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Patent # Description
2017/0311479 METHODS AND SYSTEM FOR OIL IMMERSION COOLING
A system for immersion cooling computing system equipment includes a container, a volume of cooling liquid disposed in the container, a computing system...
2017/0311478 HEAT SINK ASSEMBLIES FOR TRANSIENT COOLING
A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled...
2017/0311477 SYSTEMS AND METHODS OF REAL TIME OPTIMUM AIRFLOW BALANCING ON RACK LEVEL AIRFLOW CONSTRAINT
A central information management console provides for real time management of airflow across an information handling system or across multiple information...
2017/0311476 THERMAL CONTROL WITHIN AN ENCLOSURE WITH CIRCULAR CROSS-SECTION
A thermal control system includes an enclosure configured to contain a thermal mass. A baffle plate is disposed in the enclosure. A heat exchanger is...
2017/0311475 FLAT ROOF INVERTER RACK
A multi-component inverter rack formed from sheet metal is disclosed. Some of the sheet metal derived parts used to form the multi-component inverter rack can...
2017/0311474 MODULAR SERVER
Disclosed is a modular server that allows for the simple replacement of the system board, memory and key network components in a single system tray to form a...
2017/0311473 SENSOR HOUSING
In order to configure a housing (3) for a sensor received in the housing as deformation stable as possible the housing is made integrally in one piece from...
2017/0311472 MOUNTING CLIP
A flexible mounting clip is configured for engaging with a circuit board for removably attaching the circuit board to a mounting surface. A rib on an arm of...
2017/0311471 POWER SUPPLY STRUCTURE
A load board includes an electronic component and first wiring connected thereto. A power supply board includes a DC/DC converter and second wiring connected...
2017/0311470 IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCUIT COMPONENTS AND THE CIRCUIT THEREOF
The present invention discloses an implementation method for stacked connection between isolated circuit components, whose setting is according to at least two...
2017/0311469 MOUNTED ENCLOSURE FOR COMMUNICATION COMPONENTS
In various implementations, an enclosure may be utilized to secure component(s) to location(s), such as an overhead portion of a structure (e.g., a ceiling)...
2017/0311468 HYBRID THERMOPLASTIC GELS AND THEIR METHODS OF MAKING
Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer...
2017/0311467 ENCLOSURE FOR COMMUNICATIONS COMPONENTS
In various implementations, an enclosure may be utilized to secure component(s) for a variety of applications, such as creating a communications network. For...
2017/0311466 WITNESS LAYERS FOR GLASS ARTICLES
Glass articles having a base layer formed of glass and having a first compressive stress, an adjacent compression layer formed in the glass and having a second...
2017/0311465 PROTECTIVE CASE HAVING PLURALITY OF EXTERNAL CONNECTORS
A case for use with a portable electronic device includes a shell, an internal electrical connector, and first and second external electrical connectors. The...
2017/0311464 STRUCTURAL DEVICE COVER
The description relates to devices that can include a hollow arm that has an open side and a cover engaging region around the open side. The cover engaging...
2017/0311463 ELECTRONICS HOUSING
An electronics housing includes: a housing body for attachment to a mounting rail and on which a cover is arranged which is pivotable about a pivot pin, formed...
2017/0311462 DIN RAIL DEVICE MOUNT ASSEMBLIES, SYSTEMS AND METHODS INCLUDING LOCKING MECHANISMS
A DIN rail device mount system includes a base, a module and a locking mechanism. The base is configured to be mounted on a DIN rail. The base defines a...
2017/0311461 FLEXIBLE SCREEN MODULE AND ELECTRONIC DEVICE HAVING THE MODULE
A flexible screen module includes a casing, a flexible screen, a bracket, and a support member. The casing has an opening. The first rotating shaft has an...
2017/0311460 ELECTRICAL CONNECTION BOX AND WIRE HARNESS
An accommodating member in which an electronic component is accommodated, a cover member that is assembled to the accommodating member to block an opening by...
2017/0311459 ARRANGEMENT FOR MAKING CONTACT WITH A PRINTED CIRCUIT BOARD
The present disclosure pertains to an arrangement comprising a housing, a circuit board arranged in the housing and at least one flat contact to connect the...
2017/0311458 HOUSING FOR RECEIVING ELECTRICAL AND/OR ELECTRONIC COMPONENTS, ELECTRONIC CONTROL UNIT AND METHOD FOR PRODUCING...
