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Patent # Description
2017/0309554 METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH CONDUCTIVE INTERCONNECT FRAME AND STRUCTURE
A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame...
2017/0309553 Lead Frame Surface Modifications for High Voltage Isolation
An integrated circuit (IC) includes a lead frame that has a set of leads coupled to a corresponding set of pins. A semiconductor die with contacts is coupled...
2017/0309552 SYSTEM AND METHOD FOR VERIFYING USERS FOR A NETWORK SERVICE USING EXISTING USERS
A network computer system verifies users for a network service using verification input provided by existing users. The network computer system may determine a...
2017/0309551 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device PKG includes a semiconductor chip CP, a lead LD3, a wire BW5 electrically connecting a pad electrode PD2 of the semiconductor chip CP to...
2017/0309550 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
An improvement is achieved in the reliability of a semiconductor device. After a resin sealing portion is formed to seal a die pad, a semiconductor chip...
2017/0309549 Sintered Metal Flip Chip Joints
An integrated circuit die may be fabricating to have a plurality of contacts. A metal post may be formed on each of the plurality of contacts. A plurality of...
2017/0309548 SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
A semiconductor device includes a leadframe that includes contact pins and a semiconductor die that has protruding connection formations. A flexible support...
2017/0309547 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes preparing a lead frame that includes a die pad including a first plane and a second plane located on...
2017/0309546 LEAD FRAME SYSTEM
A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a partial thickness of the lead frame strip metal. A...
2017/0309545 POWER DISTRIBUTION BY A WORKING FLUID CONTAINED IN A CONDUIT
A system and method system for conveying power from a heat source is disclosed. The system includes a conduit constructed of a heat conducting material. The...
2017/0309544 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes an insulating substrate, a semiconductor...
2017/0309543 HEAT DISSIPATION SHEET
Provided is a heat dissipation sheet with which, after effectively conducting heat from a heat-emitting electronic component in the in-plane direction or the...
2017/0309542 Heat Conduction Sheet, Heat Conduction Sheet Manufacture Method, Heat Radiation Member, and Semiconductor Device
A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon...
2017/0309541 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Disclosed is a semiconductor package including: a base substrate provided with at least one cavity and made of a metallic material; at least one semiconductor...
2017/0309540 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and...
2017/0309539 Control Device and Method for Monitoring a Function of a Semiconductor Component During the Operation Thereof...
A control device for monitoring a functioning of a semiconductor component during its operation may comprise an input interface configured for receiving a...
2017/0309538 UNDERFILL DISPENSING USING FUNNELS
Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill...
2017/0309537 SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE STRUCTURE HAVING THE PACKAGE SUBSTRATE, AND...
A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a...
2017/0309536 METHOD AND APPRATUS FOR SEMICONDUCTOR PACKAGING
A method of forming a package includes providing a die, which includes a substrate having a circuit, a first passivation layer on the substrate, a plurality of...
2017/0309535 SEMICONDUCTOR DEVICE
A semiconductor device includes: a semiconductor substrate having a main plane; a semiconductor element provided on the main plane of the semiconductor...
2017/0309534 FABRICATION METHOD OF ELECTRONIC MODULE
An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed...
2017/0309533 CERAMIC PACKAGE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC COMPONENT, AND MODULE
A method of manufacturing a ceramic package is provided. An electrically conductive paste is applied to an inside of the first hole and an inside of the second...
2017/0309532 CONTROLLABLE INTEGRATED CAPACITIVE DEVICE
An integrated circuit includes several metallization levels separated by an insulating region. A hollow housing whose walls comprise metallic portions is...
2017/0309531 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via...
2017/0309530 SEMICONDUCTOR DEVICES AND A METHOD OF DETECTING A CRACK
A semiconductor device including an electrical conductive sensor structure connected to a sensor circuit. At least a part of the electrical conductive sensor...
2017/0309529 SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES
Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus...
2017/0309528 DYNAMIC WAFER LEVELING/TILTING/SWIVELING DURING A CHEMICAL VAPOR DEPOSITION PROCESS
The implementations described herein generally relate to the dynamic, real-time control of the process spacing between a substrate support and a gas...
2017/0309527 FLIPPED VERTICAL FIELD-EFFECT-TRANSISTOR
Various embodiments disclose a method for fabricating vertical transistors. In one embodiment, a structure is formed comprising at least a first substrate, an...
