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Patent # Description
2017/0373123 ORGANIC ELECTROLUMINESCENCE DEVICE AND METHOD FOR PRODUCING THE SAME
The present disclosure provides an organic electroluminescence device. It includes a substrate; an array of TFTs provided on the substrate; an organic...
2017/0373122 MICRO LIGHT-EMITTING DIODE DISPLAY PANEL
The invention provides a micro LED display panel, by disposing a plurality of active areas (2) on the substrate (1) arranged in an array, and a plurality of...
2017/0373121 FLEXIBLE DISPLAY PANEL AND FLEXIBLE DISPLAY DEVICE
A flexible display panel and a flexible display device are provided. The flexible display panel comprises a display region and a non-display region surrounding...
2017/0373120 PHASE-CHANGE MEMORY CELL, AND METHOD FOR MANUFACTURING THE PHASE-CHANGE MEMORY CELL
A phase-change memory cell, comprising: a substrate housing a transistor, for selection of the memory cell, that includes a first conduction electrode; a first...
2017/0373119 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor memory device according to an embodiment comprises: a semiconductor substrate extending in a first direction and a second direction, the first...
2017/0373118 OPTOELECTRONIC DEVICE WITH LIGHT-EMITTING DIODES
An optoelectronic device including a substrate with first and second opposite surfaces; and electrical insulation side elements extending from the first...
2017/0373117 Deep Trench Isolations and Methods of Forming the Same
A method includes performing an anisotropic etching on a semiconductor substrate to form a trench. The trench has vertical sidewalls and a rounded bottom...
2017/0373116 Image Sensor Device and Method
A system and method for reducing cross-talk between photosensitive diodes is provided. In an embodiment a first color filter is formed over a first ...
2017/0373115 RADIATION SENSOR
The present disclosure relates to a radiation sensor. In one implementation, the sensor may include a radiation detector array having a plurality of pixels; at...
2017/0373114 Stacked Semiconductor Chip RGBZ Sensor
An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The...
2017/0373112 METHOD OF MANUFACTURING SEMICONDUCTOR UNIT AND THE SEMICONDUCTOR UNIT
In a solid-state imaging device including a plurality of pixels each pixel including a plurality of photodiodes, it is prevented that an incidence angle of...
2017/0373111 PHOTOSENSOR SUBSTRATE AND METHOD OF PRODUCING THE SAME
A photosensor substrate (10) includes a plurality of sensor units (1). The sensor units (1) each include a switching element (2), a lower electrode (3)...
2017/0373110 MONOLITHIC CMOS INTEGRATED PIXEL DETECTOR, AND SYSTEMS AND METHODS FOR PARTICLE DETECTION AND IMAGING INCLUDING...
Monolithic pixel detectors, systems and methods for the detection and imaging of radiation in the form of energetic particles which may have a mass or be...
2017/0373109 RESONANT-FILTER IMAGE SENSOR AND ASSOCIATED FABRICATION METHOD
A resonant-filter image sensor includes a pixel array including a plurality of pixels and a microresonator layer above the pixel array. The microresonator...
2017/0373108 IMAGE SENSOR INCLUDING TRANSFER GATES IN DEEP TRENCHES
An image sensor is described. The image sensor includes a photodiode that is formed in a substrate, a floating diffusion region that vertically overlaps with a...
2017/0373107 SOLID-STATE IMAGE SENSING DEVICE AND ELECTRONIC DEVICE
The present technology relates to a solid-state image sensing device capable of restricting a deterioration in photoelectric conversion characteristic of a...
2017/0373106 Methods for Transferring Charge in an Image Sensor
Apparatuses and methods for charge transfer in image sensors are disclosed. One example of an image sensor pixel may include a first charge storage node and a...
2017/0373105 MULTI DIODE APERTURE SIMULATION
Provided are techniques for simulating a aperture in a digital imaging device, the aperture simulation generated by a multi-diode pixel image sensor. In one...
2017/0373104 SOLID-STATE IMAGING DEVICE AND METHOD FOR FABRICATING SAME
A solid-state imaging device includes a plurality of pixels two-dimensionally arrayed in a well region disposed on a semiconductor substrate, each pixel...
2017/0373103 SOLID-STATE IMAGING DEVICE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD
The present disclosure relates to a solid-state imaging device, an electronic apparatus, and a manufacturing method that are designed to further increase...
2017/0373102 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND DISPLAY DEVICE
An array substrate and manufacturing method thereof, display panel and display device. The manufacturing method of the array substrate includes: forming, on a...
2017/0373101 FFS MODE ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
An FFS mode array substrate and a manufacturing method thereof are provided. The FFS mode array substrate has: a second insulation layer deposited on a base...
2017/0373100 FLEXIBLE DISPLAY MOTHERBOARD AND MANUFACTURING METHOD OF FLEXIBLE DISPLAY PANEL
A flexible display motherboard and a manufacturing method thereof are provided. The flexible display motherboard includes a carrier substrate and a flexible...
2017/0373099 ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
Disclosed are an array substrate, a manufacturing method thereof, and a display device. The array substrate includes a gate insulating layer, an active layer,...
