Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2017/0263592 PC-LED MODULE WITH ENHANCED WHITE RENDERING AND CONVERSION EFFICIENCY
The invention provides a lighting device (100) comprising: a first solid state light source (10), configured to provide UV radiation (11) having a wavelength...
2017/0263591 LIGHT-EMITTING APPARATUS AND ILLUMINATION APPARATUS
A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing...
2017/0263590 SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARRIER DIODE
A semiconductor device includes a MOSFET including a PN junction diode. A unipolar device is connected in parallel to the MOSFET and has two terminals. A first...
2017/0263589 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package...
2017/0263588 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
A semiconductor device is disclosed. The semiconductor device includes: a first die including a signal pad region and a power pad region; a redistribution...
2017/0263587 SEMICONDUCTOR DEVICE
Reduction in reliability of a semiconductor device is suppressed. A semiconductor device includes a plurality of metal patterns formed on a ceramic substrate,...
2017/0263586 METHODS AND APPARATUSES FOR HIGH TEMPERATURE BONDING AND BONDED SUBSTRATES HAVING VARIABLE POROSITY...
Methods and systems of bonding substrates include disposing a low melting point material and one or more high melting point materials having a higher melting...
2017/0263585 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING APPARATUS OF ELECTRONIC COMPONENT
A method for manufacturing an electronic component includes positioning a first surface of a first component facing a second surface of a second component in a...
2017/0263584 COLLET
A collet for attachment to distal portion (16) of a die-transporting shank (17), which comprises: a body (13) having a through hole (2) in its centre; said...
2017/0263583 SEMICONDUCTOR DEVICE HAVING CONDUCTIVE BUMPS OF VARYING HEIGHTS
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate including a plurality of conductive...
2017/0263582 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin...
2017/0263581 ELECTRONIC DEVICE, PART MOUNTING BOARD, AND ELECTRONIC APPARATUS
[Object] To provide an electronic device, a part mounting board, and an electronic apparatus that are capable of preventing warpage of a board from occurring....
2017/0263580 HIGH VOLTAGE TOLERANT BONDING PAD STRUCTURE FOR TRENCH-BASED SEMICONDUCTOR DEVICES
Apparatus and associated methods relate to a bonding pad structure for a trench-based semiconductor device. The bonding pad structure reduces a peak magnitude...
2017/0263579 PACKAGE SUBSTRATE WITH DOUBLE SIDED FINE LINE RDL
A package substrate has a sandwiched redistribution layers is disclosed. A middle redistribution layer functions as a core redistribution layer sandwiched by a...
2017/0263578 ELECTRONIC DEVICE AND ELECTRONIC EQUIPMENT
An electronic device includes a first electronic component including a first signal line and a first ground conductor surface, a second electronic component...
2017/0263577 SEMICONDUCTOR DEVICE
A semiconductor device is provided with: a semiconductor integrated circuit having a bump mounting surface; and a thin-film capacitor portion connected to the...
2017/0263576 SIGNAL ISOLATION STRUCTURES FOR EM COMMUNICATION
Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a...
2017/0263575 FDSOI WITH ON-CHIP PHYSICALLY UNCLONABLE FUNCTION
An integrated circuit includes an array of devices including a physically unclonable function (PUF) for chip authentication. A logic pattern is stored in the...
2017/0263574 SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION
A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the...
2017/0263573 FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
A fan-out semiconductor package includes a redistribution layer, an interconnection member, a semiconductor chip, and a protective layer. The interconnection...
2017/0263572 EMI/RFI SHIELDING FOR SEMICONDUCTOR DEVICE PACKAGES
An encapsulated semiconductor device package with an overlying conductive EMI or RFI shield in contact with an end of a grounded conductive component at a...
2017/0263571 ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
An electronic component built-in substrate includes an insulating substrate having a through hole and an inner wall surrounding the through hole, an electronic...
2017/0263570 SEMICONDUCTOR PACKAGE ASSEMBLY
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate having a first pad and a second pad thereon. A...
2017/0263569 System-in-Package Devices With Magnetic Shielding
Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical...
2017/0263568 SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHMENT ANGLE AND METHOD
A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the...
2017/0263567 SUBSTRATE HAVING POWER DELIVERY NETWORK FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND DEVICES INCLUDING THE...
A semiconductor package includes an integrated circuit mounted on a substrate, a first power line disposed on or above the substrate and configured to transmit...
