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| Patent # | Description |
|---|---|
| 2018/0114825 |
DISPLAY DEVICE The present inventive concept relates to a display device. A display device according to an exemplary embodiment of the present inventive concept include: a base... |
| 2018/0114824 |
DISPLAY DEVICE A display device includes first, second, and third insulating layers sequentially disposed on a substrate, a scan line disposed on the first insulating layer,... |
| 2018/0114823 |
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF A display device includes a scan line that extends in a first direction on a substrate and that transmits a scan signal; a data line that extends in a second... |
| 2018/0114822 |
FLEXIBLE DISPLAY A flexible display is disclosed. The flexible display includes a flexible substrate and a thin film transistor array positioned on the flexible substrate and... |
| 2018/0114821 |
DISPLAY DEVICE HAVING AN EMITTING AREA AND A REFLECTING AREA A display device serving as a mirror in a non-display state is provided. The display device may include a reflective pattern and a half-mirror layer which are... |
| 2018/0114820 |
FLAT PANEL DISPLAY CONNECTING FRONT SIDE TO REAR SIDE OF SUBSTRATE USING
THROUGH HOLE The present disclosure relates to a display device including a light emitting element display. The present disclosure suggests a flat panel display comprising:... |
| 2018/0114819 |
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME A method of manufacturing a display device includes: forming an active layer on a substrate; forming a first insulation layer covering the active layer;... |
| 2018/0114818 |
ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF FABRICATING THE
SAME An organic light emitting diode display device includes a substrate; a thin film transistor on the substrate; a first electrode on the thin film transistor and... |
| 2018/0114817 |
ORGANIC LIGHT-EMITTING DISPLAY DEVICE An organic light-emitting display device, including a substrate that includes a plurality of first emission portions that realize a first color and a plurality... |
| 2018/0114816 |
DISPLAY DEVICE In one example embodiment, a display device for suppressing reflected light includes a driving circuit and a display region which includes a plurality of... |
| 2018/0114815 |
ORGANIC LIGHT EMITTING DISPLAY DEVICE An organic light emitting display device in an embodiment of the present invention comprises a display panel equipped with a plurality of pixels each including... |
| 2018/0114814 |
PHOTOELECTRIC DEVICE AND IMAGE SENSOR AND ELECTRONIC DEVICE A photoelectric device includes a first electrode and a second electrode facing each other, a photoelectric conversion layer between the first electrode and... |
| 2018/0114813 |
DOUBLE PATTERNING METHOD TO FORM SUB-LITHOGRAPHIC PILLARS A method and resulting structure, is disclosed to fabricate vertical bipolar junction transistors including a regular array of base contact pillars and emitter... |
| 2018/0114812 |
IMAGING DEVICE An imaging device including a unit pixel cell including a semiconductor substrate having a surface including a first area and a second area surrounded by the... |
| 2018/0114811 |
SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE DEVICE Each unit pixel includes a photoelectric converter, an n-type impurity region forming an accumulation diode together with the semiconductor region, the... |
| 2018/0114810 |
IMAGING DEVICE COMPRISING MULTILAYER WIRING STRUCTURE An imaging device includes: a semiconductor substrate; a photoelectric conversion element including a first electrode, a second electrode, and a photoelectric... |
| 2018/0114809 |
RANGE SENSOR AND SOLID-STATE IMAGING DEVICE A range sensor includes: an n-type surface-buried region selectively buried in an upper portion of a pixel layer to implement a photodiode and extending from a... |
| 2018/0114808 |
SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor,... |
| 2018/0114807 |
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS This technology relates to a solid-state imaging device and an electronic apparatus by which image quality can be enhanced. The solid-state imaging device... |
| 2018/0114806 |
IMAGE SENSOR HAVING SHIELDS AND METHODS OF FABRICATING THE SAME An image sensor includes: a first sub-pixel and a second sub-pixel that are adjacent to each other; and an upper shield, wherein the first sub-pixel includes a... |
| 2018/0114805 |
IMAGE PICKUP DEVICE [Object] To provide an image pickup device that is capable of reducing the thickness of the imaging optical system without reducing the imaging capacity and... |
| 2018/0114804 |
HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE Implementations of semiconductor packages may include: a substrate including a first side and a second side and an image signal processor (ISP) including a... |
| 2018/0114803 |
Fabrication Of Photodiode Array On Spherical Platform For 4-PI Detection
Awareness A method is presented for fabricating an array of sensors on an object having a non-developable surface. The method includes: growing an epitaxial structure on... |
| 2018/0114802 |
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, SENSOR AND DETECTION
DEVICE Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film... |
| 2018/0114801 |
RADIO FREQUENCY (RF) SWITCH Disclosed is a radio frequency (RF) switch that includes a substrate and a plurality of elongated drain/source (D/S) diffusion regions laterally disposed in... |
| 2018/0114800 |