2017/0373098 THIN-FILM TRANSISTOR SUBSTRATE, THIN-FILM TRANSISTOR SUBSTRATE MANUFACTURING METHOD, AND LIQUID CRYSTAL DISPLAY
A thin-film transistor substrate constituting a liquid crystal display includes: a thin-film transistor including, a gate electrode, a gate insulating film...
2017/0373097 THIN-FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
A method is provided for manufacturing a thin film transistor array substrate, which includes: a substrate on which a thin film transistor and a storage...
2017/0373096 DISPLAY DEVICE
According to one embodiment, a display device includes a pixel, a scanning line, a signal line, a pixel electrode, a first switching element, and a capacitance...
2017/0373095 Array Substrate and Manufacturing Method Thereof, Display Panel and Display Device
A method for manufacturing an array substrate, including: forming a plurality of first metal layer patterns on a base substrate which are independent from each...
2017/0373094 THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS
A thin film transistor "TFT") substrate includes a substrate, an active layer over the substrate, and first and second TFTs over the substrate. The active...
2017/0373093 FLEXIBLE DISPLAY PANEL
A flexible display panel includes a bending area and a surrounding area adjacent to the bending area. The barrier layer includes first silicon nitride layers...
2017/0373092 LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
A retention circuit provided in a logic circuit enables power gating. The retention circuit includes a first terminal, a node, a capacitor, and first to third...
2017/0373091 THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF
A thin film transistor array panel according to an exemplary embodiment of the present invention includes: a substrate; a gate electrode on the substrate; a...
2017/0373090 STANDARD CELL ARCHITECTURE FOR DIFFUSION BASED ON FIN COUNT
Disclosed systems and methods pertain to finfet based integrated circuits designed with logic cell architectures which support multiple diffusion regions for...
2017/0373089 MEMORY DEVICE
A memory device includes a plurality of gate electrode layers stacked on a substrate, a plurality of channel layers penetrating the plurality of gate electrode...
2017/0373088 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device may include a first cell structure, a second cell structure, a pad structure, a circuit, and one or more openings. The pad structure may...
2017/0373087 OFFSET BACKSIDE CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY DEVICE
Die cracking of a three dimensional memory device may be reduced by adding offsets to backside contact via structures. Each backside contact via structure can...
2017/0373086 Amorphous Silicon Layer In Memory Device Which Reduces Neighboring Word Line Interference
Techniques for fabricating a memory device which has reduced neighboring word line interference, and a corresponding memory device. The memory device comprises...
2017/0373085 METHODS FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES FABRICATED BY THE SAME
The inventive concepts provide methods for fabricating a semiconductor device and semiconductor devices fabricated by the same. According to the method,...
2017/0373084 MEMORY DEVICE HAVING VERTICAL STRUCTURE
A memory device includes a first semiconductor layer, a second semiconductor layer on the first semiconductor layer, and upper bit lines. The first...
2017/0373083 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME
A semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first...
2017/0373082 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor memory device according to an embodiment, includes a semiconductor pillar extending in a first direction, a first electrode extending in a...
2017/0373081 Integrated Structures Containing Vertically-Stacked Memory Cells
Some embodiments include an integrated structure having a stack of alternating dielectric levels and conductive levels, and having vertically-stacked memory...
2017/0373080 NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
This non-volatile semiconductor memory device includes a memory cell array including NAND cell units formed in a first direction vertical to a surface of a...
2017/0373079 THREE DIMENSIONAL MEMORY DEVICE CONTAINING MULTILAYER WORDLINE BARRIER FILMS AND METHOD OF MAKING THEREOF
Memory stack structures are formed through an alternating stack of insulating layers and sacrificial material layers. Backside recesses are formed by removal...
2017/0373078 INTER-PLANE OFFSET IN BACKSIDE CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY DEVICE
A three-dimensional memory device includes a plurality of planes, each having a respective alternating stack, strings of memory stack structures which extends...
2017/0373077 NON-VOLATILE SPLIT GATE MEMORY CELLS WITH INTEGRATED HIGH K METAL GATE LOGIC DEVICE AND METAL-FREE ERASE GATE,...
A method of forming split gate non-volatile memory cells on the same chip as logic and high voltage devices having HKMG logic gates. The method includes...
2017/0373076 Integrated Structures and Methods of Forming Integrated Structures
Some embodiments include an integrated structure having semiconductor material within a region between two parallel surfaces. The semiconductor material has...
2017/0373075 MEMORY CELL PILLAR INCLUDING SOURCE JUNCTION PLUG
Some embodiments include apparatuses and methods having a source material, a dielectric material over the source material, a select gate material over the...
2017/0373074 METHOD OF MAKING A FULLY DEPLETED SEMICONDUCTOR-ON-INSULATOR PROGRAMMABLE CELL AND STRUCTURE THEREOF
A programmable cell includes a semiconductor-on-insulator substrate, a program gate, and a word line gate. The semiconductor-on-insulator substrate includes a...
2017/0373073 STATIC RANDOM-ACCESS MEMORY (SRAM) CELL ARRAY
A static random-access memory (SRAM) cell array forming method includes the following steps. A plurality of fin structures are formed on a substrate, wherein...
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