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Patent # Description
2017/0271602 THIN FILM DEVICE WITH PROTECTIVE LAYER
Embodiments of the invention include a method for fabricating a semiconductor device and the resulting structure. A substrate is provided. A plurality of metal...
2017/0271601 Organic Light-Emitting Diode Materials
Described herein are molecules for use in organic light emitting diodes. Example molecules comprise at least one moiety A and at least one moiety D. Values and...
2017/0271600 Organometallic Complex, Light-Emitting Element, Light-Emitting Device, Electronic Device, and Lighting Device
A novel organometallic complex is provided. An organometallic complex emitting green to blue phosphorescence is provided. An organometallic complex having a...
2017/0271599 ORGANIC ELECTROLUMINESCENT DEVICE
The organic EL device of the invention has, in order, an anode, a hole transport layer, a luminous layer, an electron transport layer and a cathode. The hole...
2017/0271598 ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES
A dual host system for OLEDs that contains hole-transporting indolocarbazole and electron-transporting indolocarbazole exhibiting superior performance in the...
2017/0271597 ORGANIC ELECTROLUMINESCENT ELEMENT, DISPLAY DEVICE, LIGHTING DEVICE, PI-CONJUGATED COMPOUND, AND LIGHT-EMITTING...
An object of the present invention is to provide an organic electroluminescent element containing an organic layer interposed between an anode and a cathode,...
2017/0271596 COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME
A compound is represented by one selected from Formulae 1 and 2: ##STR00001## Wherein the components of Formulae 1 and 2 are each independently defined as set...
2017/0271595 COMPOUND HAVING SUBSTITUTED TRIPHENYLENE RING STRUCTURE, AND ORGANIC ELECTROLUMINESCENT DEVICE
An organic compound having an excellent electron injection and transport performance is provided as a material for a low-power-consumption organic ...
2017/0271594 HYBRID CARBON-METAL INTERCONNECT STRUCTURES
Embodiments of the present disclosure are directed towards techniques and configurations for hybrid carbon-metal interconnect structures in integrated circuit...
2017/0271593 MANUFACTURING METHODS OF ELECTROLUMINESCENT DEVICES
A manufacturing method of electroluminescent devices includes: providing a first electrode; electrically depositing a first carrier injection layer on the...
2017/0271592 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
The semiconductor device includes a plurality of first conductive patterns on a substrate, a first selection pattern on each of the plurality of first...
2017/0271591 MULTILAYERED MEMRISTORS
A multilayered memristor includes a semiconducting n-type layer, a semiconducting p-type layer, and a semiconducting intrinsic layer. The semiconducting n-type...
2017/0271590 Resistance Variable Memory Structure
A semiconductor structure includes a memory region. A memory structure is disposed on the memory region. The memory structure includes a first electrode, a...
2017/0271589 RESISTIVE MEMORY ARRAYS WITH A NEGATIVE TEMPERATURE COEFFICIENT OF RESISTANCE MATERIAL
A resistive memory array includes a plurality of resistive memory devices. A sneak path current in the resistive memory array is reduced when a negative...
2017/0271588 COMPOSITE SELECTOR ELECTRODES
A composite selector electrode includes a switching layer coupled in electrical parallel with a conducting layer. The switching layer is electrically...
2017/0271586 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device of an embodiment includes a memory cell array. The memory cell array comprises: a semiconductor layer extending in a first...
2017/0271585 NONVOLATILE MEMORY DEVICE
According to one embodiment, a nonvolatile memory device includes a first conductive layer, a second conductive layer, and an intermediate layer. The first...
2017/0271584 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor memory device includes a semiconductor layer, a gate electrode, a metal containing portion, and an insulating...
2017/0271583 RESISTIVE MEMORY CELLS INCLUDING LOCALIZED FILAMENTARY CHANNELS, DEVICES INCLUDING THE SAME, AND METHODS OF...
Resistive memory cells are described. In some embodiments, the resistive memory cells include a switching layer having an inner region in which one or more...
2017/0271582 STRUCTURES INCORPORATING AND METHODS OF FORMING METAL LINES INCLUDING CARBON
Disclosed technology relates generally to integrated circuits, and more particularly, to structures incorporating and methods of forming metal lines including...
2017/0271581 SEMICONDUCTOR MEMORY DEVICES
A semiconductor memory device includes first conductive lines extending in a first direction on a substrate, second conductive lines extending in a second...
2017/0271580 SEMICONDUCTOR MEMORY DEVICES
Disclosed are a semiconductor memory device and a method of manufacturing the same. A first conductive line extends in a first direction on a substrate and has...
2017/0271579 MAGNETIC RANDOM ACCESS MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
In an MRAM device, the MRAM includes a magnetic tunnel junction (MTJ) structure and a protection layer on a sidewall of the MTJ structure. The protection layer...
2017/0271578 METHOD OF FABRICATING CRYSTALLINE MAGNETIC FILMS FOR pSTTM APPLICATIONS
A method including forming a device stack including a dielectric layer between a fixed magnetic layer and a free magnetic layer on a fully-crystalline...