2017/0263566 METHOD FOR MAKING A SHIELDED INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTRICALLY CONDUCTIVE POLYMER LAYER
A method for making shielded integrated circuit (IC) packages includes providing spaced apart IC dies carried by a substrate and covered by a common...
2017/0263565 INTEGRATED CIRCUIT (IC) PACKAGE WITH A GROUNDED ELECTRICALLY CONDUCTIVE SHIELD LAYER AND ASSOCIATED METHODS
An integrated circuit (IC) package includes a substrate and an IC die carried by the substrate. An encapsulated body is over the IC die. At least one grounding...
2017/0263564 DISPLAY DEVICE HAVING AN ALIGNMENT MARK
A display device according to an exemplary embodiment includes a substrate including a display area and a non-display area. An alignment mark is positioned in...
2017/0263563 Semiconductor Constructions
Some embodiments include a construction having conductive structures spaced from one another by intervening regions. Insulative structures are within the...
2017/0263562 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a semiconductor device is disclosed. The device includes a substrate, and a first interconnect on the substrate. The first...
2017/0263561 TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION
A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the...
2017/0263559 POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVED IR DROP AND CHIP PERFORMANCE
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of first...
2017/0263558 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
According to the embodiment, the semiconductor device includes: a substrate; a stacked body; and a plurality of columnar portions. The stacked body is provided...
2017/0263557 CONTACTS HAVING A GEOMETRY TO REDUCE RESISTANCE
A method of increasing the surface area of a contact to an electrical device that in one embodiment includes forming a contact stud extending through an...
2017/0263556 CONDUCTIVE STRUCTURES, SYSTEMS AND DEVICES INCLUDING CONDUCTIVE STRUCTURES AND RELATED METHODS
Conductive structures include stair step structures positioned along a length of the conductive structure and at least one landing comprising at least one via...
2017/0263555 Semiconductor Device and Method
A structure and method for the formation and use of fuses within a semiconductor device is provided. The fuses may be formed within the third metal layer and...
2017/0263554 FUSE FORMED FROM III-V ASPECT RATIO STRUCTURE
A fuse structure is provided above a first portion of a semiconductor material. The fuse structure includes a first end region containing a first portion of a...
2017/0263553 STRUCTURE AND METHOD TO SELF ALIGN VIA TO TOP AND BOTTOM OF TIGHT PITCH METAL INTERCONNECT LAYERS
Embodiments of the invention include interconnect structures with overhead vias and through vias that are self-aligned with interconnect lines and methods of...
2017/0263552 SEMICONDUCTOR DEVICE STRUCTURES
A method of forming a semiconductor structure comprises forming pools of acidic or basic material in a substrate structure. A resist is formed over the pools...
2017/0263551 NOVEL METHOD FOR CREATING ALTERNATE HARDMASK CAP INTERCONNECT STRUCTURE WITH INCREASED OVERLAY MARGIN
Embodiments of the invention include an interconnect structure and methods of forming such structures. In an embodiment, the interconnect structure may include...
2017/0263550 SEMICONDUCTOR DEVICE AND DESIGNING METHOD THEREOF
A metal wiring layer includes a plurality of hierarchical blocks each divided by a side that serves as a boundary. One of the hierarchical blocks is placed to...
2017/0263549 STRUCTURE AND FORMATION METHOD OF INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a...
2017/0263548 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE
Structures and formation methods of a semiconductor device structure are provided. The method includes forming a dielectric layer over a semiconductor...
2017/0263547 METALLIC BLOCKING LAYER FOR RELIABLE INTERCONNECTS AND CONTACTS
A semiconductor structure is provided that includes a first interconnect dielectric layer containing a first interconnect metal structure embedded therein. A...
2017/0263546 WIRING BOARD WITH ELECTRICAL ISOLATOR AND BASE BOARD INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY AND...
A wiring board includes an electrical isolator laterally surrounded by a base board and a molding compound. The electrical isolator is inserted into a through...
2017/0263545 WIRING BOARD AND SEMICONDUCTOR DEVICE
A wiring board includes: a first insulating layer; a first wiring layer formed on a lower surface of the first insulating layer; a first through hole which...
2017/0263544 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the...
2017/0263543 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this...
2017/0263542 PREFORMED LEAD FRAME DEVICE AND LEAD FRAME PACKAGE INCLUDING THE SAME
A preformed lead frame device includes a molding layer and a plurality of spaced-apart lead frame units. The molding layer is made of a polymer material, and...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.