Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2017/0309605 ASSEMBLY OF WAFER STACKS
A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable...
2017/0309604 DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
A display apparatus includes: an emission layer including a light-emitting element which generates and emits light; a driving layer which drives the...
2017/0309603 3DIC Structure and Method for Hybrid Bonding Semiconductor Wafers
Methods for improving hybrid bond yield for semiconductor wafers forming 3DIC devices includes first and second wafers having dummy and main metal deposited...
2017/0309602 SEMICONDUCTOR LIGHT EMITTING DEVICE
A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked...
2017/0309601 LIGHT EMITTING DIODE LIGHTING MODULE
A light emitting diode (LED) lighting module includes a plurality of LED components and a carrier. The LED components are electrically connected in series, and...
2017/0309600 SEMICONDUCTOR PACKAGES
A planar dual die package includes a package substrate and first and second semiconductor dice disposed side by side on a first surface of the package...
2017/0309599 SEMICONDUCTOR DEVICE
A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a bonding electrode, and a dummy electrode. The first...
2017/0309598 SEMICONDUCTOR DEVICE
According to one embodiment, M (M represents an integer of 2 or larger) semiconductor chips and through electrodes for N (N represents an integer of 2 or...
2017/0309597 MANUFACTURING METHOD OF PACKAGE STRUCTURE
A manufacturing method of a package structure includes at least the following steps. At least one first die is disposed over a carrier. The first die is...
2017/0309596 Chip on Package Structure and Method
A system and method for packaging semiconductor device is provided. An embodiment comprises forming vias over a carrier wafer and attaching a first die over...
2017/0309595 LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
A method of assembling a flip chip on a leadframe package. A locking dual leadframe (LDLF) includes a top metal frame portion including protruding features and...
2017/0309594 BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMICONDUCTOR CHIP
A mounting apparatus of a chip including a mechanism configured to arrange a front surface of a chip and a front surface of a substrate to face each other such...
2017/0309593 Semiconductor chip assembly and method for making same
A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having...
2017/0309592 SEMICONDUCTOR DEVICE
A semiconductor device includes a base member, a wiring portion, a semiconductor element, and a resin package. The base member has an obverse surface, a...
2017/0309591 ELECTRONIC COMPONENT
An electric component comprising a terminal electrode and a hot-melt polymer layer formed on the terminal electrode, wherein the hot-melt polymer layer...
2017/0309590 ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
An anisotropic conductive film whereby electrically conductive particles can be sufficiently captured at each connection terminal while suppressing the...
2017/0309589 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Provided are a semiconductor device and a method for manufacturing the same. The semiconductor device according to an embodiment of the inventive concept...
2017/0309588 Dummy Flip Chip Bumps for Reducing Stress
A device includes a metal pad over a substrate. A passivation layer includes a portion over the metal pad. A post-passivation interconnect (PPI) is...
2017/0309587 SEMICONDUCTOR DEVICE HAVING AN INDUCTOR
A semiconductor device is provided with a semiconductor chip. The semiconductor chip has a semiconductor substrate, an interconnect layer, an inductor and...
2017/0309586 THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
An assembly of a semiconductor chip having pads to a substrate having pads aligned to receive the semiconductor chip is provided, whereby at least one of the...
2017/0309585 FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
The present invention provides a semiconductor structure and a method of fabricating the same. The method includes: providing a chip having conductive pads,...
2017/0309584 METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
A method for bonding a first substrate and a second substrate, the first substrate having at least one first connection extending from one side of the first...
2017/0309583 METHOD FOR PROCESSING AN ELECTRONIC COMPONENT AND AN ELECTRONIC COMPONENT
According to various embodiments, a method for processing an electronic component including at least one electrically conductive contact region may include:...
2017/0309582 Semiconductor Devices with On-Chip Antennas and Manufacturing Thereof
A semiconductor device includes a semiconductor die having an active main surface and an opposite main surface opposite the active main surface. The...
2017/0309581 Switchable Die Seal Connection
An integrated circuit (IC) structure for radio frequency (RF) circuits having a multi-point selectably grounded die seal and multi-point selectably grounded...