2017/0271577 FERROMAGNETIC TUNNEL JUNCTION ELEMENT AND METHOD OF DRIVING FERROMAGNETIC TUNNEL JUNCTION ELEMENT
In a tunnel junction element having a ferromagnetic free layer, an insulating layer and a ferromagnetic fixed layer, in order to reduce the current necessary...
2017/0271576 MAGNETIC DIFFUSION BARRIERS AND FILTER IN PSTTM MTJ CONSTRUCTION
A material layer stack for a magnetic tunneling junction, the material layer stack including a fixed magnetic layer; a dielectric layer; a free magnetic layer;...
2017/0271575 MAGNETIC SENSOR AND METHOD OF MANUFACTURING THE SAME
The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a...
2017/0271574 MAGNETIC MEMORY
A magnetic memory according to an embodiment includes: a magnetoresistive device including a first magnetic layer, a second magnetic layer, and a first...
2017/0271573 ELECTRONIC ELEMENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an...
2017/0271572 PRE-PRODUCT AND METHOD FOR PRODUCING A STRIP-LIKE HIGH-TEMPERATURE SUPERCONDUCTOR
The present invention relates to a precursor (1) for production of a high-temperature superconductor (HTS) in ribbon form, comprising a metallic substrate (10)...
2017/0271571 FLEXIBLE THERMOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING THE SAME
A flexible thermoelectric element and a method for manufacturing the same is provided. The thermoelectric element is disposed between a high temperature...
2017/0271570 THERMOELECTRIC DEVICE
The present invention is directed to a thermoelectric device that includes a plurality of thermoelectric couples positioned between a top plate and a bottom...
2017/0271569 LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL MEMBER
A light emitting device package can include a base including a flat top surface; first and second electrical circuit layers on the flat top surface; a light...
2017/0271568 LIGHT-EMITTING DEVICE
A light-emitting device comprises a plurality of light-emitting pillars separated from each other by a space, wherein each of the plurality of light-emitting...
2017/0271567 COPPER ALLOY PLATE STRIP FOR USE IN LED LEAD FRAME
A copper alloy sheet or strip for a lead frame of LED includes specific amounts of Fe, P, Zn, and Sn with the remainder being Cu and unavoidable impurities. A...
2017/0271566 DISPLAY PANEL
A display panel includes a substrate, conducting wires, a first insulation layer, a second insulation layer, first electrode series, light emitting units and...
2017/0271565 LIGHT EMITTING DEVICE, PACKAGE, AND METHODS OF MANUFACTURING THE SAME
A method of manufacturing a light emitting device includes: providing an assembly comprising: a package comprising: a resin member having an inner side surface...
2017/0271564 Phosphor Plate and Method for Manufacturing Same
The present invention relates to a phosphor plate comprising: a base plate; and phosphor included in the base plate, and provides a phosphor plate and a method...
2017/0271563 METHOD AND APPARATUS FOR CONTROLLED SEMICONDUCTOR GROWTH DURING SYNTHESIS OF QUANTUM DOT MATERIALS
Techniques and mechanisms for synthesizing quantum dot structures. In an embodiment, a first reaction is performed to dissolve a precursor of a semiconductor...
2017/0271562 QUANTUM DOT COMPOSITE FLUORESCENT PARTICLE AND LED MODULE
The invention discloses a quantum dot composite fluorescent particle including quantum dots, a mesoporous material, and a water-blocking and oxygen-blocking...
2017/0271561 WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A SINGLE CARRIER DIE
An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped....
2017/0271560 A NOVEL LED SUPPORT STRUCTURE
The invention discloses a novel LED support structure, including a metal support terminal; an LED chip fixed on the metal support terminal; a bonding wire for...
2017/0271559 LIGHT EMITTING DEVICE
A side-view type light emitting device has a bottom surface thereof as a light emission surface and a first lateral surface thereof as a mounting surface for...
2017/0271558 LIGHT EMITTING DIODE DIE AND MANUFACTURING METHOD THEREOF
An LED die includes a substrate, a pre-growth layer, a first insulating layer and a light emitting structure. The pre-growth layer, the first insulating layer...
2017/0271557 Micro-LED Device
A micro-LED .mu.LED, comprising: a substantially parabolic mesa structure; a light emitting source within the mesa structure; and a primary emission surface on...
2017/0271556 SEMICONDUCTOR STACKING STRUCTURE, AND METHOD AND APPARATUS FOR SEPARATING NITRIDE SEMICONDUCTOR LAYER USING SAME
A semiconductor stacking structure according to the present invention comprises: a monocrystalline substrate which is disparate from a nitride semiconductor;...
2017/0271555 LIGHT EMITTING DIODE
Disclosed is a light emitting diode using light of a short wavelength band. The light emitting diode includes a first conductivity type semiconductor layer...
2017/0271554 QUANTUM DOT LIGHT ENHANCEMENT SUBSTRATE AND LIGHTING DEVICE INCLUDING SAME
A component including a substrate, at least one layer including a color conversion material comprising quantum dots disposed over the substrate, and a layer...
2017/0271553 Light Emitting Diode Chip Having Temperature Compensation of the Wavelength
An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a p-type semiconductor region, an n-type...
2017/0271552 LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME
A light emitting element includes a first electrode, a second electrode overlapping the first electrode, and an emission layer between the first electrode and...
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