Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2017/0294443 VERTICAL MEMORY DEVICES HAVING DUMMY CHANNEL REGIONS
A memory device includes a plurality of channel regions that each extend in a direction perpendicular to an upper surface of a substrate, a plurality of gate...
2017/0294442 SELF-ALIGNED MULTIPLE PATTERNING SEMICONDUCTOR DEVICE FABRICATION
Various embodiments provide a self-merged profile (SMP) method for fabricating a semiconductor device and a device fabricated using an SMP method. In an...
2017/0294441 STATIC RANDOM ACCESS MEMORY (SRAM) CELLS INCLUDING VERTICAL CHANNEL TRANSISTORS AND METHODS OF FORMING THE SAME
A static random access memory (SRAM) cell can include a first pull-up transistor, a first pull-down transistor, a second pull-up transistor, a second pull-down...
2017/0294440 METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING EDGE CHIP AND RELATED DEVICE
A method of forming a semiconductor device includes forming a molding layer and a supporter layer on a substrate including an etch stop layer, forming a mask...
2017/0294439 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
Semiconductor devices and method of manufacturing the same are provided. The devices may include a substrate including a first impurity region and second...
2017/0294438 NAND String Utilizing Floating Body Memory Cell
NAND string configurations and semiconductor memory arrays that include such NAND string configurations are provided. Methods of making semiconductor memory...
2017/0294437 Semiconductor Devices and Methods of Fabricating the Same
A semiconductor device includes a substrate with an NMOSFET region and a PMOSFET region, a first active pattern on the NMOSFET region, a second active pattern...
2017/0294436 FIN FIELD EFFECT TRANSISTOR AND SEMICONDUCTOR DEVICE
A FinFET including a gate stack, a semiconductor fin embedded in the gate stack, a source and a drain disposed is provided. The semiconductor fin extends along...
2017/0294435 BIDIRECTIONAL POWER SEMICONDUCTOR
A bidirectional power semiconductor device with full turn-off control in both current directions and improved electrical and thermal properties is provided,...
2017/0294434 METHOD AND SYSTEM FOR A SEMICONDUCTOR DEVICE WITH INTEGRATED TRANSIENT VOLTAGE SUPPRESSION
A power transistor assembly and method of operating the assembly are provided. The power transistor assembly includes integrated transient voltage suppression...
2017/0294433 ARRAY SUBSTATE AND DISPLAY DEVICE
Disclosed are an array substrate and a display device, which can achieve protection of a signal line against static electricity and meanwhile decrease a load...
2017/0294432 SEMICONDUCTOR DEVICE HAVING MULTIPLE GATE PADS
Disclosed are semiconductor devices that include additional gate pads, and methods of fabricating and testing such devices. A device may include a first gate...
2017/0294431 SEMICONDUCTOR DEVICE IN A LEVEL SHIFTER WITH ELECTROSTATIC DISCHARGE (ESD) PROTECTION CIRCUIT AND SEMICONDUCTOR...
The present disclosure relates to a semiconductor chip having a level shifter with electro-static discharge (ESD) protection circuit and device applied to...
2017/0294430 STANDARD CELL FOR REMOVING ROUTING INTERFERENCE BETWEEN ADJACENT PINS AND DEVICE INCLUDING THE SAME
An integrated circuit including a first standard cell including, first transistors, the first transistors being first unfolded transistors, a first metal pin,...
2017/0294429 SEMICONDUCTOR LAYOUT STRUCTURE
A semiconductor layout structure includes a substrate comprising a cell edge region and a dummy region abutting thereto, a plurality of dummy contact patterns...
2017/0294428 METHOD OF PRODUCING OPTOELECTRONIC MODULES AND AN ASSEMBLY HAVING A MODULE
A method produces a plurality of optoelectronic modules, and includes: A) providing a metallic carrier assembly with a plurality of carrier units; B) applying...
2017/0294427 LIGHT EMITTING MODULE
To provide a light emitting module capable of reducing luminance unevenness. A light emitting module 10 includes an element substrate 11 extending in one...
2017/0294426 LIGHT-EMITTING-AND-RECEIVING ELEMENT MODULE AND SENSOR DEVICE USING THE SAME
A light-emitting-and-receiving element module 1 comprises a substrate 2 that comprises a top surface 2a; a light-emitting element 3a on the top surface 2a of...
2017/0294425 FLEXIBLE DISPLAY APPARATUS
A flexible display apparatus includes: a flexible substrate including a first surface and a second surface which is opposite to the first surface; a first...
