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Patent # Description
2018/0204765 MODIFIED SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) PROCESSES USING CUT PATTERN MASKS TO FABRICATE INTEGRATED...
Aspects describing modified self-aligned quadruple patterning (SAQP) processes using cut pattern masks to fabricate integrated circuit (IC) cells with reduced...
2018/0204764 POST-ETCH RESIDUE REMOVAL FOR ADVANCED NODE BEOL PROCESSING
The disclosure relates to a cleaning composition that aids in the removal of post-etch residues and aluminum-containing material, e.g., aluminum oxide, in the...
2018/0204763 SELF-ALIGNED ISOTROPIC ETCH OF PRE-FORMED VIAS AND PLUGS FOR BACK END OF LINE (BEOL) INTERCONNECTS
Self-aligned isotropic etch processes for via and plug patterning for back end of line (BEOL) interconnects, and the resulting structures, are described. In an...
2018/0204762 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a substrate having a first active pattern and a second active pattern, the first active pattern including a first recess region...
2018/0204761 LATERAL PiN DIODES AND SCHOTTKY DIODES
Lateral PiN diodes and Schottky diodes with low parasitic capacitance and variable breakdown voltage structures and methods of manufacture are disclosed. The...
2018/0204760 MASKLESS AIR GAP TO PREVENT VIA PUNCH THROUGH
A first etch stop layer is deposited on a plurality of conductive features on an insulating layer on a substrate. A second etch stop layer is deposited over an...
2018/0204759 INTERCONNECT STRUCTURE INCLUDING AIRGAPS AND SUBSTRACTIVELY ETCHED METAL LINES
Integrated circuits including at least two electrically conductive interconnect lines and methods of manufacturing generally include a surface of the...
2018/0204758 Integrated Circuit Structure with Guard Ring
A semiconductor structure includes a substrate having a first region and a second region being adjacent each other; a first patterned layer formed on the...
2018/0204757 PLASMA PROCESSING APPARATUS
A plasma processing apparatus that plasmatizes a gas that is supplied to inside of a chamber by using high-frequency power used for generating a plasma and...
2018/0204756 PLASMA PROCESSING APPARATUS
A plasma processing apparatus of processing a processing target object within a depressurized space is provided. The plasma processing apparatus includes a...
2018/0204755 RADIANT HEATING PRESOAK
A workpiece processing system and method comprises transferring a workpiece to a vacuum chamber. A heated chuck is configured to selectively clamp a workpiece...
2018/0204754 SUBSTRATE SUPPORTING DEVICE
A substrate supporting device having a feeder structure that enables a large number of electrodes to be successfully supplied with power. A ceramic heater 100...
2018/0204753 DOOR OPENING/CLOSING SYSTEM, AND LOAD PORT EQUIPPED WITH DOOR OPENING/CLOSING SYSTEM
A door opening/closing system includes: a base as part of a wall isolating a conveyance space from an external space; an opening portion provided in the base;...
2018/0204752 FRAME UNIT TRANSFER SYSTEM
Disclosed herein is a frame unit transfer system for transferring a frame unit formed by supporting a workpiece through an adhesive tape to an annular frame,...
2018/0204751 SUBSTRATE CONTAINER WITH ENHANCED CONTAINMENT
Substrate containers and/or portions thereof for use in the semiconductor manufacturing industry can be formed by injection molding metal slurries. More...
2018/0204750 PLASMA PARAMETERS AND SKEW CHARACTERIZATION BY HIGH SPEED IMAGING
Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a...
2018/0204749 FLEXIBLE SUPPORT SUBSTRATE FOR TRANSFER OF SEMICONDUCTOR DEVICES
An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to hold the wafer...
2018/0204748 CERAMIC HEATER
A ceramic heater includes a disk-shaped ceramic plate with an upper surface defining a wafer placement surface on which a wafer is to be placed. One or more...
2018/0204747 SUBSTRATE SUPPORT ASSEMBLY HAVING SURFACE FEATURES TO IMPROVE THERMAL PERFORMANCE
A substrate support assembly including a ceramic body includes an upper surface. The upper surface includes a sealing ring at a periphery of the ceramic body,...
2018/0204746 GRINDING APPARATUS
Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a...
2018/0204745 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND COMPUTER READABLE RECORDING MEDIUM
A substrate processing apparatus includes a rotation holding device that holds and rotates a substrate, a liquid supply device including one or more rinse...
2018/0204744 SCRUBBING APPARATUS FOR ELECTRONIC MODULE AND AN AUTOMATIC SCRUBBING METHOD THEREOF
The present disclosure discloses an automatic scrubbing apparatus for an electronic module and an automatic scrubbing method thereof. The automatic scrubbing...
2018/0204743 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
This substrate processing method is a substrate processing method that processes a front surface of a substrate with using a processing liquid, including a...
2018/0204742 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus, includes: a process chamber accommodating a substrate; a vaporizer vaporizing a liquid precursor to generate reaction gas and...
2018/0204741 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THEREOF
The present disclosure discloses a method of packaging a chip and a chip package structure. The method of packaging the chip includes: mounting at least one...
2018/0204740 SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE
A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods...
