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Patent # Description
2018/0019188 STRETCHABLE SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the...
2018/0019187 METHOD OF INTEGRATING A COPPER PLATING PROCESS IN A THROUGH-SUBSTRATE-VIA (TSV) ON CMOS WAFER
A semiconductor device composed of a through-substrate-via (TSV) interconnect, and methods for forming the interconnect.
2018/0019186 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor device includes: a wiring board including an insulating board and a wiring layer, the insulating board having an element mounting surface,...
2018/0019185 THERMALLY ENHANCED SEMICONDUCTOR PACKAGE HAVING FIELD EFFECT TRANSISTORS WITH BACK-GATE FEATURE
The present disclosure relates to a thermally enhanced semiconductor package having field effect transistors (FETs) with a back-gate feature. The thermally...
2018/0019184 THERMALLY ENHANCED SEMICONDUCTOR PACKAGE HAVING FIELD EFFECT TRANSISTORS WITH BACK-GATE FEATURE
The present disclosure relates to a thermally enhanced semiconductor package having field effect transistors (FETs) with a back-gate feature. The thermally...
2018/0019183 CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORMING THE SAME
Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that...
2018/0019182 SILICON NITRIDE CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING THE SAME
The present invention provides a silicon nitride circuit board in which metal plates are attached on front and rear sides of a silicon nitride substrate having...
2018/0019181 SEMICONDUCTOR DEVICE
Provided is a technique for enhancing heat dissipation properties in dissipating heat generated in an electrode to a heatsink without impairing bonding...
2018/0019180 SEMICONDUCTOR MODULE AND POWER CONVERTER
A semiconductor module includes an insulating substrate including an insulating layer, a first metal pattern formed on an upper surface of the insulating...
2018/0019179 Silicon-Based Heat Dissipation Device For Heat-Generating Devices
Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus includes a chip module assembly that includes a...
2018/0019178 CHIP PACKAGING AND COMPOSITE SYSTEM BOARD
A chip packaging includes a substrate, a first chip, a molding material, a first circuit, and a second circuit. The substrate includes a bottom surface, a...
2018/0019177 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
An electronic component includes a substrate having a principal surface, a chip arranged at the principal surface of the substrate, a sealing resin sealing the...
2018/0019176 ELECTRONIC COMPONENT AND CIRCUIT MODULE
An electronic component includes a core, a winding, and an electrode. A flange of the core includes a body having a first surface that faces a top side and is...
2018/0019175 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer...
2018/0019174 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
One aspect of the present disclosure provides a semiconductor device. In some embodiments, the semiconductor device includes an integrated circuit die, at...
2018/0019173 SEMICONDUCTOR DEVICE AND CASING OF THE SEMICONDUCTOR DEVICE
A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled...
2018/0019172 METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING USING CAPACITIVE SENSORS GROUPS
Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time...
2018/0019171 FABRICATION OF AN ISOLATED DUMMY FIN BETWEEN ACTIVE VERTICAL FINS WITH TIGHT FIN PITCH
A method of forming an arrangement of active and inactive fins on a substrate, including forming at least three vertical fins on the substrate, forming a...
2018/0019170 SELF-ALIGNED 3-D EPITAXIAL STRUCTURES FOR MOS DEVICE FABRICATION
Techniques are disclosed for customization of fin-based transistor devices to provide a diverse range of channel configurations and/or material systems within...
2018/0019169 BACKING SUBSTRATE STABILIZING DONOR SUBSTRATE FOR IMPLANT OR RECLAMATION
A donor substrate in a layer transfer process, is stabilized by attaching a backing substrate. The backing substrate allows thermal and mechanical ...
2018/0019168 ELECTROSTATIC CHUCK TABLE
An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength...
2018/0019167 SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STRUCTURES
In interconnect fabrication (e.g. a damascene process), a conductive layer is formed over a substrate with holes, and is polished to provide interconnect...
2018/0019166 DEFECT INSPECTION AND REPAIRING METHOD AND ASSOCIATED SYSTEM AND NON-TRANSITORY COMPUTER READABLE MEDIUM
A defect inspection and repairing method is disclosed. The method includes: providing a wafer including a semiconductor chip disposed on a surface of the...
2018/0019165 CVD Mo DEPOSITION BY USING MoOCl4
A method of forming a molybdenum-containing material on a substrate is described, in which the substrate is contacted with molybdenum oxytetrachloride...
2018/0019164 METHOD FOR FORMING IMPROVED LINER LAYER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
A method for manufacturing a semiconductor device includes conformally depositing a liner layer on a top surface of a dielectric layer, and on sidewall and...
