Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2018/0219000 Protective Layer for Contact Pads in Fan-out Interconnect Structure and Method of Forming Same
In accordance with a method embodiment includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die...
2018/0218999 DIRECT BONDING METHOD
A bonding between a first substrate and a second substrate, the method includes the steps of: a) providing the first substrate and the second substrate, b)...
2018/0218998 STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
A method of making an assembly can include juxtaposing a top surface of a first electrically conductive element at a first surface of a first substrate with a...
2018/0218997 METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND
A method for direct bonding an electronic chip onto a substrate or another electronic chip, the method including: carrying out a hydrophilic treatment of a...
2018/0218996 Method For Producing Wire Bond Connection And Arrangement For Implementing The Method
Method for producing wire bond connections between an electronic component or a module and a substrate with energy input into a bonding wire by an ultrasonic...
2018/0218995 METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
A method for manufacturing a light-emitting device includes: a first connecting step of forming a ball portion of the wire joined to a first connecting point...
2018/0218994 ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING CONNECTION...
To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive...
2018/0218993 METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal...
2018/0218992 Semiconductor Device, Method for Fabricating a Semiconductor Device and Method for Reinforcing a Die in a...
A semiconductor device includes a semiconductor die having a first main face, a second main face and side faces connecting the first main face and the second...
2018/0218991 METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURE FOR JOINING WAFERS AND RESULTING STRUCTURE
The disclosure is directed to an integrated circuit structure for joining wafers and methods of forming same. The IC structure may include: a metallic pillar...
2018/0218990 BUMP-FORMING FILM, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND CONNECTION STRUCTURE
A bump-forming film is used for forming, on a semiconductor device such as a bumpless IC chip, bumps which are low in cost and can achieve stable conduction...
2018/0218989 Semiconductor Device and Method of Manufacture
A redistribution layer with a landing pad is formed over a substrate with one or more mesh holes extending through the landing pad. The mesh holes may be...
2018/0218988 ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY
Systems and methods are disclosed for providing an interconnection for extending high-temperature use in sensors and other electronic devices. The...
2018/0218987 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device is provided. The semiconductor device includes an electrode pad provided above a semiconductor substrate; and a wire bonded on the...
2018/0218986 PATCH ON INTERPOSER PACKAGE WITH WIRELESS COMMUNICATION INTERFACE
A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the...
2018/0218985 Backside Redistribution Layer (RDL) Structure
An embodiment package on package (PoP) device includes a molding compound having a metal via embedded therein, a passivation layer disposed over the molding...
2018/0218984 SENSOR SHIELDING FOR HARSH MEDIA APPLICATIONS
A sensor device for use in harsh media, comprising a silicon die comprises a lowly doped region, and a contact layer, contacting the silicon die. The contact...
2018/0218983 Eliminate Sawing-Induced Peeling Through Forming Trenches
A package includes a device die, a molding material encircling the device die, wherein a top surface of the molding material is substantially level with a top...
2018/0218982 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device according to present embodiment has first wirings provided in a first area and made of a first metal. A first gap is provided between...
2018/0218981 CIRCUIT DESIGN HAVING ALIGNED POWER STAPLES
A multi-layer integrated circuit structure includes (among other components) a first layer having gate conductors, a second layer having M0 conductors, a third...
2018/0218980 Semiconductor Devices Including a Capping Layer
Methods of forming a semiconductor device are provided. A method of forming a semiconductor device may include forming a capping layer on a metal pattern and...
2018/0218979 VERTICALLY INTEGRATED NANOSHEET FUSE
Embodiments are directed to a method and resulting structures for forming a semiconductor device having a vertically integrated nanosheet fuse. A nanosheet...
2018/0218978 VERTICALLY INTEGRATED NANOSHEET FUSE
Embodiments are directed to a method and resulting structures for forming a semiconductor device having a vertically integrated nanosheet fuse. A nanosheet...