2018/0204739 SELECTIVE PLANISHING METHOD FOR MAKING A SEMICONDUCTOR DEVICE
In a method for fabricating semiconductor devices a leadframe pattern is formed from a flat tape of base metal. A plurality of additional metal layers is...
2018/0204738 CHAMBER FOR PATTERNING NON-VOLATILE METALS
Apparatuses suitable for etching substrates at various pressure regimes are described herein. Apparatuses include a process chamber including a movable...
2018/0204737 METHOD OF MANUFACTURNG SOLAR CELL
A method of manufacturing a solar cell is disclosed. The method of manufacturing the solar cell includes depositing an intrinsic amorphous silicon layer on a...
2018/0204736 COMPOSITIONS AND METHODS FOR REMOVING CERIA PARTICLES FROM A SURFACE
A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having...
2018/0204735 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
There is provide a technique that includes preparing a substrate, in which an insulating film is formed on a pattern having an aspect ratio of 20 or greater...
2018/0204734 ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
A microelectronic device is formed by forming a platinum-containing layer on a substrate of the microelectronic device. A cap layer is formed on the...
2018/0204733 METHOD OF PREFERENTIAL SILICON NITRIDE ETCHING USING SULFUR HEXAFLUORIDE
Embodiments of the invention describe substrate processing methods using non-polymerizing chemistry to preferentially etch silicon nitride relative to other...
2018/0204732 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
There is provided a technique that includes: (a) providing a substrate having a film containing a predetermined element, oxygen and carbon formed on a surface...
2018/0204731 SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
A method for fabricating a semiconductor structure includes providing a base substrate, forming a plurality of core layers on the base substrate, forming a...
2018/0204730 METHOD OF FORMING PATTERNS, PATTERNS FORMED ACCORDING TO THE METHOD, AND SEMICONDUCTOR DEVICE INCLUDING THE...
A method of forming patterns, patterns formed according to the method, and a semiconductor device including the patterns, the method including forming an...
2018/0204729 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
A substrate processing device including an accommodation unit that accommodates a substrate. A gas supply unit supplies plasma generation gas. A plasma supply...
2018/0204728 Dry Etching Method
Disclosed is a dry etching method for etching a laminated film of silicon oxide layers and silicon nitride layers on a substrate. The dry etching method...
2018/0204727 Method of Fabricating a Tunnel Oxide Layer and a Tunnel Oxide Layer for a Semiconductor Device
A method of fabricating a tunnel oxide layer for a semiconductor memory device, the method comprising: fabricating on a substrate a first oxide layer by a...
2018/0204726 BARRIER LAYER ABOVE ANTI-PUNCH THROUGH (APT) IMPLANT REGION TO IMPROVE MOBILITY OF CHANNEL REGION OF FIN FIELD...
A fin field device structure and method for forming the same are provided. The FinFET device structure includes a protruding structure extending from a...
2018/0204725 Method of Manufacturing a Silicon Carbide Semiconductor Device by Removing Amorphized Portions
A trench is formed that extends from a main surface into a crystalline silicon carbide semiconductor layer. A mask is formed that includes a mask opening...
2018/0204724 IMAGE TRANSFER USING EUV LITHOGRAPHIC STRUCTURE AND DOUBLE PATTERNING PROCESS
An EUV lithographic structure includes an EUV photosensitive resist layer disposed on a hardmask layer, wherein the EUV lithographic structure is free of an...
2018/0204723 IMAGE TRANSFER USING EUV LITHOGRAPHIC STRUCTURE AND DOUBLE PATTERNING PROCESS
An EUV lithographic structure includes an EUV photosensitive resist layer disposed on a hardmask layer, wherein the EUV lithographic structure is free of an...
2018/0204722 METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE
A method for manufacturing a nitride semiconductor substrate includes: a preparation step of preparing a sapphire substrate (2); and a buffer layer forming...
2018/0204721 Precursors Of Manganese And Manganese-Based Compounds For Copper Diffusion Barrier Layers And Methods Of Use
Semiconductor devices and methods of making semiconductor devices with a barrier layer comprising manganese nitride are described. Also described are...
2018/0204720 SUBSTRATE PROCESSING APPARATUS
Described herein is a technique capable of acquiring, monitoring and recording the progress of the reaction between a substrate and a reactive gas contained in...
2018/0204719 MULTIPLE PATTERNING APPROACH USING ION IMPLANTATION
A method for patterning a substrate, comprising: providing a photoresist patterning feature on the substrate, the substrate defining a substrate plane, the...
2018/0204718 SOURCE AND DRAIN PROCESS FOR FINFET
A device includes a fin structure, a dielectric layer, a gate a spacer, and an epitaxy structure. The dielectric layer is over the fin structure. The gate is...
2018/0204717 METHOD AND DEVICE FOR THE SURFACE TREATMENT OF SUBSTRATES
A method for the surface treatment of a substrate surface of a substrate includes arranging the substrate surface in a process chamber, bombarding the...
2018/0204716 PROTECTIVE FILM FORMING METHOD
A protective film forming method is provided. In the method, substantially an entire surface of a silicon-containing underfilm is terminated with fluorine by...
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