments, an electronic device comprises, for example, at least one photosensitive layer and at least one carrier selective layer. Under one...
2017/0207353 SOLAR CELL MODULE
A solar cell module includes: solar cells each having a first main surface and a second main surface; a front-side transparent protective member disposed on a...
2017/0207349 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
An object is to improve field effect mobility of a thin film transistor using an oxide semiconductor. Another object is to suppress increase in off current...
2017/0207344 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of a semiconductor device comprises the steps of: providing a transparent substrate; forming a gate electrode on the transparent...
2017/0207333 GATE-ALL-AROUND FIN DEVICE
A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a...
2017/0207329 EPITAXIAL WAFER FOR HETEROJUNCTION BIPOLAR TRANSISTOR AND HETEROJUNCTION BIPOLAR TRANSISTOR
An epitaxial wafer for a heterojunction bipolar transistor and a heterojunction bipolar transistor that is capable of reducing a base resistance and a turn-on...
2017/0207328 FIN TUNNEL FIELD EFFECT TRANSISTOR (FET)
A fin tunnel field effect transistor includes a seed region and a first type region disposed above the seed region. The first type region includes a first...
2017/0207318 SCHOTTKY BARRIER STRUCTURE FOR SILICON CARBIDE (SiC) POWER DEVICES
A method for fabricating a silicon carbide power device may include steps of: forming a first n-type silicon carbide layer on top of a second n-type silicon...
2017/0207304 SUPERLATTICE MATERIALS AND APPLICATIONS
A superlattice cell that includes Group IV elements is repeated multiple times so as to form the superlattice. Each superlattice cell has multiple ordered...
2017/0207302 SEMICONDUCTOR DEVICE
A semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type provided...
2017/0207295 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
A method includes determining an active region pattern density of a first region of an integrated circuit layout based on a total area of each active region in...
2017/0207287 DISPLAY DEVICE
A display device in an embodiment according to the present invention includes a conductive layer over an interlayer insulating layer, a pixel electrode over...
2017/0207266 SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film...
2017/0207259 CMOS IMAGE SENSORS
Disclosed is a complementary metal oxide semiconductor (CMOS) image sensor. The image sensor comprises a first separation zone in a substrate, the first...
2017/0207257 PIXEL CIRCUIT, SEMICONDUCTOR PHOTODETECTION DEVICE, AND RADIATION COUNTING DEVICE
In a photoelectric changing unit, a photoelectric conversion unit converts light into electric charge, and an electric charge accumulation unit accumulates the...
2017/0207256 SOLID-STATE LIGHT-RECEIVING DEVICE FOR ULTRAVIOLET LIGHT
To provide a solid-state light-receiving device for ultraviolet light which can measure the amount of irradiation with ultraviolet light harmful to the human...
2017/0207253 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
The present invention provides an array substrate and a manufacturing method thereof. Etching stop patterns or auxiliary conductive patterns of a patterned...
2017/0207248 THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY PANEL
The application provides a thin film transistor, a method for manufacturing the thin film transistor, and a display panel, the thin film transistor includes a...
2017/0207234 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A {111} plane of a substrate having a silicon crystal structure meets a top surface of the substrate to form an interconnection line on the top surface. A...
2017/0207232 MEMORY DEVICE
A memory device including a substrate, a plurality of channel columns, a gate stack, an interlayer insulating layer, a plurality of first trenches, and at...
2017/0207226 SEMICONDUCTOR DEVICE
A semiconductor device may include a source layer, a stack structure, a channel layer, a slit, and a source pick-up line. The source layer may include at least...
2017/0207223 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor device, includes: forming an insulating film on a first surface of a semiconductor substrate; and forming a hydrogen...
2017/0207218 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes an n-channel, a p-channel, a first gate dielectric layer, a second gate dielectric layer, a first metal gate electrode and a...
2017/0207205 SEMICONDUCTOR PACKAGES
A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the...
2017/0207203 LIGHT EMITTING DEVICE
A light emitting device including a supporting body; first wirings formed on a surface of the supporting body; second wirings formed on the surface of the...
2017/0207200 THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
A thermally enhanced semiconductor assembly with three dimensional integration includes a stacked semiconductor sub-assembly electrically coupled to a wiring...
2017/0207199 LAMINATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF LAMINATED SEMICONDUCTOR DEVICE
A laminated semiconductor device includes: three or more semiconductor chips that are laminated; resins that are disposed among the semiconductor chips, the...
2017/0207193 APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a...
2017/0207192 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the...
2017/0207186 ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
An electronic device includes an electrode including Cu, a solder including Sn and provided above the electrode, and a joining layer including In and Ag and...
2017/0207182 CHIP PACKAGE AND METHOD FOR FORMING THE SAME
A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. The substrate includes a sensing or...
2017/0207181 WAFER PROCESSING METHOD
Disclosed herein is a wafer processing method including a first modified layer forming step of applying a laser beam having a transmission wavelength to a...
2017/0207179 SEMICONDUCTOR DEVICE
An object of the present invention is to obtain a semiconductor device having highly reliable bonding portions. The semiconductor device according to the...
2017/0207171 FLEXIBLE SUBSTRATE HAVING A VIA-HOLE WITH A CONDUCTIVE MATERIAL AND A METHOD FOR MANUFACTURING THE SAME
In a flexible substrate and a method for manufacturing the flexible substrate, the flexible substrate includes a polymer substrate, a through conductive...
2017/0207165 METHOD, APPARATUS, AND SYSTEM FOR OFFSET METAL POWER RAIL FOR CELL DESIGN
At least one method, apparatus and system disclosed involves circuit layout for an integrated circuit device comprising an asymmetrically placed metal...
2017/0207164 METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING A HIGH RESISTIVTY LAYER, AND RELATED SEMICONDUCTOR...
Methods of forming a semiconductor structure include forming a device layer on an initial substrate, attaching a first surface of the device layer to a...
2017/0207163 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Disclosed herein is a semiconductor device including: a substrate having a first conductive layer and a second conductive layer arranged deeper than the first...
2017/0207162 METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME
Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the...
2017/0207159 POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES
Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing...
2017/0207150 CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD FOR MANUFACTURING THE PACKAGE
A clip-bonded semiconductor chip package comprises a lead frame having a pad and a lead; a semiconductor chip bonded onto the pad of the lead frame; a bonding...
2017/0207148 LEAD FRAME AND SEMICONDUCTOR DEVICE
A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first...
2017/0207145 SEMICONDUCTOR MODULE
To bond a layered substrate and a cooling chamber having different linear expansion coefficients while preventing cracking and breaking, provided is a...
2017/0207137 TEST STRUCTURE AND METHOD OF MANUFACTURING STRUCTURE INCLUDING THE SAME
A test structure for manufacturing a semiconductor device includes a test element, a first pad connected to the test element, and a second pad connected to the...
2017/0207133 MULTIPLE PATTERNING TECHNIQUES FOR METAL GATE
The present disclosure relates to an integrated circuit with a work function metal layer disposed directly on a high-k dielectric layer, and an associated...
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