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| Patent # | Description |
|---|---|
| 2018/0130689 |
Electrostatic Chuck Including Clamp Electrode Assembly Forming Portion of
Faraday Cage for RF Delivery and... A ceramic layer is attached to a top surface of a base plate using a bond layer. The ceramic layer has a top surface configured to support a substrate. A clamp... |
| 2018/0130688 |
TRANSFER APPARATUS, PROCESSING APPARATUS, AND TRANSFER METHOD A frame unit is transferred from a cassette to a predetermined position. The frame unit has a platelike workpiece, a tape attached to the workpiece, and a ring... |
| 2018/0130687 |
ELECTRONIC DEVICE MANUFACTURING LOAD PORT APPARATUS, SYSTEMS, AND METHODS An electronic device manufacturing system includes a factory interface that has a load port. The load port may include a panel having a back surface. The back... |
| 2018/0130685 |
SYSTEMS, APPARATUS, AND METHODS FOR AN IMPROVED LOAD PORT Embodiments provide systems, apparatus, and methods for an improved load port that includes a frame supporting a dock and a carrier opener; an elevator... |
| 2018/0130684 |
SYSTEMS, APPARATUS, AND METHODS FOR AN IMPROVED LOAD PORT BACKPLANE Embodiments provide systems, apparatus, and methods for an improved load port that includes a backplane assembly supporting a docking tray and a substrate... |
| 2018/0130683 |
APPARATUS AND METHOD FOR CONTACTLESS TRANSFER AND SOLDERING OF CHIPS USING
A FLASH LAMP A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip... |
| 2018/0130682 |
STORAGE DEVICE AND PHOTORESIST COATING AND DEVELOPING MACHINE HAVING
STORAGE DEVICE A storage device and a photoresist coating and developing machine having a storage device are disclosed. The storage device includes a frame and a plurality of... |
| 2018/0130681 |
PROCESSING SYSTEM A processing system includes: at least one processing unit. Each processing unit includes a plurality of processing chambers, and a utility module. Each of the... |
| 2018/0130680 |
Thermal Process Device A thermal process device for heat treating a product or plurality of products includes a thermal processing chamber having opposed distal ends and a plurality... |
| 2018/0130679 |
PLASMA PROCESSING DEVICE The present invention relates to a plasma processing device, comprising: an upper electrode has a plurality of protruding posts which made by conducting... |
| 2018/0130678 |
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Disclosed is a substrate treating apparatus including a substrate holder, a rotating drive unit, a treatment liquid supplying unit, an exterior cup, and an... |
| 2018/0130677 |
SUBSTRATE PROCESSING APPARATUS A substrate processing apparatus can suppress a rear surface of a substrate from being contaminated when moving the substrate and a liquid supply unit upwards.... |
| 2018/0130676 |
GROOVE-TYPE DRYING STRUCTURE A groove-type drying structure includes a drying groove having a cover. The drying groove is internally provided with an inner groove body. The inner groove... |
| 2018/0130675 |
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND RECORDING
MEDIUM A substrate processing apparatus performs: a pressure raising process of raising a pressure within the processing container to a processing pressure higher... |
| 2018/0130674 |
APPARATUS AND METHOD FOR PROCESSING SUBSTRATE Disclosed are an apparatus and method for processing a substrate. The apparatus includes a chamber, a susceptor disposed in a lower portion of the chamber, a... |
| 2018/0130673 |
PACKAGE STRUCTURE, FAN-OUT PACKAGE STRUCTURE AND METHOD OF THE SAME A package structure includes a spiral coil, a redistribution layer (RDL) and a molding material. The molding material fills gaps of the spiral coil. The spiral... |
| 2018/0130672 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE A method of manufacturing a semiconductor device includes preparing an object layer on a substrate; polishing the object layer with a first slurry including a... |
| 2018/0130671 |
Methods For Self-Aligned Patterning Processing methods comprising depositing a film on a substrate surface and in a surface feature with chemical planarization to remove the film from the... |
| 2018/0130670 |
ETCHING METHOD Disclosed is a method for etching an etching target layer which contains silicon and is provided with a metal-containing mask thereon. The method includes:... |
| 2018/0130669 |
SELF-LIMITING CYCLIC ETCH METHOD FOR CARBON-BASED FILMS Embodiments of the disclosure describe a cyclic etch method for carbon-based films. According to one embodiment, the method includes providing a substrate... |
| 2018/0130668 |
ENHANCED PATTERNING OF INTEGRATED CIRCUIT LAYER BY TILTED ION IMPLANTATION Methods for achieving sub-lithographic feature sizes in an integrated circuit (IC) layer are provided that use ion implantation to enhance or reduce the etch... |
| 2018/0130667 |
FILM THICKNESS MEASURING METHOD, FILM THICKNESS MEASURING APPARATUS,
POLISHING METHOD, AND POLISHING APPARATUS The present invention relates to a film-thickness measuring method for detecting a film thickness by analyzing optical information contained in a reflected... |
| 2018/0130666 |
ENHANCED THIN FILM DEPOSITION Methods of producing metal-containing thin films with low impurity contents on a substrate by atomic layer deposition (ALD) are provided. The methods... |
| 2018/0130665 |
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE A method of fabricating a semiconductor device, the method including forming a deposition active layer and a guide pattern on a semiconductor substrate such... |