2017/0309526 Method of Semiconductor Fabrication with Height Control Through Active Region Profile
A method includes forming trenches on a semiconductor substrate, thereby defining regions for forming semiconductor devices; extracting a profile of the...
2017/0309525 METHOD FOR PECVD OVERLAY IMPROVEMENT
The present disclosure generally relates to a method for performing semiconductor device fabrication, and more particularly, to improvements in lithographic...
2017/0309524 TEST STRUCTURES FOR MEASURING SILICON THICKNESS IN FULLY DEPLETED SILICON-ON-INSULATOR TECHNOLOGIES
Described are test structures and methods for measuring silicon thickness in fully depleted silicon-on-insulator technologies.
2017/0309523 FAN-OUT PANEL LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with...
2017/0309522 METHODS FOR FORMING FIN STRUCTURES
A method includes providing a substrate having a first and a second plurality of fins with a first at least one dielectric material disposed thereon, removing...
2017/0309521 METHODS FOR FORMING GERMANIUM AND SILICON GERMANIUM NANOWIRE DEVICES
A method for forming nanowire semiconductor devices includes a) providing a substrate including an oxide layer defining vias; and b) depositing nanowires in...
2017/0309520 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating semiconductor device is disclosed. First, a substrate is provided, and a first metal gate and a second metal gate are formed on the...
2017/0309519 DISTINCT GATE STACKS FOR III-V-BASED CMOS CIRCUITS COMPRISING A CHANNEL CAP
Semiconductor devices and methods of forming the same include forming a first channel region on a first semiconductor region. A second channel region is formed...
2017/0309518 Structures and Methods for Reliable Packages
A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive...
2017/0309517 Method for Forming a Semiconductor Device and a Semiconductor Device
In certain embodiments, a semiconductor device includes a plurality of semiconductor chips. Each semiconductor chip comprises a semiconductor body having a...
2017/0309516 METHOD OF FORMING A WRAP-AROUND CONTACT ON A SEMICONDUCTOR DEVICE
Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such...
2017/0309515 MICROWAVE ANNEAL TO IMPROVE CVD METAL GAP-FILL AND THROUGHPUT
An integrated circuit is fabricated by chemical vapor deposition or atomic layer deposition of a metal film to metal film.
2017/0309514 OXIDIZING TREATMENT OF ALUMINUM NITRIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
Thin AlN films are oxidatively treated in a plasma to form AlO and AlON films without causing damage to underlying layers of a partially fabricated...
2017/0309513 METHOD FOR IMPROVING ADHESION BETWEEN POROUS LOW K DIELECTRIC AND BARRIER LAYER
A semiconductor device includes a semiconductor substrate, a porous low-k dielectric layer, a copper interconnect structure in the porous low-k dielectric...
2017/0309512 Apparatus For Prevention Of Backside Deposition In A Spatial ALD Process Chamber
Susceptor assemblies comprising a susceptor with a support post are described. The susceptor has a body with a top surface and a bottom surface. The top...
2017/0309511 CHUCK FOR SUPPORTING A WAFER
According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may...
2017/0309510 ELECTROSTATIC CHUCK
According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate...
2017/0309509 HIGH TEMPERATURE CHUCK FOR PLASMA PROCESSING SYSTEMS
A wafer chuck assembly includes a puck, a shaft and a base. An insulating material defines a top surface of the puck, a heater element is embedded within the...
2017/0309508 INTERFACES AND DIE PACKAGES, AND APPARTUSES INCLUDING THE SAME
A memory device includes a memory die package including a plurality of memory dies, an interface device including an interface circuit, and a memory controller...
2017/0309507 COMPACT MANUFACTURING DEVICE, AND INTER-DEVICE TRANSPORT SYSTEM FOR PRODUCTION LINE
A compact manufacturing device to automatically transport a wafer transport container. The compact manufacturing device comprises a processing chamber and a...
2017/0309506 Conveyor Apparatus And Method For Transporting Leadframe
A conveyor apparatus for a leadframe includes a track defining a longitudinally extending passage through which the leadframe travels. A magnetic clamping...
2017/0309505 METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTION EFFECTIVENESS VIA COLOR SENSING
Disclosed are methods of preparing a semiconductor substrate having a metal seed layer for a subsequent electroplating operation. In some embodiments, the...
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