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Patent # Description
2017/0345694 METHOD FOR PRODUCING CRYSTAL SUBSTRATE
A method for producing a crystal substrate includes preparing, measuring, holding, and machining. The preparing prepares a crystal substrate body including a...
2017/0345693 VISUAL FEEDBACK FOR PROCESS CONTROL IN RTP CHAMBERS
Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP...
2017/0345692 PICKUP AND PLACING DEVICE AND OPERATION METHOD OF PICKING AND PLACING BY PICKUP AND PLACING DEVICE
The current disclosure provides a pickup and placing device including a control element, a substrate and a pickup structure. The substrate has an upper surface...
2017/0345691 SUBSTRATE SUPPORT ASSEMBLY
An electrostatic chuck comprises a ceramic body having a first surface and a second surface that is on an opposite side of the ceramic body to the first...
2017/0345690 METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES
A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area,...
2017/0345689 LIQUID PROCESSING APPARATUS
A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region...
2017/0345688 APPARATUS AND METHOD FOR TREATING SUBSTRATE
Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treating unit that...
2017/0345687 UNIT FOR SUPPLYING FLUID, APPARATUS AND METHOD FOR TREATING SUBSTRATE WITH THE UNIT
Provided is an apparatus and method for supplying a fluid. The substrate treating apparatus comprises a treating unit for treating a substrate and a fluid...
2017/0345686 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
Disclosed are a liquid treating apparatus and a liquid treating method. The liquid treating apparatus includes a chamber that provides a space for processing a...
2017/0345685 SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND MEMORY MEDIUM
A substrate cleaning method includes supplying, onto a substrate, a film-forming processing liquid including a volatile component and a polar organic material...
2017/0345684 METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES
An apparatus for processing wafer-shaped articles comprises a rotary chuck adapted to hold a wafer shaped article thereon. The rotary chuck comprises a...
2017/0345682 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally while rotating the substrate around a vertical...
2017/0345681 METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
An apparatus for processing wafer-shaped articles comprises a rotary chuck and a heating assembly that faces a wafer-shaped article when positioned on the...
2017/0345680 TRANSFER UNIT, AND APPARATUS AND METHOD FOR TREATING SUBSTRATE
Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treatment chamber that...
2017/0345679 METHODS OF FABRICATING A SEMICONDUCTOR DEVICE
Methods of fabricating a semiconductor device are provided. The methods may include forming a lower mold layer on a substrate that includes first and second...
2017/0345678 INTEGRATED CIRCUIT PACKAGE CONFIGURATIONS TO REDUCE STIFFNESS
Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a die having a first side and a second side disposed...
2017/0345677 Substrate Pad Structure
A device includes a plurality of first pads in a package substrate, wherein at least one first pad is of a first elongated shape, a plurality of vias in a...
2017/0345676 WAFER LEVEL PACKAGING USING A TRANSFERABLE STRUCTURE
According to various aspects and embodiments, a system and method for packaging an electronic device is disclosed. One example of the method comprises...
2017/0345675 PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
Some embodiments contemplate methods for forming a package structure and a package structure formed thereby. An embodiment method includes depositing a...
2017/0345674 METHOD OF SELECTIVE SILICON NITRIDE ETCHING
Embodiments of the invention provide a substrate processing method for selective SiN etching relative to other layers used in semiconductor manufacturing....
2017/0345673 METHOD OF SELECTIVE SILICON OXIDE ETCHING
Embodiments of the invention provide a substrate processing method for selective SiO.sub.2 etching relative to other layers used in semiconductor...
2017/0345672 SURFACE TREATMENT METHOD FOR SiC SUBSTRATE
Provided is a surface treatment method for a SiC substrate (40), the method being capable of controlling whether to generate a step bunching or the type of...
2017/0345671 METHOD OF SIDEWALL IMAGE TRANSFER
According to one embodiment, a substrate processing method includes providing a substrate containing Si raised features, depositing a conformal film on the Si...
2017/0345670 METHODS FOR IMPROVED CRITICAL DIMENSION UNIFORMITY IN A SEMICONDUCTOR DEVICE FABRICATION PROCESS
Exemplary methods of patterning a device layer are described, including operations of patterning a protector layer and forming a first opening in a first...
2017/0345669 HARD-MASK COMPOSITION
Disclosed and claimed herein is a composition for forming a spin-on hard-mask, having a fullerene derivative and a crosslinking agent. Further disclosed is a...
2017/0345668 DISC-SHAPED HEATER AND HEATER-COOLING-PLATE ASSEMBLY
An electrostatic chuck heater 10 includes a disc-shaped ceramic base 30 and a plurality of heating elements 20 embedded in the ceramic base 30. A top surface...
2017/0345667 METHOD OF SILICON EXTRACTION USING A HYDROGEN PLASMA
A method of silicon extraction using a hydrogen plasma has been disclosed in various embodiments. The substrate processing method includes providing a...
