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Patent # Description
2017/0345744 EXPOSED SOLDERABLE HEAT SPREADER FOR FLIPCHIP PACKAGES
A flipchip may include: a silicon die having a circuit side with solder bumps and a non-circuit side; a leadframe attached to the solder bumps on the circuit...
2017/0345743 LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJACENT VERTICAL LEADFRAME COLUMNS
A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad...
2017/0345742 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A lead frame includes a plurality of circuit patterns which each have a die pad and an electrode terminal portion and are disposed in a band shape, a tie bar,...
2017/0345741 INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
An integrated fan-out package is described. The integrated fan-out package comprises a first die and a second die arranged adjacent to each other. A molding...
2017/0345740 SEMICONDUCTOR PACKAGE, SMART CARD AND METHOD FOR PRODUCING A SEMICONDUCTOR PACKAGE
A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of...
2017/0345739 ADVANCED THROUGH SUBSTRATE VIA METALLIZATION IN THREE DIMENSIONAL SEMICONDUCTOR INTEGRATION
An advanced through silicon via structure for is described. The device includes a substrate including integrated circuit devices. A high aspect ratio through...
2017/0345738 ADVANCED THROUGH SUBSTRATE VIA METALLIZATION IN THREE DIMENSIONAL SEMICONDUCTOR INTEGRATION
A method providing a high aspect ratio through substrate via in a substrate is described. The through substrate via has vertical sidewalls and a horizontal...
2017/0345737 ADVANCED THROUGH SUBSTRATE VIA METALLIZATION IN THREE DIMENSIONAL SEMICONDUCTOR INTEGRATION
A method providing a high aspect ratio through substrate via in a substrate is described. The through substrate via has vertical sidewalls and a horizontal...
2017/0345736 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
A semiconductor device includes: a semiconductor element; a heat radiator body having a housing recess wherein a bottom surface of the housing recess is...
2017/0345735 PLUG-IN TYPE POWER MODULE AND SUBSYSTEM THEREOF
A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of...
2017/0345734 Thermally Conductive Sheet
The thermally conductive sheet includes a sheet-like formed body produced by curing a mixed composition containing an uncured polymer matrix, a flat graphite...
2017/0345733 POWER MODULE
A power module includes a connection terminal for external connection, the connection terminal protruding from the side surface of a package, and a dummy...
2017/0345732 3DIC Packaging with Hot Spot Thermal Management Features
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and...
2017/0345731 SENSOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure....
2017/0345730 RESIN COMPOSITION FOR ENCAPSULATING, MANUFACTURING METHOD OF ON-VEHICLE ELECTRONIC CONTROL UNIT, AND ON-VEHICLE...
Provided is a resin composition for encapsulating which is used for forming an encapsulating resin of an on-vehicle electronic control unit including a wiring...
2017/0345729 SEMICONDUCTOR MODULE
It is an object of the present invention to provide a semiconductor module that reduces an excessive stress on a sealed object due to the expansion and...
2017/0345728 FLOW METERING FOR DISPENSE MONITORING AND CONTROL
Methods and systems of accurately dispensing a viscous fluid onto a substrate. In an embodiment, a method includes using an electronic flow meter device to...
2017/0345727 DEPOSITION SUPPORTING SYSTEM, DEPOSITING APPARATUS AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
According to one embodiment, deposition supporting system, depositing apparatus and manufacturing method of a semiconductor device includes a depositing...
2017/0345726 Testing, Manufacturing, and Packaging Methods for Semiconductor Devices
Methods of testing, manufacturing, and packaging semiconductor devices are disclosed. In some embodiments, a method of testing a semiconductor device includes...
2017/0345725 METHOD OF EXTRACTING DEFECTS
A method provides a design layout having a pattern of features. The design layout is transferred onto a substrate on a semiconductor substrate using a mask. A...
2017/0345724 METHOD FOR THE FORMATION OF TRANSISTORS PDSO1 AND FDSO1 ON A SAME SUBSTRATE
The present invention relates to a method for forming an electronic device intended to accommodate at least one fully depleted transistor of the FDSOI type and...
2017/0345723 HIGH-K METAL GATE DEVICE AND MANUFATURING METHOD THEREOF
A high-k metal gate device and manufacturing method thereof are provided in the present invention. The method uses a silicon material layer as a battier layer...
2017/0345722 HIGH-K METAL GATE DEVICE AND MANUFATURING METHOD THEREOF
A high-k metal gate device and manufacturing method thereof are provided in the present invention. The method uses a silicon material layer as a battier layer...
2017/0345721 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a gate stack...
2017/0345720 METHOD AND APPARATUS FOR CONTROLLING VOLTAGE OF DOPED WELL IN SUBSTRATE
A method for controlling voltage of a doped well in a substrate is provided. The substrate and the doped well are in different conductive type. The method...
2017/0345719 MODULATION OF THE MORPHOLOGY OF EPITAXIAL SEMICONDUCTOR MATERIAL
Chip structures and fabrication methods for forming such chip structures. A first device structure has a structural feature comprised of a first dielectric...
