Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2017/0345845 ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
An array substrate, and a display panel and display device including the same are disclosed. An embodiment of the array substrate comprises a display region...
2017/0345844 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Provided herein is a semiconductor device including N stacked groups (where N is a natural number greater than or equal to two) sequentially stacked over a...
2017/0345843 VERTICAL MEMORY DEVICES
A vertical memory device includes a plurality of stacked structures, at least one inter-structure layer, and a channel structure. The plurality of stacked...
2017/0345842 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate, an element isolation film, and a fin having side surfaces facing each other in a first direction of...
2017/0345841 NVM MEMORY HKMG INTEGRATION TECHNOLOGY
The present disclosure relates to a method of forming an integrated circuit (IC). In some embodiments, a substrate is provided comprising a memory region and a...
2017/0345840 Method Of Integrating FINFET CMOS Devices With Embedded Nonvolatile Memory Cells
A method of forming a memory device with memory cells over a planar substrate surface and FinFET logic devices over fin shaped substrate surface portions,...
2017/0345839 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes channel layers arranged in a first direction and a second direction intersecting the first direction; stacked insulating layers...
2017/0345838 NON-VOLATILE MEMORY DEVICE
According to one embodiment, a non-volatile memory device includes electrodes, an interlayer insulating film, at least one semiconductor layer, conductive...
2017/0345837 SEMICONDUCTOR MEMORY DEVICE
A semiconductor device according to an embodiment includes two semiconductor pillars, a connection member connected between the two semiconductor pillars, and...
2017/0345836 Method for Forming a PN Junction and Associated Semiconductor Device
A method can be used to make a semiconductor device. A number of projecting regions are formed over a first semiconductor layer that has a first conductivity...
2017/0345835 SELF-ALIGNED FLASH MEMORY DEVICE
The present disclosure relates to an improved integrated circuit having an embedded flash memory device with a word line having its height reduced, and...
2017/0345834 SOI MEMORY DEVICE
A method of manufacturing a semiconductor device is provided including providing a silicon-on-insulator substrate comprising a semiconductor bulk substrate, a...
2017/0345833 METHOD OF MANUFACTURING AND OPERATING A NON-VOLATILE MEMORY CELL
A memory device includes a capacitor, a tunneling-enhanced device, and a transistor. In accordance with an embodiment, capacitor has first and second...
2017/0345832 NVM Memory HKMG Integration Technology
The present disclosure relates to an integrated circuit (IC) that includes a HKMG hybrid non-volatile memory (NVM) device and that provides small scale and...
2017/0345831 Ferroelectric Devices and Methods of Forming Ferroelectric Devices
Some embodiments include a ferroelectric device comprising ferroelectric material adjacent an electrode. The device includes a semiconductor ...
2017/0345830 LOW POWER EMBEDDED ONE-TIME PROGRAMMABLE (OTP) STRUCTURES
Devices and methods for forming a device are presented. The method includes providing a substrate prepared with at least a first region for accommodating an...
2017/0345829 HIGH DENSITY PROGRAMMABLE E-FUSE CO-INTEGRATED WITH VERTICAL FETS
A method for integrating vertical transistors and electric fuses includes forming fins through a dielectric layer and a dummy gate stack on a substrate;...
2017/0345828 Non-volatile memory and method for programming and reading a memory array having the same
A non-volatile memory (NVM) includes a fin structure, a first fin field effect transistor (FinFET), a second FinFET, an antifuse structure, a third FinFET, and...
2017/0345827 Double Metal Layout for Memory Cells of a Non-Volatile Memory
A non-volatile memory having a double metal layout is provided that includes a first fuse fabricated on a first conductive layer of the integrated circuit, a...
2017/0345826 METHOD FOR PRODUCING PILLAR-SHAPED SEMICONDUCTOR MEMORY DEVICE
A method for producing a pillar-shaped semiconductor memory device includes forming a mask on a semiconductor substrate and etching to form a semiconductor...
2017/0345825 SEMICONDUCTOR DEVICES INCLUDING A DUMMY GATE STRUCTURE ON A FIN
Semiconductor devices including a dummy gate structure on a fin are provided. A semiconductor device includes a fin protruding from a substrate. The...
2017/0345824 Methods of Fabricating Semiconductor Devices
A method of fabricating a semiconductor device includes forming an interlayer insulating structure on a substrate, forming a contact hole that penetrates the...
2017/0345823 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
An electronic device includes a semiconductor memory. The semiconductor memory may include a semiconductor substrate having an isolation trench in a first...
2017/0345822 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
Semiconductor devices may include a substrate, gate electrodes on the substrate, and source/drain regions at both sides of each of the gate electrodes. Each of...
2017/0345821 HIGH SPEED SEMICONDUCTOR DEVICE
A semiconductor device includes a fin extending from a substrate, a first source/drain feature, a second source/drain feature, and a gate structure on the fin....