2017/0345666 PLASMA PROCESSING METHOD
Disclosed is a plasma processing method for processing a workpiece that includes: a silicon-containing etching target layer, an organic film provided on the...
2017/0345665 ATOMIC LAYER ETCHING SYSTEMS AND METHODS
A processing apparatus includes a processing chamber having a substrate holder; a first gas delivery system configured to deliver a first source gas within the...
2017/0345664 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
A plasma processing apparatus includes a microwave generation unit configured to generate a microwave, a processing vessel configured to introduce the...
2017/0345663 METHOD FOR MANUFACTURING A BONDED SOI WAFER
Method for manufacturing a bonded SOI wafer by bonding a bond wafer and base wafer, each composed of a silicon single crystal, via an insulator film, including...
2017/0345662 METHOD FOR POLISHING SILICON WAFER
The present invention is method for polishing silicon wafer, the method including recovering used slurry containing polishing abrasive grains that have been...
2017/0345661 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
A semiconductor device includes: a first semiconductor layer formed, on a substrate, of a nitride semiconductor; a second semiconductor layer formed, on the...
2017/0345660 LDMOS TRANSISTOR, ESD DEVICE, AND FABRICATION METHOD THEREOF
A method is provided for fabricating an LDMOS transistor. The method includes providing a base substrate. The method also includes forming a first well area...
2017/0345659 MATERIAL REMOVAL PROCESS FOR SELF-ALIGNED CONTACTS
A method is disclosed of removing a first material disposed over a second material adjacent to a field effect transistor gate having a gate sidewall layer that...
2017/0345658 METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER AND SIC EPITAXIAL GROWTH APPARATUS
A method for manufacturing a SiC epitaxial wafer according to one aspect of the present invention includes separately introducing, into a reaction space for...
2017/0345657 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, DRIVING DEVICE, VEHICLE,...
A semiconductor device according to an embodiment includes a silicon carbide layer, a gate electrode, and a silicon oxide layer disposed between the silicon...
2017/0345656 FABRICATION OF SEMICONDUCTOR FIN STRUCTURES
A semiconductor substrate is a provided and an insulating layer is formed thereon. A cavity structure is formed above the insulating layer, including a lateral...
2017/0345655 METHOD FOR PRODUCING PATTERNS
A method for producing patterns in a layer to be etched, from a stack including at least the layer to be etched and a masking layer overlying the layer to be...
2017/0345654 FABRICATION OF COMPOUND SEMICONDUCTOR STRUCTURES
A semiconductor substrate, comprising a first semiconductor material, is provided and an insulating layer is formed thereon; an opening is formed in the...
2017/0345653 OXIDE SINTERED BODY, SPUTTERING TARGET, AND OXIDE SEMICONDUCTOR THIN FILM OBTAINED USING SPUTTERING TARGET
Provided are an oxide sintered compact whereby low carrier density and high carrier mobility are obtained when the oxide sintered compact is used to obtain an...
2017/0345652 ELECTRONIC DEVICE WITH A WIRE ELEMENT EXTENDING FROM AN ELECTROCONDUCTIVE LAYER COMPRISING ZIRCONIUM CARBIDE OR...
The electronic device comprises a substrate (1), at least one semiconductor wire element (2) formed by a nitride of a group III material and an...
2017/0345651 METHOD FOR PRODUCING A LAYER SYSTEM FOR THIN-FILM SOLAR CELLS HAVING A SODIUM INDIUM SULFIDE BUFFER LAYER
A method for producing a layer system for thin-film solar cells is described, wherein a) an absorber layer is produced, and b) a buffer layer is produced on...
2017/0345650 Fabrication of M-plane Gallium Nitride
The present disclosure provides a fabrication of M-plane gallium nitride which is able to grow M-plane gallium nitride without the need of expensive...
2017/0345649 PROCESSING CHAMBER WITH IRRADIANCE CURING LENS
Embodiments disclosed herein relate to a processing chamber having a lens disposed therein. In one embodiment, the processing chamber includes a chamber body,...
2017/0345648 SURFACE MODIFYING MATERIAL FOR SEMICONDUCTOR DEVICE FABRICATION
Methods and materials for making a semiconductor device are described. The method includes forming a surface preparation layer over the semiconductor...
2017/0345647 SUBSTRATE PROCESSING METHOD
Disclosed is a substrate processing method including gas injection including a source material containing silicon towards substrates received in a reaction...
2017/0345646 SINGLE-CRYSTAL RARE EARTH OXIDE GROWN ON III-V COMPOUND
A substrate with a (001) orientation is provided. A gallium arsenide (GaAs) layer is epitaxially grown on the substrate. The GaAs layer has a reconstruction...
2017/0345645 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
A method of manufacturing a semiconductor device, includes forming a film containing a predetermined element on a substrate by supplying a precursor containing...
2017/0345644 CARBON FILM FORMING METHOD, CARBON FILM FORMING APPARATUS, AND STORAGE MEDIUM
There is provided a method of forming a carbon film on a workpiece, which includes: loading the workpiece into a process chamber; supplying a gas containing a...
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