2017/0345718 STACKED FILM, ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF FABRICATING STACKED FILM
A stacked film is a stacked film including an oxide film, and a metal film provided on the oxide film, in which the oxide film includes a ZrO.sub.2 film of...
2017/0345717 Methods for Forming a Semiconductor Device and Semiconductor Devices
A method for forming a semiconductor device includes forming a laser marking buried within a semiconductor substrate and thinning the semiconductor substrate...
2017/0345716 Method of Separating Semiconductor Dies from a Semiconductor Substrate, Semiconductor Substrate Assembly and...
Separation grooves are etched from a main surface into a semiconductor substrate. The separation grooves separate chip regions in horizontal directions...
2017/0345715 ELEMENT CHIP MANUFACTURING METHOD
An element chip manufacturing method includes a preparation process of preparing a substrate which includes a first surface provided with a bump and a second...
2017/0345714 CHIP CARRIERS AND SEMICONDUCTOR DEVICES INCLUDING REDISTRIBUTION STRUCTURES WITH IMPROVED THERMAL AND...
A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a...
2017/0345713 SEMICONDUCTOR CHIPS HAVING THROUGH SILICON VIAS AND RELATED FABRICATION METHODS AND SEMICONDUCTOR PACKAGES
A semiconductor chip including through silicon vias (TSVs), wherein the TSVs may be prevented from bending and the method of fabricating the semiconductor chip...
2017/0345712 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming first and second pattern structures on first and second regions of a substrate, respectively,...
2017/0345711 Semiconductor Devices and Methods for Forming a Semiconductor Device
A method for forming a semiconductor device includes forming an insulating material layer above a semiconductor substrate and modifying at least a portion of a...
2017/0345710 METHOD OF FORMING PATTERN OF SEMICONDUCTOR DEVICE
A method of forming a pattern of a semiconductor device includes: forming a first mask pattern comprising first mask lines extending in a first direction in a...
2017/0345709 METHODS OF FORMING SEMICONDUCTOR STRUCTURES
The present disclosure relates to a process for the manufacture of a high resistivity semiconductor substrate, comprising the following stages: providing a...
2017/0345708 Semiconductor Packaging Structure and Process
A method and structure for packaging a semiconductor device are provided. In an embodiment a first substrate is bonded to a second substrate, which is bonded...
2017/0345707 FOUNDRY-AGNOSTIC POST-PROCESSING METHOD FOR A WAFER
A foundry-agnostic post-processing method for a wafer is provided. The wafer includes an active surface, a substrate and an intermediate layer interposed...
2017/0345706 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a substrate, a gate structure disposed over the substrate, a dielectric material disposed over the substrate and the gate...
2017/0345705 Reducing Neighboring Word Line In Interference Using Low-K Oxide
Techniques for fabricating a memory device which has reduced neighboring word line interference, and a corresponding memory device. The memory device comprises...
2017/0345704 WAFER TRAY
A wafer tray includes a tray main body and a plurality of wafer guides. The tray main body includes a major surface having a first diameter. A wafer placing...
2017/0345703 System and Method for Performing Spin Dry Etching
A spin dry etching process includes loading an object into a dry etching system. A dry etching process is performed to the object, and the object is spun while...
2017/0345702 SUBSTRATE HOLDING DEVICE AND METHOD OF MANUFACTURING THE SAME
A substrate holding device includes a base body that has a flat plate-like shape and that includes gas passages that open in an upper surface of the base body,...
2017/0345701 SUBSTRATE HOLDING DEVICE
A substrate holding device includes a base body that has a flat plate-like shape and in which gas holes that open in an upper surface of the base body are...
2017/0345700 VACUUM CLAMPING DEVICE FOR GRIPPING WORKPIECES
The present invention among other things relates to a vacuum clamping device for clamping of workpieces, in particular for clamping of flat substrates, with a...
2017/0345699 SUPPORTING GLASS SUBSTRATE AND MANUFACTURING METHOD THEREFOR
A technical object of the present invention is to devise a supporting glass substrate suitable for supporting a substrate to be processed to be subjected to...
2017/0345698 ELECTROSTATIC CHUCK IMPEDANCE EVALUATION
A support assembly for a semiconductor processing chamber is provided and includes a body comprising a heater, and a puck coupled to the body, the puck...
2017/0345697 DEVICE FOR TREATING SUBSTRATES
A device treats substrates with a liquid, which device has a conveying device by which the substrates can be conveyed in a conveying direction through a...
2017/0345696 WAFER PROCESSING DEVICE AND METHOD THEREFOR
Disclosed in this invention is a wafer processing apparatus and method for pre-alignment and edge exposure of a wafer. The wafer processing apparatus includes...
2017/0345695 APPARATUS AND METHOD FOR OPERATING MACHINERY UNDER UNIFORMLY DISTRIBUTED MECHANICAL PRESSURE
A method of certifying uniform distribution of mechanical pressure comprises an apparatus for moving an object, the apparatus including an arm (410) with a...
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