2017/0309580 Leadframe For A Semiconductor Component
The present disclosure relates to semiconductor components. The teachings thereof may be embodied in a lead frame for a semiconductor component including: a...
2017/0309579 ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE
Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed...
2017/0309578 MICROELECTRONIC BOND PADS HAVING INTEGRATED SPRING STRUCTURES
A microelectronic package may be fabricated with at least one compliant external bond pad having at least one integrated spring structure for mitigating the...
2017/0309577 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
A method for use in manufacturing semiconductor devices includes providing a wafer includes a semiconductor substrate that is mechanically homogeneous. The...
2017/0309576 ELECTRONIC CIRCUIT PACKAGE
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the...
2017/0309575 SUBSTRATE DESIGNED TO PROVIDE EMI SHIELDING
Packages and packaging techniques for providing EMI shielding are described. In an embodiment, a package includes an electrically conductive ground structure...
2017/0309573 INTERCONNECT STRUCTURE HAVING TUNGSTEN CONTACT COPPER WIRING
Aspects of the present disclosure include interconnect structures for an integrated circuit (IC) structure and methods of making the same. The interconnect...
2017/0309572 Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
A semiconductor device has a first semiconductor die stacked over a second semiconductor die which is mounted to a temporary carrier. A plurality of bumps is...
2017/0309571 FAN-OUT SEMICONDUCTOR PACKAGE
A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first...
2017/0309570 RECONFIGURABLE REPEATER SYSTEM
The present disclosure is directed to a reconfigurable repeater system. A system may comprise a PCB to which devices are coupled. At least one communication...
2017/0309569 Logic Semiconductor Devices
A logic semiconductor device includes a plurality of active patterns extending in a horizontal direction and being spaced apart from each other in a vertical...
2017/0309568 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
An integrated circuit device includes a first conductive line and a second conductive line that are spaced apart from each other and extend in a first...
2017/0309567 FUSE STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
A fuse structure includes a fusing line including a first portion, a second portion, and a central portion between the first portion and the second portion;...
2017/0309566 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
A semiconductor integrated circuit device (1000) includes: a first semiconductor chip CHP1 having a first circuit; and a second semiconductor chip (CHP2)...
2017/0309565 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
A method for use in manufacturing semiconductor devices includes providing a structured layer on a wafer, and selectively providing a substance on a selected...
2017/0309564 SEMICONDUCTOR DEVICE
A semiconductor device that includes a first wiring, a second wiring, and a first number of first resistance elements that are connected in parallel between...
2017/0309563 METAL-INSULATOR-METAL CAPACITOR AND METHODS OF FABRICATION
A method of forming a semiconductor structure, comprising forming a dual damascene structure having a capacitor trench and an interconnect trench, forming a...
2017/0309562 SEMICONDUCTOR DEVICE AND LAYOUT DESIGN THEREOF
A device includes gates and a first conductive segment. A first distance is present between a first gate of the gates and the first conductive segment. A...
2017/0309561 SEMICONDUCTOR DEVICE
There is provided a semiconductor device including a memory region and a logic region. The memory region includes a transistor (memory transistor) that stores...
2017/0309560 DEVICES AND METHODS FOR FORMING CROSS COUPLED CONTACTS
Semiconductor devices and methods of fabricating the semiconductor devices with cross coupled contacts using patterning for cross couple pick-up are disclosed....
2017/0309559 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
A printed circuit board (PCB) includes an insulating layer with an upper surface and a lower surface opposite to the upper surface; a first conductive pattern...
2017/0309558 INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
An interposer includes an insulating layer, conductor circuits formed in grooves formed on a first surface of the insulating layer respectively, and metal...
2017/0309557 PACKAGE SUBSTRATE
This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier;...
2017/0309556 ELECTRONIC PART MOUNTING HEAT-DISSIPATING SUBSTRATE
An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead...
2017/0309555 ELECTRONIC PART MOUNTING HEAT-DISSIPATING SUBSTRATE
[Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.