2017/0294423 INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
Some embodiments relate to a package. The package includes a first substrate, a second substrate, and an interposer frame between the first and second...
2017/0294422 PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERIAL (TIM) IN CAVITY OF AN ENCAPSULATION LAYER
A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package...
2017/0294421 FABRICATING METHOD OF A SEMICONDUCTOR LIGHT EMITTING DEVICE
A fabricating method of a semiconductor light emitting device includes disposing a plurality of non-conductive walls on a substrate. An alignment position is...
2017/0294420 A METHOD OF APPLYING A LIGHTING ARRANGEMENT TO A SURFACE AND A LIGHTING SURFACE
LED lighting elements are provided over a first conductive layer, each comprising a pad with top and bottom electrical contacts. A spray coating fills the...
2017/0294419 LIGHT EMITTING DEVICE
A light emitting device includes a first light emitting element having a first front surface and a first lateral surface, and a second light emitting element...
2017/0294418 HIGH DENSITY PIXELATED LED AND DEVICES AND METHODS THEREOF
At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one...
2017/0294417 HIGH DENSITY PIXELATED LED AND DEVICES AND METHODS THEREOF
At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one...
2017/0294416 LIGHT-EMITTING APPARATUS AND FABRICATING METHOD THEREOF
A fabricating method of a light-emitting apparatus including the following steps is provided. An adhesive layer having first adhesive bump groups including...
2017/0294415 SEMICONDUCTOR DEVICE AND STRUCTURE
A 3D semiconductor device and structure, including: a first die including first transistors and first interconnect, overlaid by a second die including second...
2017/0294414 COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF MANUFACTURING
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module...
2017/0294413 STACK-TYPE SEMICONDUCTOR PACKAGE
A semiconductor package includes a lower package including a lower package substrate, a lower semiconductor chip disposed on the lower package substrate, and a...
2017/0294412 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal...
2017/0294411 SEMICONDUCTOR PACKAGES INCLUDING CHIP ENABLEMENT PADS
A semiconductor package includes a package substrate and semiconductor chips stacked on the package substrate. The package substrate may include at least one...
2017/0294410 MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONNECTS
A microelectronic package includes at least one microelectronic element having a front surface defining a plane, the plane of each microelectronic element...
2017/0294409 Multi-Chip Fan Out Package and Methods of Forming the Same
A package includes a die having a conductive pad at a top surface of the die, a stud bump over and connected to the conductive pad, and a redistribution line...
2017/0294408 SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS
A semiconductor device includes a semiconductor chip covered with a resin layer, the semiconductor chip including an electrode pad at a surface of the...
2017/0294407 PASSIVE ELEMENT PACKAGE AND SEMICONDUCTOR MODULE COMPRISING THE SAME
A passive element package includes a first substrate, first passive elements disposed on the first substrate, a second substrate disposed on the first passive...
2017/0294406 Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The...
2017/0294405 METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist...
2017/0294404 SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The...
2017/0294403 Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip...
2017/0294402 Bonding Package Components Through Plating
A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the...
2017/0294401 SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
Semiconductor packages and methods for forming a semiconductor package are presented. The semiconductor package includes a package substrate having a die...
2017/0294400 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a semiconductor substrate with a wiring layer formed thereon, an insulating film formed on the semiconductor substrate so as to...
2017/0294399 POWER MODULE SUBSTRATE WITH Ag UNDERLAYER AND POWER MODULE
A power module substrate with a Ag underlayer of the invention includes: a circuit layer that is formed on one surface of an insulating layer; and a Ag...
2017/0294398 SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING OF ELEMENTS
A semiconductor device includes a semiconductor chip covered with a resin layer, the semiconductor chip including an electrode pad at a surface of the...
2017/0294397 DIE AND SUBSTRATE ASSEMBLY WITH GRADED DENSITY BONDING LAYER
A die and substrate assembly is disclosed for a die with electronic circuitry and a substrate. A sintered bonding layer of sintered metal is disposed between...
2017/0294396 SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable...
2017/0294395 SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS
A semiconductor device includes a base, a semiconductor chip on the base, a conductive bonding layer between a surface of the base and a surface of the...
2017/0294394 SEMICONDUCTOR DEVICE HAVING A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS
A semiconductor device includes a substrate including, on a surface thereof, a first conductive pad and a first insulating layer formed around the first...
2017/0294393 PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
A method for attaching a semiconductor die to a substrate includes providing a substrate that includes an attachment layer at a surface of the substrate. The...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.