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Patent # Description
2017/0271195 A REGULATED HIGH SIDE GATE DRIVER CIRCUIT FOR POWER TRANSISTORS
The present invention relates in a first aspect to a regulated high side gate driver circuit for power transistors. The regulated high side gate driver circuit...
2017/0271194 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
A plasma processing method includes a mounting process of mounting a holding sheet holding a substrate in a stage provided in a plasma processing apparatus,...
2017/0271193 SEMICONDUCTOR TRANSPORT MEMBER AND SEMICONDUCTOR MOUNTING MEMBER
Provided is a semiconductor transport member that includes a semiconductor mounting member capable of expressing a strong gripping force and unlikely to cause...
2017/0271192 COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODES
A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described....
2017/0271191 SUBSTRATE SUPPORTING PLATE, THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME, AND THIN FILM DEPOSITION METHOD
A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate...
2017/0271190 ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
A substrate processing apparatus includes an electrostatic chuck which is made up of a base, a dielectric plate on the base, a chuck electrode in the...
2017/0271189 ROBOT ARMS AND METHOD FOR ALIGNING SUBSTRATE WITH THE SAME
The present disclosure provides a robot arm, including a pedestal, a support arm on the pedestal and configured to support a substrate, a driving system...
2017/0271188 SUBSTRATE CONTAINER VALVE ASSEMBLIES
A substrate container includes a container portion having an open side or bottom, and a door to sealingly close the open side or bottom, one of the door and...
2017/0271187 LOAD LOCK CHAMBER AND THE CLUSTER TOOL SYSTEM USING THE SAME
Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to...
2017/0271186 MOLD AND TRANSFER MOLDING APPARATUS
According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing...
2017/0271185 Thin Film Device Fabrication Methods and Apparatus
A deposition device for providing a thin film on a substrate. The device comprises a material source for providing at least one first metallic element which...
2017/0271184 METHODS AND ASSEMBLIES FOR GAS FLOW RATIO CONTROL
Methods and gas flow control assemblies configured to deliver gas to process chamber zones in desired flow ratios. In some embodiments, assemblies include one...
2017/0271183 METHODS AND ASSEMBLIES FOR GAS FLOW RATIO CONTROL
Methods and gas flow control assemblies configured to deliver gas to process chamber zones in desired flow ratios. In some embodiments, assemblies include one...
2017/0271182 IN-SITU TEMPERATURE MEASUREMENT IN A NOISY ENVIRONMENT
Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a...
2017/0271181 METHOD AND APPARATUS FOR REDUCING RADIATION INDUCED CHANGE IN SEMICONDUCTOR STRUCTURES
Embodiments of the present disclosure relate to an apparatus and a method for reducing the adverse effects of exposing portions of an integrated circuit (IC)...
2017/0271180 WET-DRY INTEGRATED WAFER PROCESSING SYSTEM
An apparatus for processing wafer-shaped articles comprises a vacuum transfer module and an atmospheric transfer module. A first airlock interconnects the...
2017/0271179 SUBSTRATE SUPPORT ASSEMBLY HAVING METAL BONDED PROTECTIVE LAYER
A method of manufacturing a substrate support assembly comprises bonding a ceramic body to a thermally conductive base. The method further comprises metal...
2017/0271178 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning...
2017/0271177 SUBSTRATE PROCESSING APPARATUS
In a substrate processing apparatus, the inner peripheral edge of a second-cup canopy part radially opposes an outer peripheral surface of an opposing-member...
2017/0271176 SUBSTRATE PROCESSING APPARATUS
Cleaning processing of each of the inside of a shower head and the inside of a processing space can be sufficiently or appropriately performed even when gas...
2017/0271175 EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR ASSEMBLY AND BUMP DENSITY
Disclosed is a die packaging structure comprising a semiconductor die, an encapsulant layer disposed around the semiconductor die, wherein a backside surface...
2017/0271174 PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINATION
A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die...
2017/0271173 METHOD FOR FORMING METALLIZATION STRUCTURE
A method for forming a metallization structure is provided, including forming a metallic powder layer on a substrate; performing a first laser sintering on a...
2017/0271172 CMP SLURRY COMPOSITION FOR POLISHING COPPER LINE AND POLISHING METHOD USING SAME
The present invention relates to a CMP slurry composition for polishing a copper line, the CMP slurry composition comprising a colloidal silica, an oxidizing...
2017/0271171 METHOD OF PROCESSING SURFACE OF POLYSILICON AND METHOD OF PROCESSING SURFACE OF SUBSTRATE ASSEMBLY
Embodiments of the present invention provide a method of processing a surface of a polysilicon and a method of processing a surface of a substrate assembly....
2017/0271170 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
According to one embodiment, a method for manufacturing a semiconductor device includes forming a hole extending in a first direction in a workpiece. The...
2017/0271169 A METHOD OF PLANARIZING A FILM LAYER
A method of fabricating a semiconductor device is disclosed. The method includes forming a first flowable-material (FM) layer over a substrate. A top surface...