2017/0345820 Metal Gate Isolation Structure and Method Forming Same
A device includes a gate isolation plug, which further includes a U-shaped layer having a bottom portion and two sidewall portions, and an inner region...
2017/0345819 SEMICONDUCTOR DEVICE HAVING GATE STRUCTURE WITH REDUCED THRESHOLD VOLTAGE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device is provided, including: a substrate having a first area and a second area; several first gate structures formed at the first area, and...
2017/0345818 Semiconductor Devices with Trench Gate Structures in a Semiconductor Body with Hexagonal Crystal Lattice
A semiconductor device includes trench gate structures in a semiconductor body with hexagonal crystal lattice. A mean surface plane of a first surface is...
2017/0345817 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR MODULE
A semiconductor device of the present invention achieves improved avoidance of a parasitic operation in a circuit region while achieving miniaturization of the...
2017/0345816 DECOUPLING CAPACITOR
A device includes a plurality of active areas, a plurality of gates, and a plurality of conductors. The active areas are elongated in a first direction. The...
2017/0345815 THIN-FILM DEVICE
A thin-film device is provided with high reliability that prevents breakage of a thin-film resistance element due to stress caused by expansion of a resin...
2017/0345814 SEMICONDUCTOR DEVICE
According to one embodiment, an electrostatic discharge semiconductor device includes one or more wiring layers first disposed over a substrate, including: a...
2017/0345813 LOW DYNAMIC RESISTANCE LOW CAPACITANCE DIODES
A low dynamic resistance, low capacitance diode of a semiconductor device includes a heavily-doped n-type substrate. A lightly-doped n-type layer 1 micron to 5...
2017/0345812 THROUGH VIA EXTENDING THROUGH A GROUP III-V LAYER
A process for manufacturing an integrated circuit (IC) with a through via extending through a group III-V layer to a diode is provided. An etch is performed...
2017/0345811 METHOD FOR MANUFACTURING ESD PROTECTION DEVICE
Disclosed is a method for manufacturing an ESD protection device. The method comprises: forming a first buried layer on the semiconductor substrate; forming a...
2017/0345810 Semiconductor Devices With Cells Comprising Routing Resources
A cell comprising at least one diffusion region and a plurality of interconnection conductive patterns located over the at least one diffusion layer and...
2017/0345809 CIRCUIT WITH COMBINED CELLS AND METHOD FOR MANUFACTURING THE SAME
In some embodiments, a first cell layout and a second cell layout are provided and combined into a third cell layout. Each of the first cell layout and the...
2017/0345808 ELECTRIC POWER CONVERSION CIRCUIT INCLUDING SWITCHES AND BOOTSTRAP CIRCUITS, AND ELECTRIC POWER TRANSMISSION...
An electric power conversion circuit includes: first and second input terminals; first and second output terminals; first and third switches connected to the...
2017/0345807 Multi-Stack Package-on-Package Structures
A package includes a first device die, and a first encapsulating material encapsulating the first device die therein. A bottom surface of the first device die...
2017/0345806 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes a first substrate, an insulation layer, and a first electrode. The first substrate contains a first semiconductor material. The...
2017/0345805 PACKAGE INCLUDING STACKED DIE AND PASSIVE COMPONENT
Disclosed herein is an electronic device including a substrate having a conductive area formed thereon. A first molding level is stacked on the substrate. A...
2017/0345804 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
The present disclosure provides a method of manufacturing a structure. The method comprises: providing a substrate; forming an interconnect layer over the...
2017/0345803 MODULE STACKING MECHANISM WITH INTEGRATED GROUND
Printed circuit board (PCB) structures and methods of assembling them are described herein. In some embodiments, a PCB structure may include a first mounting...
2017/0345802 DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF
The present disclosure relates to a display device using a semiconductor light emitting device and a fabrication method thereof. A display device may include a...
2017/0345801 DISPLAY APPARATUS AND FABRICATING METHOD THEREOF
A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first...
2017/0345800 LED MODULE
An LED module includes: a substrate having a main surface and a back surface which face in opposite directions from each other in a thickness direction; a...
2017/0345799 POWER MODULE
A power module may include a first bus bar having a first plurality of tabs, wherein each of the first plurality of tabs is electrically coupled to a...
2017/0345798 SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A semiconductor structure includes: a first semiconductor workpiece; a second semiconductor workpiece, bonded to a first surface of the first semiconductor...
2017/0345797 SEMICONDUCTOR ADHESIVE, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor adhesive used for sealing connection portions of a semiconductor device, wherein: in the semiconductor device, the connection portion of a...
2017/0345796 ELECTRONIC DEVICE WITH STACKED ELECTRONIC CHIPS
An electronic device includes a carrier substrate, a first electronic chip and a second chip. The first chip is mounted on the carrier substrate via interposed...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.