Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2017/0263491 SUBSTRATE PROCESSING APPARATUS
A transfer path is provided which is extended so as to be passed on a lateral side of a processing portion that processes a substrate. The substrate...
2017/0263490 METHOD FOR PROVIDING A PLANARIZABLE WORKPIECE SUPPORT, A WORKPIECE PLANARIZATION ARRANGEMENT, AND A CHUCK
According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more...
2017/0263489 Fan-Out Interconnect Structure and Methods Forming the Same
A method includes forming an adhesive layer over a carrier, forming a sacrificial layer over the adhesive layer, forming through-vias over the sacrificial...
2017/0263488 METHOD OF MANUFACTURING FLEXIBLE DISPLAY DEVICE
Methods for manufacturing a flexible display device are provided. A flexible substrate is provided and a first bonding pattern, which encloses a display area,...
2017/0263486 Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C. The top surface may be sapphire. The...
2017/0263485 SYSTEM AND METHOD FOR MULTI-LOCATION ZAPPING
A system for zapping a wafer, the system may include a pulse generation unit that is configured to generate (a) first zapping pulses for causing a breakdown in...
2017/0263484 MULTI-ZONE PEDESTAL FOR PLASMA PROCESSING
A method and apparatus for a heated pedestal is provided. In one embodiment, the heated pedestal includes a body comprising a ceramic material, a plurality of...
2017/0263483 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
During a position deviation detection operation, a hand of a transport mechanism is moved to a true target position in a substrate supporter. A substrate...
2017/0263482 WAFER CARRIER
A wafer carrier for processing a plurality of wafers includes a carrier body which rotatable about a central axis, and a plurality of pockets formed in the...
2017/0263481 Adapter Tool Configured to be Attached to a Loadport of a Wafer Handling System and Wafer Handling System with...
An adapter tool configured to be attached to a loadport of a wafer handling system includes a support member and first and second guiding elements attached to...
2017/0263480 ARRANGEMENT HAVING A PLURALITY OF CHIPS AND A CHIP CARRIER, AND A PROCESSING ARRANGEMENT
In various embodiments, an arrangement is provided. The arrangement may include a plurality of chips; a chip carrier carrying the plurality of chips, the chip...
2017/0263479 SUBSTRATE CONTAINER, LOAD PORT APPARATUS, AND SUBSTRATE TREATING APPARATUS
A substrate container including a casing, a rack, a casing holder, a casing lifting mechanism, a lid, and a lid holder. When holding of substrates with the...
2017/0263478 Detection System for Tunable/Replaceable Edge Coupling Ring
A substrate processing system includes a processing chamber. A pedestal is arranged in the processing chamber. An edge coupling ring is arranged adjacent to...
2017/0263477 SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD OF SUBSTRATE PROCESSING APPARATUS
According to one embodiment, there is provided a substrate processing apparatus including a processing unit and a manipulator. The processing unit processes a...
2017/0263476 MOLD DEVICE
According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first...
2017/0263475 Hot Jet Assisted Systems and Methods
A heating device for heating the surface of a substrate. The heating device comprises a gas source comprising an inert material supply inert under the...
2017/0263474 SEMICONDUCTOR MANUFACTURING APPARATUS
A semiconductor manufacturing apparatus according to the present embodiment includes a first cooler, a second cooler, and a temperature controller. The first...
2017/0263473 LASER PROCESSING APPARATUS
A controller of a laser processing apparatus includes: a storage section that stores processing conditions for forming modified layers along division lines of...
2017/0263472 MULTIPLE WAFER ROTARY PROCESSING
A wafer processor has a rotor holding wafers within a process tank. The rotor rotates sequentially moving the wafers through a process liquid held in the...
2017/0263471 SUBSTRATE CLEANING APPARATUS
A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes...
2017/0263470 Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
A semiconductor device has a first conductive layer and a semiconductor die disposed adjacent to the first conductive layer. An encapsulant is deposited over...
2017/0263469 SEMICONDUCTOR PACKAGE WITH SIDEWALL-PROTECTED RDL INTERPOSER
A semiconductor package includes a redistribution layer (RDL) interposer having a first side, a second side opposite to the first side, and a vertical sidewall...
2017/0263468 MANUFACTURING METHOD FOR REDUCING THE SURFACE ROUGHNESS OF A LOW TEMPERATUREPOLY-SILICON AND A LOW...
The present invention discloses a manufacturing method to reduce the surface roughness of the low temperature poly-silicon, including: a surface pretreatment...
2017/0263467 METHODS OF FORMING A PORTION OF A MEMORY ARRAY HAVING A CONDUCTOR HAVING A VARIABLE CONCENTRATION OF GERMANIUM
An embodiment of a method of forming a portion of a memory array includes forming a conductor with a concentration of germanium that decreases with an...
2017/0263466 BOTTOM PROCESSING
Embodiments disclosed herein generally relate to methods and apparatus for processing of the bottom surface of a substrate to counteract thermal stresses...
2017/0263465 VERTICAL NANOWIRES FORMED ON UPPER FIN SURFACE
One illustrative device includes, among other things, at least one fin defined in a semiconductor substrate and a substantially vertical nanowire having an...
2017/0263464 METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
A method for forming a semiconductor device structure is provided. The method includes performing a first plasma etching process on a substrate to form a first...