2018/0019163 METHOD FOR FORMING IMPROVED LINER LAYER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
A method for manufacturing a semiconductor device includes conformally depositing a liner layer on a top surface of a dielectric layer, and on sidewall and...
2018/0019162 AMORPHOUS CARBON LAYER FOR COBALT ETCH PROTECTION IN DUAL DAMASCENE BACK END OF THE LINE INTEGRATED CIRCUIT...
A method of forming an amorphous carbon (aC) layer as a barrier layer for preventing etching of metals in a dual damascene metallization process and the...
2018/0019161 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
The present disclosure provides a semiconductor structure having a semiconductor layer; a gate with a conductive portion and a sidewall spacer; an interlayer...
2018/0019160 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Provided are a semiconductor device and a manufacturing method therefor that can prevent the breakage of an element and in which the control of impurity...
2018/0019159 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
A manufacturing method for a semiconductor device, comprising: providing a semiconductor substrate (100), and forming a shallow trench isolation structure...
2018/0019158 WAFER SCALE PACKAGING
A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor...
2018/0019157 Methods Of Forming One Or More Covered Voids In A Semiconductor Substrate
Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for...
2018/0019156 LASER ABLATIVE DIELECTRIC MATERIAL
Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the...
2018/0019155 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus including a frame, a first SCARA arm having an end effector and being configured to extend and retract along a first axis, a...
2018/0019154 SUBSTRATE TRANSFER ROBOT AND SUBSTRATE TRANSFER METHOD
This substrate transfer robot includes: a robot arm to which a substrate holding portion for holding a substrate is movably provided; a robot control unit for...
2018/0019153 SUBSTRATE TRANSFER DEVICE AND BONDING SYSTEM
A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the...
2018/0019152 ADHESIVE TAPE STICKING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SAME
An adhesive tape sticking apparatus includes a chamber includes a lower chamber and an upper chamber. The lower chamber includes a first inner space and the...
2018/0019151 Package-on-Package Structure
A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier,...
2018/0019150 METHOD FOR PROCESSING ONE SEMICONDUCTOR WAFER OR A PLURALITY OF SEMICONDUCTOR WAFERS AND PROTECTIVE COVER FOR...
In various embodiments, a method for processing a semiconductor wafer is provided. The semiconductor wafer includes a first main processing side and a second...
2018/0019149 Method of Manufacturing a Semiconductor Device
A system and method for a semiconductor wafer carrier is disclosed. An embodiment comprises a semiconductor wafer carrier wherein conductive dopants are...
2018/0019148 LOCALLY HEATED MULTI-ZONE SUBSTRATE SUPPORT
Embodiments of the present disclosure provide an electrostatic chuck (ESC) having azimuthal temperature control. In one embodiment, the electrostatic chuck...
2018/0019147 CENTERING FIXTURE FOR ELECTROSTATIC CHUCK SYSTEM
A centering fixture for centering a wafer on a chuck is provided. The centering fixture includes a body including an upper surface, a lower surface, an inner...
2018/0019146 RETICLE PURGING SYSTEM AND METHOD THEREOF
A reticle purging system includes an automated pod opener, a reticle holding device, a reticle transporting device and at least one purging device. The reticle...
2018/0019145 SUBSTRATE PROCESSING APPARATUS
Provided is a substrate processing apparatus, including: transportation chamber maintained in an atmospheric environment where a substrate is transported; a...
2018/0019144 VERTICAL WAFER BOAT
A vertical wafer boat includes a plurality of struts formed with a shelf plate portion configured to mount a silicon wafer, and a top plate and a bottom plate...
2018/0019143 BIN INSERT FOR BINNING OF LIGHT EMITTING DEVICES, BINNING ARRANGEMENT FOR BINNING OF LIGHT EMITTING DEVICES,...
A bin insert for binning of light emitting devices comprises a hollow structural section (1). The hollow structural section (1) further comprises a top opening...
2018/0019142 Front Opening Ring Pod
A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first...
2018/0019141 LASER SYSTEM AND LASER ANNEALING APPARATUS
A laser system may serve as a light source of a laser annealing apparatus that irradiates a workpiece with a pulse laser beam. The laser system may include: a...
2018/0019140 BONDING APPARATUS
A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured...
2018/0019139 Wafer-Level Etching Methods for Planar Photonics Circuits and Devices
A photoresist material is deposited, patterned, and developed on a backside of a wafer to expose specific regions on the backside of chips for etching. These...
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