| 2018/0130664 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE In a method of manufacturing a semiconductor device, by performing a predetermined number of times a cycle of performing supplying reducing gas to a substrate... |
| 2018/0130663 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD A method of manufacturing a semiconductor device includes the following processes. A metal film forming process in which a metal film including cobalt is... |
| 2018/0130662 |
SYSTEM AND METHOD FOR MITIGATING OXIDE GROWTH IN A GATE DIELECTRIC Oxide growth of a gate dielectric layer that occurs between processes used in the fabrication of a gate dielectric structure can be reduced. The reduction in... |
| 2018/0130661 |
Semiconductor Device and Method of Manufacturing the Same A third semiconductor layer (105) including a third nitride semiconductor is provided between an electrode (110) and a second semiconductor layer (104)... |
| 2018/0130660 |
SEMICONDUCTOR DEVICE HAVING INTERCONNECT STRUCTURE Various embodiments provide semiconductor devices. A base including a substrate and an interlayer dielectric layer is provided. The base has a first region and... |
| 2018/0130659 |
Plasma Doping Using A Solid Dopant Source A method of processing a workpiece is disclosed, where the interior surfaces of the plasma chamber are first coated using a conditioning gas that contains the... |
| 2018/0130658 |
APPARATUS AND METHOD FOR BONDING SUBSTRATES A device and method is described for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a... |
| 2018/0130657 |
Geometric Control Of Bottom-Up Pillars For Patterning Applications Processing methods comprising selectively replacing a first pillar material with a second pillar material in a self-aligned process are described. The first... |
| 2018/0130656 |
FORMING DEFECT-FREE RELAXED SiGe FINS A method of forming defect-free relaxed SiGe fins is provided. Embodiments include forming fully strained defect-free SiGe fins on a first portion of a Si... |
| 2018/0130655 |
SYMMETRIC TUNNEL FIELD EFFECT TRANSISTOR The present disclosure relates to semiconductor structures and, more particularly, to a symmetric tunnel field effect transistor and methods of manufacture.... |
| 2018/0130654 |
PRECURSORS FOR SILICON DIOXIDE GAP FILL A full fill trench structure is described, including a microelectronic device substrate having a high aspect ratio trench therein and filled with silicon... |
| 2018/0130653 |
OPTICS FOR CONTROLLING LIGHT TRANSMITTED THROUGH A CONICAL QUARTZ DOME Embodiments described herein generally relate to apparatus for heating substrates. The apparatus generally include a process chamber having a substrate support... |
| 2018/0130652 |
PROCESS FEED MANAGEMENT FOR SEMICONDUCTOR SUBSTRATE PROCESSING Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a... |
| 2018/0130651 |
PULSED PLASMA ANALYZER AND METHOD FOR ANALYZING THE SAME A pulsed plasma analyzer includes a pulse modulator that controls an off-time of a pulsed plasma that includes a target radical, an optical spectrometer that... |
| 2018/0130650 |
INTEGRATED SAMPLE PROCESSING FOR ELECTROSPRAY IONIZATION DEVICES Methods, systems and devices that generate differential axial transport in a fluidic device having at least one fluidic sample separation flow channel and at... |
| 2018/0130649 |
Systems and Methods for Scaling Injection Waveform Amplitude During Ion
Isolation This disclosure describes a method of adjusting the amplitude of broadband waveforms for isolation, especially during injection to a multipole trapping device.... |
| 2018/0130648 |
Rate Enhanced Pulsed DC Sputtering System A sputtering system and method are disclosed. The system includes first power source coupled to a first magnetron and an anode, and the first power source... |
| 2018/0130647 |
METHOD AND APPARATUS FOR CALIBRATING OPTICAL PATH DEGRADATION USEFUL FOR
DECOUPLED PLASMA NITRIDATION CHAMBERS Methods for matching semiconductor processing chambers using a calibrated spectrometer are disclosed. In one embodiment, plasma attributes are measured for a... |
| 2018/0130646 |
METHODS AND SYSTEMS FOR GENERATING PLASMA ACTIVATED LIQUID Exemplary systems and methods associated with activating fluids using indirect plasma. In particular, liquid can be activated to high concentrations and at... |
| 2018/0130645 |
HEAT TRANSFER MEDIUM SYSTEM AND SUBSTRATE PROCESSING APPARATUS A heat transfer medium supply system includes valve units each alternately supplying a first and a second heat transfer medium to a corresponding zone of a... |
| 2018/0130644 |
HIGH CONDUCTANCE PROCESS KIT Apparatus for plasma processing of semiconductor substrates. Aspects of the apparatus include an upper shield with a gas diffuser arranged at a center of the... |
| 2018/0130643 |
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD A plasma processing apparatus includes: a base that has an electrode body provided with a placing surface on which a substrate is placed and a pedestal which... |
| 2018/0130642 |
Methods And Systems To Modulate Film Stress Apparatus and methods to control the phase of power sources for plasma process regions in a batch process chamber. A master exciter controls the phase of the... |
| 2018/0130641 |
Apparatus and Method for Augmenting the Volume of Atmospheric Pressure
Plasma Jets An apparatus and methods to increase and direct the spatial volume of atmospheric pressure plasma jets. One or more additional gas flows is introduced to... |
| 2018/0130640 |
ACTIVE SHOWERHEAD An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at... |
| 2018/0130639 |
EXTERNAL PLASMA SYSTEM Methods and systems for generating a plasma using an external plasma system are described. The plasma system may include an energy coupling device (e.g., an... |
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