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Patent # Description
2018/0212142 ENGINEERED BARRIER LAYER INTERFACE FOR HIGH SPEED SPIN-TRANSFER TORQUE MAGNETIC RANDOM ACCESS MEMORY
A perpendicular magnetic tunnel junction may include a free layer, a reference layer, and a barrier layer. The barrier layer may be arranged between the free...
2018/0212141 Unipolar Magnetoelectric Magnetic Tunnel Junction
A magneto-electric magnetic tunnel junction device (ME-MTJ) that permits direct driving of ME-MTJ devices by a prior ME-MTJ device is the unipolar ...
2018/0212140 SEMICONDUCTOR DEVICES
A semiconductor device may include a bottom electrode contact and a magnetic tunnel junction on the bottom electrode contact. The semiconductor device may...
2018/0212139 RESONATOR AND RESONATOR DEVICE
A resonator includes a vibrator with a base, and multiple vibrating arms extending therefrom. Moreover, a frame surrounds a periphery of the vibrating part and...
2018/0212137 METHODS AND DEVICES FOR HAPTIC COMMUNICATION
A haptic stimulator includes a multilayer sheet with a piezoelectric or electroactive polymer layer adapted to mechanically deform upon application of voltage,...
2018/0212136 STRAND CRITICAL CURRENT DENSITY IN Nb3Sn SUPERCONDUCTING STRANDS VIA A NOVEL HEAT TREATMENT
A new heat treatment for Internal-Tin Nb.sub.3Sn strands is described. The heat treatment uses Nausite membranes to decrease the volume fraction of the .eta....
2018/0212135 METHOD FOR PRODUCING A SEMIFINISHED PRODUCT FOR A SUPERCONDUCTING WIRE
A method for producing a semifinished product for a superconducting wire is provided herein. The semifinished product includes at least one NbTi-containing...
2018/0212134 METHODOLOGY FOR FORMING A RESISTIVE ELEMENT IN A SUPERCONDUCTING STRUCTURE
A method of forming a superconducting structure is provided that includes forming a superconducting element in a first dielectric layer, forming a protective...
2018/0212133 FLEXIBLE THERMOELECTRIC DEVICES, METHODS OF PREPARATION THEREOF, AND METHODS OF RECOVERING WASTE HEAT THEREWITH
The present disclosure relates to flexible thermoelectric devices. In some embodiments, such devices can comprise a flexible substrate with a first conductive...
2018/0212132 THERMOELECTRIC ELEMENT AND COOLING APPARATUS COMPRISING SAME
The thermoelement according to one embodiment of the present invention includes: a first substrate; multiple p-type thermoelectric legs and multiple n-type...
2018/0212131 THERMOELECTRIC CONVERSION MATERIAL AND METHOD FOR PRODUCING SAME
A thermoelectric conversion material is used in which columnar or spherical nanodots 1 having a diameter of 20 nm or less are embedded in an embedding layer 3...
2018/0212130 THERMOELECTRIC STRUCTURE, THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME
A thermoelectric structure that may be included in a thermoelectric device may include a thin-film structure that may include a plurality of thin-film layers....
2018/0212129 HEAT DISSIPATION CIRCUIT BOARD AND METHOD FOR PRODUCING HEAT DISSIPATION CIRCUIT BOARD
A heat dissipation circuit board includes a printed circuit board including an insulating film and a conductive pattern that is formed on a front-surface side...
2018/0212128 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
A light emitting device includes a light emitting element, a light-transmissive member, a light guide member and a light reflective member. The...
2018/0212127 OPTOELECTRONIC COMPONENT, ASSEMBLY OF OPTOELECTRONIC COMPONENTS AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT
An optoelectronic component includes a semiconductor chip configured to emit radiation at least via a main radiation surface, a converter element arranged in a...
2018/0212126 LIGHT-EMITTING DEVICE
A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed...
2018/0212125 LIGHT-EMITTING DEVICE
A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed...
2018/0212124 LIGHT EMITTING DEVICE MOUNTING BOARD BLOCK, LIGHT EMITTING DEVICE, AND METHOD OF PRODUCING THE LIGHT EMITTING...
A light emitting device mounting board block includes: a lead frame having a plate-shape, the lead frame having a first surface, and a second surface located...
2018/0212123 LIGHT-EMITTING DIODE DEVICE
A light-emitting element, includes a first edge, a second edge, a third edge and a fourth edge; a substrate; a semiconductor stack formed on the substrate,...
2018/0212122 INTEGRATED LIGHT-EMITTING PACKAGE
An integrated light-emitting package according to an embodiment comprises: a light-emitting element layer including a plurality of light-emitting units...
2018/0212121 COMPONENT AND METHOD OF PRODUCING COMPONENTS
A component includes a carrier having a front side facing towards a semiconductor body and a rear side facing away from the semiconductor body, each of which...
2018/0212120 MAGNETICALLY GUIDED CHIPLET DISPLACEMENT
Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving...
2018/0212119 LIGHT EMITTING APPARATUS
A light emitting device including a contact layer, a blocking layer over the contact layer, a protection layer adjacent the blocking layer, a light emitter...
2018/0212118 BEVELED CHIP REFLECTOR FOR CHIP-SCALE PACKAGING LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
A chip-scale packaging (CSP) light-emitting device (LED), including a light-emitting semiconductor die, a photoluminescent layer, a chip-side-spacer structure,...
