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Patent # Description
2017/0271399 INTEGRATED CIRCUIT WITH HALL EFFECT AND ANISOTROPIC MAGNETORESISTIVE (AMR) SENSORS
Disclosed examples provide wafer-level integration of magnetoresistive sensors and Hall-effect sensors in a single integrated circuit, in which one or more...
2017/0271398 STRETCHABLE DISPLAY APPARATUS
A display apparatus includes a plurality of light-emitting diodes ("LED"s); a stretchable substrate including a flat portion, and a plurality of protrusions...
2017/0271397 Anti-Reflective Treatment Of The Rear Side Of A Semiconductor Wafer
A method for producing a semiconductor wafer, in which an optical anti-reflective layer (4) is formed on the backside of the wafer in order to optimize optical...
2017/0271396 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
The present disclosure provides a semiconductor device including: a first semiconductor layer including a first region and a second region adjacent to the...
2017/0271395 COMPOSITE IMAGE SENSOR AND DEVICE COMPRISING THE COMPOSITE IMAGE SENSOR
One embodiment provides a device, including: a composite image sensor, including: a wiring layer that processes electrical signals; a first photodiode layer...
2017/0271394 SHALLOW TRENCH TEXTURED REGIONS AND ASSOCIATED METHODS
Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor layer having...
2017/0271393 SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF
A solid-state imaging device includes a photoelectric conversion unit, a transistor, and an element separation region separating the photoelectric conversion...
2017/0271392 Front-Side Imager Having a Reduced Dark Current on a SOI Substrate
A front-side image sensor may include a substrate in a semiconductor material and an active layer in the semiconductor material. The front side image sensor...
2017/0271391 PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
Backside illuminated photosensitive devices and associated methods are provided. In one aspect, for example, a backside-illuminated photosensitive imager...
2017/0271390 Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method...
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module...
2017/0271389 IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include:...
2017/0271388 INTEGRATED BIO-SENSOR WITH NANOCAVITY AND FABRICATION METHOD THEREOF
A bio-sensor includes a substrate having a light-sensing region thereon. A first dielectric layer, a diffusion barrier layer, and a second dielectric layer are...
2017/0271387 MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE
A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing...
2017/0271386 Implant Isolated Devices and Method for Forming the Same
A device includes a semiconductor substrate and implant isolation region extending from a top surface of the semiconductor substrate into the semiconductor...
2017/0271385 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE
The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can...
2017/0271384 BIASED DEEP TRENCH ISOLATION
An image sensor includes a plurality of photodiodes disposed in a semiconductor material, and a through-semiconductor-via coupled to a negative voltage source....
2017/0271383 IMAGE DEVICE HAVING MULTI=LAYERED REFRACTIVE LAYER ON BACK SURFACE
An image sensor device is disclosed. The image sensor device includes: a substrate having a front surface and a back surface; a radiation-sensing region formed...
2017/0271381 METHOD FOR MANUFACTURING A FIELD EFFECT TRANSISTOR, METHOD FOR MANUFACTURING A VOLATILE SEMICONDUCTOR MEMORY...
A method for manufacturing a field effect transistor including a gate-insulating layer, an active layer, and a passivation layer. The method includes a first...
2017/0271380 PEELING METHOD
A peeling method of one embodiment of the present invention includes a first step of forming a first insulating layer over a substrate; a second step of...
2017/0271379 ARRAY SUBSTRATE FOR DISPLAY APPARATUS, DISPLAY APPARATUS, METHOD FOR PRODUCING ARRAY SUBSTRATE FOR DISPLAY...
A technique disclosed in the present specification relates to reducing failures at repairing a bright pixel defect to be a dark pixel. An array substrate for a...
2017/0271378 SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE
A semiconductor device with a reduced layout area of transistors is provided. The semiconductor device includes a first transistor including a first oxide...
2017/0271377 DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
Disclosed is a display device including a transistor showing extremely low off current. In order to reduce the off current, a semiconductor material whose band...
2017/0271376 THIN FILM TRANSISTOR AND DISPLAY DEVICE COMPRISING THE SAME
According to one embodiment, a thin film transistor includes an oxide semiconductor layer provided above an insulating substrate and including a channel region...
2017/0271375 SEMICONDUCTOR DEVICE
A semiconductor device includes a first electrode, a first insulating layer on the first electrode, a second electrode on the first insulating layer, a second...