2017/0263463 METHOD FOR ETCHING SILICON SUBSTRATE USING PLASMA GAS
There is provided a method for etching a silicon substrate, the method comprising: forming an etch mask on a silicon substrate; forming a first gas comprising...
2017/0263462 MANUFACTURING METHOD OF ELEMENT CHIP
A manufacturing method of an element chip includes a preparation process of adhering a holding sheet to the first main surface of a substrate so as to prepare...
2017/0263461 PLASMA PROCESSING METHOD
A plasma processing method includes an attaching process of attaching a resin film to a first main surface of a substrate which is provided with the first main...
2017/0263460 TECHNIQUES FOR MANIPULATING PATTERNED FEATURES USING IONS
A method may include providing a surface feature on a substrate, the surface feature comprising a feature shape a feature location, and a dimension along a...
2017/0263459 MULTI-LAYER INTER-GATE DIELECTRIC STRUCTURE AND METHOD OF MANUFACTURING THEREOF
A semiconductor device having a first gate stack on a substrate is disclosed. The first gate stack may include a first gate conductor over a first gate...
2017/0263458 METHOD FOR FABRICATING A METAL HIGH-K GATE STACK FOR A BURIED RECESSED ACCESS DEVICE
A method for fabricated a buried recessed access device comprising etching a plurality of gate trenches in a substrate, implanting and activating a...
2017/0263457 Apparatus and Methods to Remove Unbonded Areas Within Bonded Substrates Using Localized Electromagnetic Wave...
An electromagnetic wave irradiation apparatus and methods to bond unbonded areas in a bonded pair of substrates are disclosed. The unbonded areas between the...
2017/0263456 METHODS OF FORMING NANOSTRUCTURES HAVING LOW DEFECT DENSITY
A method of forming a nanostructure comprises forming self-assembled nucleic acids on at least a portion of a substrate. The method further comprises...
2017/0263455 MASK STRUCTURE FORMING METHOD AND FILM FORMING APPARATUS
There is provided a method of forming an etching-purpose mask structure on an insulating film containing silicon and oxygen, which includes: forming an...
2017/0263454 METHOD FOR FORMING FIN STRUCTURES FOR NON-PLANAR SEMICONDUCTOR DEVICE
A method for forming fin structure includes following steps. A substrate is provided. A first mandrel and a plurality of second mandrels are formed on the...
2017/0263453 SUBSTRATE AND ELECTRONIC DEVICE
A substrate includes: a support substrate having a first main surface and a surface layer region which includes at least the first main surface and is formed...
2017/0263452 METHOD FOR MANUFACTURING TWO-DIMENSIONAL MATERIAL STRUCTURE AND TWO-DIMENSIONAL MATERIAL DEVICE
A method for manufacturing a two-dimensional material structure and a resultant two-dimensional material device. The method comprises steps of: forming a...
2017/0263451 ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
A method for depositing a dielectric layer that includes introducing a substrate into a process chamber of a deposition tool; and heating the substrate to a...
2017/0263450 PLASMA ASSISTED ATOMIC LAYER DEPOSITION METAL OXIDE FOR PATTERNING APPLICATIONS
The embodiments herein relate to methods and apparatus for depositing an encapsulation layer over memory stacks in MRAM and PCRAM applications. The...
2017/0263449 ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
A method for depositing a dielectric layer that includes introducing a substrate into a process chamber of a deposition tool; and heating the substrate to a...
2017/0263448 COMPOUND SEMICONDUCTOR DEVICE STRUCTURES COMPRISING POLYCRYSTALLINE CVD DIAMOND
A semiconductor device structure comprising: a layer of compound semiconductor material; and a layer of polycrystalline CVD diamond material, wherein the...
2017/0263447 Method To Transfer Two Dimensional Film Grown On Metal-Coated Wafer To The Wafer Itself In a Face-To-Face Manner
A method of in-situ transfer during fabrication of a component comprising a 2-dimensional crystalline thin film on a substrate is disclosed. In one embodiment,...
2017/0263446 SAPPHIRE SUBSTRATE RECYCLING METHOD
In order to address the high recycling cost, high complexity and other problems encountered by the prior art, the present invention proposes a method for...
2017/0263445 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND TEMPLATE FOR NANOIMPRINT
According to one embodiment, there is provided a manufacturing method of a semiconductor device. The method includes forming a film to be processed on a...
2017/0263444 REFLECTIVE MASK BLANK, METHOD FOR MANUFACTURING SAME, REFLECTIVE MASK, METHOD FOR MANUFACTURING SAME, AND...
The present invention aims to provide a reflective mask blank and a reflective mask which have a highly smooth multilayer reflective film as well as a low...
2017/0263443 TRENCH AND HOLE PATTERNING WITH EUV RESISTS USING DUAL FREQUENCY CAPACITIVELY COUPLED PLASMA (CCP)
A method for treating a substrate is disclosed. The method includes forming a film stack on the substrate, the film stack comprising an underlying layer, a...
2017/0263442 PLASMA STABILIZATION METHOD AND DEPOSITION METHOD USING THE SAME
A plasma stabilization method and a deposition method using the same are disclosed. The plasma stabilization method includes (a) supplying a source gas and (b)...
2017/0263441 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
There is provided a method of manufacturing a semiconductor device, including forming a seed layer on a substrate by performing a cycle a predetermined number...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.