Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2017/0354075 Hibiscus Plant Named 'DUP-CMIP'
A new and distinct cultivar of hibiscus plant named `DUP-CMIP`, characterized by compact growth with internode distance reduced with respect to standard exotic...
2017/0354074 Magnolia plant named 'Melissa Parris'
A new and distinct Magnolia cultivar named `Melissa Parris` is disclosed, characterized by having pleasantly scented pink flowers, a strong central leader, and...
2017/0354073 COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING SYSTEM
In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being...
2017/0354072 MODULE INSTALLATION ALIGNMENT DEVICE
A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to...
2017/0354071 ELECTRONIC COMPONENT SUPPLY APPARATUS, REEL APPARATUS, TAPE PROCESSING APPARATUS, AND METHOD FOR RESUPPLYING...
An electronic component supply apparatus (1) includes a reel apparatus (2) and a tape processing apparatus (3). The reel apparatus (2) has a tape reel (8) with...
2017/0354070 COMPONENT MOUNTING SYSTEM
A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component...
2017/0354069 ELECTRONIC COMPONENT SUPPLY SYSTEM
Provided is an electronic component supply system determining the types of electronic components installed on component pallets at a time when the electronic...
2017/0354068 COMPONENT PLACEMENT MACHINE AND COMPONENT PLACEMENT METHOD
A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the...
2017/0354067 POWER SYSTEM AND METHOD
A power system (1), typically for use in a data centre, which eliminates use of a changeover device when switching between power sources. The power system (1)...
2017/0354066 LIQUID IMMERSION COOLING APPARATUS, LIQUID IMMERSION COOLING SYSTEM, AND CONTROL METHOD OF LIQUID IMMERSION...
A liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the apparatus includes a liquid immersion tank that...
2017/0354065 Facility Including Externally Disposed Data Center Air Handling Units
Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing.
2017/0354064 MODULAR DATA CENTER FACILITY WITH COOLING MODULES
A modular housing encloses a data center and a modular cooling system. The modular cooling system includes a modular cooling pallet on which cooling modules...
2017/0354063 Data Center Cooling System
A data center cooling system configured to cool one or more components of a data center thereby enabling a data center to be maintained at a higher overall...
2017/0354061 ELECTRONIC APPARATUS COOLING SYSTEM
Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the...
2017/0354060 APPARATUS FOR COOLING ELECTRONIC CIRCUITRY
Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least...
2017/0354059 SYSTEMS AND METHODS FOR COOLING A COMPARTMENTALIZED AND DUCTED ELECTRICAL ENCLOSURE
In one embodiment, the system includes one or more electrical components associated with turbomachinery, and the one or more electrical components are disposed...
2017/0354058 SERVER COOLING SYSTEM WITHOUT THE USE OF VAPOR COMPRESSION REFRIGERATION
A system, method, and computer product for cooling a server center without the use of vapor compression refrigeration. An example embodiment involves using...
2017/0354057 Junction Box Thermal Management
An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base...
2017/0354056 POWER DISTRIBUTION UNIT WITH CORD STORAGE CARTRIDGE
Systems, methods, and devices are provided in which cord storage cartridges are removably connected to a power distribution unit (PDU). The cord storage...
2017/0354055 Quick Release Device for a Slide Track
A quick release device for a slide track includes a frame having an abutment section. A positioning seat is fixed to the frame and has a fixing section located...
2017/0354054 COMPONENT RACK FOR A DISPLAY
A component rack for a display that includes: a frame, that includes: a base, a first wall, and a second wall arranged to form a U-shaped cavity; and a...
2017/0354053 POWER DISTRIBUTION UNIT SYSTEM INCORPORATING SMART CABLES AND ADAPTERS
A power distribution unit including a plurality of outlet cores arranged along an outlet panel of a housing and mounted to one or more circuit boards with an...
2017/0354052 Assembly for Attaching and Connecting a Computer Data Storage Device to an On-Board Computer and Associated...
The present invention relates to an assembly (10) for attaching a data storage device (12) to an on-board computer including an encapsulation structure (17),...