2017/0271374 ARRAY SUBSTRATE, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE
The present disclosure provides an array substrate, its manufacturing method, and a display device. The method includes steps of forming a passivation layer on...
2017/0271373 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
According to an embodiment of the present disclosure, a method for manufacturing the array substrate includes forming a first transparent conductive layer and...
2017/0271372 DISPLAY DEVICE
A display device includes a first substrate having an active area, a circuit area extending outwardly from the active area, and a cell seal area extending...
2017/0271371 ARRAY SUBSTRATE AND DISPLAY DEVICE
Disclosed are an array substrate and a display device. The array substrate comprises a plurality of first data lines (1) parallel to a short side of the array...
2017/0271370 ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY PANEL
The present disclosure provide an array substrate and a method of manufacturing the same, and a display panel. The array substrate includes: a base substrate;...
2017/0271369 ARRAY SUBSTRATE, DISPLAY DEVICE AND WEARABLE DEVICE
The present disclosure provides an array substrate, a display device and a wearable device. The array substrate includes a plurality of pixel units. Each of...
2017/0271368 DISPLAY SUBSTRATE, MANUFACTURING METHOD FOR THE SAME, AND DISPLAY DEVICE
The embodiments of the disclosure provide a display substrate, a manufacturing method for the same, and a display device. The display substrate comprises a...
2017/0271367 INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE BASED ON INTEGRATED CIRCUIT, AND STANDARD CELL LIBRARY
An integrated circuit (IC) may include at least one cell including a plurality of conductive lines that extend in a first direction and are in parallel to each...
2017/0271366 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a nonvolatile semiconductor memory device includes first and second connectors, first and second conductive layers, a first...
2017/0271365 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
The memory string comprises: a first semiconductor layer; a stacked body in which a plurality of conductive layers and a plurality of interlayer insulating...
2017/0271364 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
This nonvolatile semiconductor memory device includes: a memory cell array including a memory cell; a wiring part connecting the memory cell array to an...
2017/0271363 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor memory device includes a stacked body including a first electrode layer and a second electrode layer stacked on the first electrode layer, and...
2017/0271362 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device according to an embodiment includes: a first semiconductor layer, a stacked body including a plurality of conductive layers and a...
2017/0271361 SEMICONDUCTOR MEMORY DEVICE
According to an embodiment, a semiconductor memory device comprises: an insulating layer disposed on a semiconductor substrate; a plurality of memory cell...
2017/0271360 3D NON-VOLATILE MEMORY ARRAY UTILIZING METAL ION SOURCE
According to one embodiment, a semiconductor memory device includes a semiconductor layer, a plurality of conductive layers, a plurality of insulating layers,...
2017/0271359 SEMICONDUCTOR MEMORY DEVICE
According to an embodiment, a semiconductor memory device comprises control gate electrodes, a first semiconductor layer, a gate insulating layer, a first...
2017/0271358 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
According to an embodiment, a semiconductor memory device comprises: a stacked body that includes a plurality of control gate electrodes stacked above a...
2017/0271357 SEMICONDUCTOR MEMORY DEVICE
A plurality of semiconductor layers have longitudinally a first direction, have a peripheral area surrounded by the plurality of control gate electrodes, and...
2017/0271356 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
According to an embodiment, a semiconductor memory device comprises: control gate electrodes stacked above a substrate; a semiconductor layer that extends in a...
2017/0271355 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
According to one embodiment, a semiconductor memory device includes a semiconductor substrate, a stacked body provided on the semiconductor substrate and...
2017/0271354 SEMICONDUCTOR DEVICE
Provided herein is a semiconductor device. The semiconductor device includes: a lower conductive pattern; a lower memory string conductive pattern disposed...
2017/0271353 SEMICONDUCTOR DEVICE
Provided herein is a semiconductor device. The semiconductor device may include a substrate, conductive patterns, and a pipe gate. The substrate may have first...
2017/0271352 THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ANNULAR ETCH-STOP SPACER AND METHOD OF MAKING THEREOF
An etch-stop annular spacer can be formed around a protruding portion of a sacrificial pillar structure that fills a lower memory opening through a first...
2017/0271351 VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
A vertical memory device includes a substrate, a plurality of channels on the substrate and extending in a first direction that is vertical to a top surface of...
2017/0271350 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor memory device includes a substrate, a first insulating film, a stacked body, and a first pillar. At least a...
2017/0271349 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device according to an embodiment comprises: a plurality of control gate electrodes arranged in a first direction intersecting an upper...
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