FABRICATING INTEGRATED LIGHT-EMITTING PIXEL ARRAYS FOR DISPLAYS Methods of fabricating integrated active-matrix light emitting pixel array based displays are provided. The methods include: forming an array of light emitting... |
| 2018/0114799 |
LIGHT-EMITTING DEVICE To provide a light-emitting device in which variation in luminance among pixels caused by variation in threshold voltage of transistors can be suppressed. The... |
| 2018/0114798 |
DISPLAY PANEL In a display panel, a first substrate has an active area and a peripheral area outside the active area. A plurality of first traces are located at the... |
| 2018/0114797 |
ARRAY SUBSTRATE AND METHOD FOR MAINTAINING THE SAME, DISPLAY PANEL AND
DISPLAY DEVICE An array substrate includes a pixel unit, a data line, a first gate line and a second gate line. Adjacent two columns of pixel units are collectively connected... |
| 2018/0114796 |
Array Substrate and Manufacturing Method Thereof, and Display Device An array substrate and a manufacturing method thereof, and a display device are provided. The array substrate includes a plurality of mutually parallel signal... |
| 2018/0114795 |
Elevationally-Extending Strings Of Memory Cells Individually Comprising A
Programmable Charge Storage... A method comprises forming material to be etched over a substrate. An etch mask comprising a silicon nitride-comprising region is formed elevationally over the... |
| 2018/0114794 |
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME A semiconductor device includes word lines vertically stacked on top of each other on a substrate, insulating patterns between the word lines, a vertical... |
| 2018/0114793 |
SINGLE POLY ELECTRICAL ERASABLE PROGRAMMABLE READ ONLY MEMORY (EEPROM) A single poly electrical erasable programmable read only memory (EEPROM) includes a source, a drain, a dielectric layer and an electrode layer. The source and... |
| 2018/0114792 |
STATIC RANDOM ACCESS MEMORY (SRAM) DENSITY SCALING BY USING MIDDLE OF LINE
(MOL) FLOW A method is presented for forming a semiconductor structure. The method includes forming gate contacts on a semiconductor substrate, forming trench silicide... |
| 2018/0114791 |
SEMICONDUCTOR DEVICE HAVING FIN-TYPE PATTERNS A semiconductor device is provided. The semiconductor device includes a substrate comprising first and second regions, in the first region, first and second... |
| 2018/0114790 |
SEMICONDUCTOR DEVICE INCLUDING FIN STRUCTURES AND MANUFACTURING METHOD
THEREOF A semiconductor device includes device areas where a Fin FET is disposed and a non-device area disposed between the device areas, which includes a dummy... |
| 2018/0114789 |
SWITCHING DEVICE A switching device may include a semiconductor substrate; gate trenches; bottom insulating layers covering bottom surfaces of the gate trenches; gate... |
| 2018/0114788 |
Semiconductor Device Including Transistor Device A semiconductor device of an embodiment includes a transistor device in a semiconductor die including a semiconductor body. The transistor device includes... |
| 2018/0114787 |
ELECTROSTATIC DISCHARGE PROTECTION DEVICE An ESD protection device on a substrate includes a base doped region of a first conductivity type. A first inter doped region of a second conductivity type is... |
| 2018/0114786 |
Method of forming package-on-package structure A method of forming a package-on-package (POP) structure is provided. A laser drilling is performed on a mold compound of a first semiconductor package to form... |
| 2018/0114784 |
FILM SENSORS ARRAY AND METHOD In accordance with an embodiment, sensor structure has a first, second, and third laminated structures. The second laminated structure is positioned between... |
| 2018/0114783 |
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF A chip package structure including a substrate, a first chip, a frame, a plurality of first conductive connectors, a first encapsulant, and a package is... |
| 2018/0114782 |
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE A manufacturing method of a package-on package structure including at least the following steps is provided. A die is bonded on a first circuit carrier. A... |
| 2018/0114781 |
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF A package structure and a manufacturing method thereof are provided. The package structure includes a circuit carrier, a substrate, a die, a plurality of... |
| 2018/0114780 |
LIGHT EMITTING DEVICE ARRAY AND LIGHTING SYSTEM INCLUDING THE SAME A light emitting device array according to an embodiment, comprises: a circuit board including a first electrode and a second electrode; a light emitting... |
| 2018/0114779 |
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first... |
| 2018/0114778 |
INK PRINTED WIRE BONDING An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are... |
| 2018/0114777 |
SEMICONDUCTOR DEVICE The present technology relates to a semiconductor device. The semiconductor device comprises: a plurality of dies stacked on top of each other, each of the... |
| 2018/0114776 |
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME A multi-chip package includes a package substrate including a first substrate pad, a first group of semiconductor chips stacked on the package substrate, each... |
| 2018/0114775 |
ULTRA-THIN DISPLAY USING PRINTED LEDS Active LEDs have a control transistor in series with an LED and have a top electrode, a bottom electrode, and a control electrode. The active LEDs are... |
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