A housing for receiving electrical and/or electronic components includes a housing base part and a housing cover which covers the housing base part and which...
2017/0311457 ELECTRIC CONNECTION BOX
An electric connection box includes a housing in which a containing space is provided, and a first substrate unit and a second substrate unit which are...
2017/0311456 Portable Electronic Device Housing Structures
Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch...
2017/0311455 Method for Producing a Multi-Layer Substrate and Multi-Layer Substrate
A method for producing a multilayer substrate (1) is specified, wherein a main body (26) comprising a plurality of ceramic layers (2) is provided, wherein at...
2017/0311454 HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM
The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The...
2017/0311453 Soldering Device
Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed...
2017/0311452 STAMP FOR PRINTED CIRCUIT PROCESS AND METHOD OF FABRICATING THE SAME AND PRINTED CIRCUIT PROCESS
A stamp that is configured to be employed in a printed circuit process, a method of fabricating the stamp, and a printed circuit process are provided, and the...
2017/0311451 METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED MICROELECTRONIC DEVICE STRUCTURES AND...
A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from...
2017/0311450 SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The...
2017/0311449 BOARD AND CABLE CONNECTION BOARD
A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first...
2017/0311448 ELECTRONIC CIRCUIT PACKAGE
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the...
2017/0311447 MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LEADFRAMES FOR COMPONENT-ON-PACKAGE CIRCUITS
A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have...
2017/0311446 CERAMIC BOARD WITH MEMORY FORMED IN THE CERAMIC
The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a ...
2017/0311445 ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the...
2017/0311444 METHODS AND DEVICES FOR PROVIDING INCREASED ROUTING FLEXIBILITY IN MULTI-LAYER PRINTED CIRCUIT BOARDS
A build-up process for fabricating a multi-layer PCB is provided during which a mezzanine redistribution, or routing, structure is formed within one of the PCB...
2017/0311443 DOUBLE LAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed...
2017/0311442 FLEXIBLE DISPLAY DEVICE
A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that...
2017/0311441 TRANSPARENT CONDUCTOR AND DEVICE
According to one embodiment, a transparent conductor includes a transparent substrate; a metal nanowire layer disposed on the transparent substrate and...
2017/0311440 High-Current PCB Traces
The present disclosure relates to systems and methods using thermal vias to increase the current-carrying capacity of conductive traces on a multilayered...
2017/0311439 PRINTED CIRCUIT BOARD WITH ENHANCED IMMUNITY TO SIMULTANEOUS SWITCHING NOISE
A printed circuit board including a series-wound inductor and two capacitors to reduce the susceptibility of a printed circuit board to simultaneous switching...
2017/0311438 BOARD LEVEL SHIELDS WITH VIRTUAL GROUNDING CAPABILITY
According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board...
2017/0311437 FLEXIBLE ELECTRONIC MODULE
A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the...
2017/0311436 PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one...
2017/0311435 CABLE CONNECTION BOARD
A cable connection board includes a signal layer disposed inside a board, a first layer and a second layer disposed inside the board with the signal layer...
2017/0311434 PRINTED CIRCUIT BOARD CAPACITOR STRUCTURES
One example includes a printed circuit board (PCB) structure. The PCB structure includes a first dereferenced microstrip and a first capacitor pad contacting...
2017/0311433 ELECTRICITY STORAGE UNIT
An electricity storage unit includes: an electricity storage device; a circuit portion on which an electronic component is mounted; a heat dissipation member...
2017/0311432 Energy Generation By Igniting Flames Of An Electropositive Metal By Plasmatizing The Reaction Gas
The present disclosure relates to generating energy. The teachings thereof may be embodied in methods for burning a reaction gas with an electropositive metal....
2017/0311431 METHOD AND APPARATUS FOR GENERATING HIGHLY REPETITIVE PULSED PLASMAS
A pulsed radio frequency inductive plasma source and method are provided. The source may generate plasma at gas pressures from 1 torr to 2000 torr. By...
2017/0311430 APPARATUS AND TECHNIQUES TO TREAT SUBSTRATES USING DIRECTIONAL PLASMA AND REACTIVE GAS
An apparatus to treat a substrate. The apparatus may include a reactive gas source having a reactive gas outlet disposed in a process chamber, the reactive gas...
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