2018/0212117 LIGHT-EMITTING DEVICE PACKAGE
A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at...
2018/0212116 Durable LED Light Engine for Airfield Guidance Sign
An airfield guidance sign is provided. The airfield guidance sign has a housing with a display side. At least a portion of the display side is able to transmit...
2018/0212115 LIGHT EMITTING PACKAGE BASE STRUCTURE
A light emitting package base structure includes a carrier, a light emitting chip, a light transmission unit and a dam. The carrier has a supporting surface...
2018/0212114 OPTOELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
An optoelectronic package includes a carrier, a light emitting die, a cover, and an encapsulation material. The carrier has a carrying plane and a wiring layer...
2018/0212113 LED lamp with siloxane particle material
An LED lamp is formed from a die substrate wherein the substrate has formed thereon a semiconductor material, an electrode for the application of a bias across...
2018/0212112 LIGHT-EMITTING APPARATUS INCLUDING PHOSPHOR
A light-emitting apparatus includes: a solid-state light source; and a wavelength convertor. The solid-state light source emits first light including green...
2018/0212111 LIGHT-EMITTING DEVICE PACKAGE
A light-emitting device package of an embodiment includes a light-emitting structure including first and second conductive semiconductor layers and an active...
2018/0212110 LIGHT-EMITTING DEVICE
A light-emitting device includes a semiconductor structure comprising a surface and a side wall inclined to the surface, wherein the semiconductor structure...
2018/0212109 LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREFOR
A light-emitting diode and a manufacturing method therefor are disclosed. The light-emitting diode comprises: a first conductive semiconductor layer; at least...
2018/0212108 OPTOELECTRONIC ARRANGEMENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC ARRANGEMENT
An optoelectronic arrangement is specified, comprising a moulded body (2) having a base surface (2b), a first pixel group (41) with a multiplicity of pixels...
2018/0212107 Optoelectronic Semiconductor Chip
An optoelectronic semiconductor chip is disclosed. In an embodiment, the chip includes a semiconductor layer sequence with a first side, a second side and an...
2018/0212106 LIGHT-EMITTING PACKAGE STRUCTURE PROVIDED WITH PREDETERMINED VIEW ANGLE, LIGHT-EMITTING PACKAGE MODULE AND...
A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a...
2018/0212105 FLIP CHIP LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME
A flip chip light emitting diode includes a semiconductor layer comprising an epitaxial layer an N-semiconductor layer, a light active layer and a...
2018/0212104 FLIP CHIP TYPE LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
In a flip chip type light-emitting diode, a light-emitting diode structure possesses one unique layer with properties of both thermal conduction and electrical...
2018/0212103 Light Emitting Element and Fabrication Method Thereof
The present invention discloses a light emitting element and a fabrication method thereof. The light emitting element includes: an anode electrode, a hole...
2018/0212102 LIGHT EMITTING ELEMENT AND LIGHT EMITTING APPARATUS COMPRISING SAME
A light emitting element comprises: a substrate including protrusions; and a light emitting structure located on the substrate. The protrusions are disposed in...
2018/0212101 LIGHT-EMITTING DEVICE
A light-emitting device (10) includes a first base material (100), a second base material (200), a light-emitting element (300) and a control unit (400). The...
2018/0212100 METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT
A method of manufacturing a light emitting element includes: providing a wafer that includes a substrate having a first principal face and a second principal...
2018/0212099 LIGHT EMITTING DIODE STRUCTURE, LIGHT EMITTING DIODE DEVICE AND THE MANUFACTURING METHOD THEREOF
A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth...
2018/0212098 OPTICAL DEVICE WAFER PROCESSING METHOD
An optical device wafer processing method for dividing an optical device wafer along a plurality of division lines to obtain a plurality of individual device...
2018/0212097 LIGHT EMITTING DIODE WITH DISPLACED P-TYPE DOPING
Light emitting diodes re described. In an embodiment, an LED includes a graded p-side spacer layer on a p-type confinement layer, and the graded p-side spacer...
2018/0212096 MICRO LIGHT EMITTING DIODE AND METHOD OF FORMING THE SAME
The present disclosure proposes a micro LED and a method of forming the same. After a body of layers to structure a PN junction is formed sequentially on the...
2018/0212095 METHOD OF MANUFACTURING SOLAR CELL
A method of manufacturing a solar cell includes forming a photoelectric converter including an amorphous semiconductor layer, forming an electrode connected to...
2018/0212094 INTERDIGITATED BACK CONTACT HETEROJUNCTION PHOTOVOLTAIC DEVICE WITH A FLOATING JUNCTION FRONT SURFACE FIELD
A photovoltaic device includes a crystalline substrate having a first dopant conductivity, an interdigitated back contact and a front surface field structure....
2018/0212093 PRESSURIZED HEATED ROLLING PRESS FOR MANUFACTURE AND METHOD OF USE
A system for connecting photovoltaic cells is disclosed. The system comprises a flexible component feeder source for feeding the photovoltaic cells to a...
2018/0212092 Adhesive Layer For Printed CIGS Solar Cells
An adhesive layer in a copper indium gallium selenide (CIGS) solar cell is provided between the main CIGS layer and molybdenum film to avoid delamination of...
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