2017/0271168 METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A p-type base region, n.sup.+-type source region, p.sup.+-type contact region, and n-type JFET region are formed on a front surface side of a silicon carbide...
2017/0271167 FIN DENSITY CONTROL OF MULTIGATE DEVICES THROUGH SIDEWALL IMAGE TRANSFER PROCESSES
Methods and structures for fabricating fins for multigate devices are disclosed. In accordance with one method, a plurality of sidewalls are formed in or on a...
2017/0271166 Methods and Systems for Plasma Etching Using Bi-Modal Process Gas Composition Responsive to Plasma Power Level
A substrate is disposed on a substrate holder within a process module. The substrate includes a mask material overlying a target material with at least one...
2017/0271165 ISOTROPIC SILICON AND SILICON-GERMANIUM ETCHING WITH TUNABLE SELECTIVITY
Isotropic silicon and silicon-germanium etching with tunable selectivity is described. The method includes receiving a substrate having a layer of silicon and...
2017/0271164 Directed Self-Assembly Process with Size-Restricted Guiding Patterns
A method includes providing a substrate; forming mandrel patterns over the substrate; and forming spacers on sidewalls of the mandrel patterns. The method...
2017/0271163 BLOCK PATTERNING METHOD ENABLING MERGED SPACE IN SRAM WITH HETEROGENEOUS MANDREL
Methodologies and a device for SRAM patterning are provided. Embodiments include forming a spacer layer over a fin channel, the fin channel being formed in...
2017/0271162 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Over a semiconductor substrate, a memory gate electrode for a nonvolatile memory cell is formed via a first insulating film having an internal charge storage...
2017/0271161 ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS
An ion implantation method includes: irradiating a wafer arranged to meet a predetermined plane channeling condition with an ion beam; measuring a ...
2017/0271160 Method of Forming Openings in a Material Layer
A method of fabricating a semiconductor device includes forming a hard mask (HM) mandrel along a first direction over a material layer, forming a first spacer...
2017/0271159 METHOD FOR HANDLING THIN BRITTLE FILMS
A method including: providing a structure comprising: a spalled layer having a first side and a second side; and a tape layer provided on the first side of the...
2017/0271158 METHOD FOR MANUFACTURING A WIDE BANDGAP JUNCTION BARRIER SCHOTTKY DIODE
A method for manufacturing a wide bandgap junction harrier Schottky diode (1) having an anode side (10) and a cathode side (15) is provided, wherein an (n.+-.)...
2017/0271157 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate; a nickel silicide film provided on a surface of the silicon carbide...
2017/0271156 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
In a silicon carbide semiconductor device in which a contact electrode is formed on a single-crystal silicon carbide semiconductor substrate, a barrier metal...
2017/0271155 METHOD OF PRIMING PHOTORESIST BEFORE APPLICATION OF A SHRINK MATERIAL IN A LITHOGRAPHY PROCESS
A photoresist layer is formed over a patternable layer. The photoresist layer containing a negative tone photoresist material. An exposure process is performed...
2017/0271154 HARDMASK COMPOSITION AND METHOD OF FORMING PATTERNING BY USING THE HARDMASK COMPOSITION
Example embodiments relate to a hardmask composition and/or a method of forming a fine pattern by using the hardmask composition, wherein the hardmask...
2017/0271153 METHOD OF EPITAXIAL STRUCTURE FORMATION IN A SEMICONDUCTOR
The invention provides a method of epitaxial structure formation in a semiconductor, comprising: providing a substrate; performing a dry etch to form a first...
2017/0271152 METHOD OF FORMING TIN OXIDE LAYER USING TIN METAL TARGET
Provided is a method of forming a tin oxide layer using a tin metal target which forms the tin oxide layer on a glass substrate using the tin metal target. The...
2017/0271151 COATING COMPOSITION FOR PATTERN REVERSAL ON SOC PATTERN
A resin composition for pattern reversal can be embedded between traces of the pattern of a stepped substrate formed on the substrate to be processed and can...
2017/0271150 MATERIAL COMPOSITION AND METHODS THEREOF
Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments,...
2017/0271149 METHODS OF FORMING FINE PATTERNS
A method of forming fine patterns includes forming pillars arrayed in rows and columns on an underlying layer and forming a spacer layer on the underlying...
2017/0271148 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE
When a defect region is present near the pn junction in a GaN layer, lattice defects are present in the depletion layer. Therefore, when a reverse bias is...
2017/0271147 Apparatus And Method For Processing Semiconductor Wafer Surface With Ozone-Containing Fluid
An apparatus and a method for processing one or more surfaces of a semiconductor wafer with one or more ozone-containing fluids are provided. The apparatus...
2017/0271146 SEMICONDUCTOR STRUCTURE HAVING INSULATOR PILLARS AND SEMICONDUCTOR MATERIAL ON SUBSTRATE
One aspect of the disclosure relates to a method of forming a semiconductor structure. The method may include: forming a set of openings within a substrate;...
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