2017/0354051 INTERLOCK BRACKET UNIT
An example bracket unit to control installation of an electronic module is provided herein. The bracket unit includes a bracket body, a bracket plate, and a...
2017/0354050 MODULAR HOUSING APPARATUS
Described herein are systems, modes, and methods for mounting one or more electronic housings to each other and to a rack mount system, a table mount system,...
2017/0354049 HERMETIC SEALING LID MEMBER, METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER, AND ELECTRONIC COMPONENT...
This hermetic sealing lid member (10) is made of a clad material (20) including a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22)...
2017/0354048 PLUGIN-POD FOR ELECTRONIC CONTROL UNIT
A ruggedized engine control module (ECU) system includes a plugin-pod, a connector configured to connect the plugin-pod to a connector of an ECU, and signal...
2017/0354047 CONTROLLER
A controller includes a control board, a transmitting board, a display board, and a USB board. A modular jack is arranged at a position on one surface of the...
2017/0354046 HEAD-UP DISPLAY AND OPERATION OF OPENING COVER THEREOF
A head-up display includes a transmission mechanism, a first cover, a second cover and a driver. The first cover is connected to the transmission mechanism and...
2017/0354045 ELECTRONIC DEVICE HOUSING AND DISASSEMBLY FIXTURE THEREOF
An electronic device housing is provided, which may include a front cover and a back cover. The front cover may include at least two flexible hooks and at...
2017/0354044 METHOD FOR MANUFACTURING WIRING BOARD
A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including...
2017/0354043 HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE
A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically...
2017/0354042 Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Using Solder Transfer Sheet
Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer...
2017/0354041 METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND MOUNTING SUBSTRATE MANUFACTURING APPARATUS
A method of manufacturing a mounting substrate includes a provisional pressing process, a driver pressing process, and a flexible printed circuit board...
2017/0354040 PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS
Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned...
2017/0354039 Encapsulated Circuit Module, And Production Method Therefor
To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual...
2017/0354038 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRINTED BOARD AND MANUFACTURING METHOD OF THE SEMICONDUCTOR INTEGRATED...
A semiconductor integrated circuit device (101) includes a component built-in board (21) in which at least a first core layer (Co21) on which a first...
2017/0354037 CIRCUIT ASSEMBLY AND METHOD FOR MANUFACTURING SAME
Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to...
2017/0354036 Electronic Assembly and Method for the Production thereof
The disclosure provides an electronic assembly that includes: a carrier element, a circuit carrier having a number of electronic components, a circuit board,...
2017/0354035 FLEXIBLE PRINTED CIRCUIT BOARD
There is provided a flexible printed circuit board. The flexible printed circuit board includes: a flexible insulation layer having a first surface and a...
2017/0354034 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the...
2017/0354033 RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD
A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with...
2017/0354032 HALOGEN-FREE AND PHOSPHORUS-FREE SILICONE RESIN COMPOSITION, PREPREG, LAMINATE BOARD, COPPER-CLAD PLATE USING...
Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon...
2017/0354031 TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING
An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor...
2017/0354030 HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE AND METHOD FOR SAME
A high frequency signal transmission structure includes an insulating sheet and a conductive wiring layer forming on the insulating sheet. The conductive...
2017/0354029 METHOD FOR MAKING AN INTERACTIVE INFORMATION DEVICE AND PRODUCT PRODUCED THEREBY
A method and product produced by the method for forming an interactive information device with a conductively coated panel includes forming a reduced contrast...
2017/0354028 BAND PASS FILTER-BASED GALVANIC ISOLATOR
A galvanic isolator includes a multi-layer printed circuit board (PCB) including a dielectric material having a top side and a bottom side. An RF transmission...
2017/0354027 INFORMATION PROCESSING APPARATUS
Provided is an information processing apparatus that enables acquisition, manipulation and the like of information through unauthorized access to be prevented...
2017/0354026 FLEX-LESS MULTILAYER CERAMIC SUBSTRATE
In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through...
2017/0354025 TORCHES AND METHODS OF USING THEM
Certain embodiments described herein are directed to a torch that includes a suitable amount of a refractory material. In some embodiments, the torch can...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.