2018/0218977 ANTIFUSE ELEMENT USING SPACER BREAKDOWN
Techniques and circuitry are disclosed for efficiently implementing programmable memory array circuit architectures, including both non-volatile and volatile...
2018/0218976 Enhancing Integrated Circuit Density with Active Atomic Reservoir
Methods are disclosed herein for fabricating integrated circuit interconnects that can improve electromigration. An exemplary method includes forming a first...
2018/0218975 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate and a semiconductor layer formed on...
2018/0218974 WIRING BOARD AND ELECTRONIC PACKAGE
A wiring board and an electronic package maintain the flatness of the surface of the wiring board. The wiring board includes a flat insulating layer having a...
2018/0218973 METAL ON BOTH SIDES WITH POWER DISTRIBUTED THROUGH THE SILICON
An apparatus including a circuit structure including a device stratum; and a contact coupled to a supply line and routed through the device stratum and coupled...
2018/0218972 WIRING SUBSTRATE
A wiring substrate includes a first substrate and a second substrate stacked on the first substrate. The first substrate includes a first adhesive layer and...
2018/0218971 METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and...
2018/0218970 METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and...
2018/0218969 SEMICONDUCTOR DEVICE
The semiconductor device of the present invention is a semiconductor device in which a first semiconductor chip including a first field effect transistor for a...
2018/0218968 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
To increase a current that can be supplied to an electronic element mounted on an upper surface of a semiconductor package. An electronic device includes a...
2018/0218967 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the...
2018/0218966 SEMICONDUCTOR DEVICES INCLUDING THROUGH-SILICON-VIAS AND METHODS OF MANUFACTURING THE SAME AND SEMICONDUCTOR...
A semiconductor device can include a substrate that has a surface. A via structure can extend through the substrate toward the surface of the substrate, where...
2018/0218965 THYRISTOR ASSEMBLY RADIATOR FOR DC CONVERTER VALVE
A thyristor assembly radiator for a DC converter valve. A water discharging port of an N.sup.th radiator is communicated with a water discharging port of an...
2018/0218964 IMMERSION COOLING ARRANGEMENTS FOR ELECTRONIC DEVICES
An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic...
2018/0218963 Power Module
An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation...
2018/0218962 LOW THERMAL RESISTANCE HANGING DIE PACKAGE
Embodiments herein generally relate to the field of package assembly to facilitate thermal conductivity. A package may have a hanging die, and attach to a...
2018/0218961 High Power Gallium Nitride Devices and Structures
Described herein are semiconductor devices and structures with improved power handling and heat dissipation. Embodiments are suitable for implementation in...
2018/0218960 SEMICONDUCTOR DEVICE
A semiconductor device includes a first metal plate and a second metal plate which interpose a first semiconductor element therebetween, the first metal plate...
2018/0218959 SEMICONDUCTOR DEVICE
An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality...
2018/0218958 Electronic Component Package and Method of Housing an Electronic Component
An electronic component package includes: an electronic component that includes a body, the body having a first main surface that is convexly curved along a...
2018/0218957 POWER SEMICONDUCTOR MODULE
The present invention discloses a power semiconductor module, comprising: a substrate; a semiconductor provided on a top side of the substrate; and a package...
2018/0218956 ELECTRIC CIRCUIT MODULE AND TEST METHOD OF ELECTRIC CIRCUIT MODULE
An electric circuit module 100 is provided. The electric circuit module 100 includes a multi-layer substrate 10, and a plurality of electric parts 31 mounted...
2018/0218955 AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THERMAL PERFORMANCE
The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, a...
2018/0218954 PREFORM FOR SEMICONDUCTOR ENCAPSULATION
Disclosed is a preform for semiconductor encapsulation, mainly containing a metal or alloy, the metal or alloy further containing Sn or Sn alloy, and, Cu or Cu...
2018/0218953 SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad...
2018/0218952 PICKING UP IRREGULAR SEMICONDUCTOR CHIPS
A chip pickup system is provided. The chip pickup system includes a detector for detecting a position of an irregular semiconductor chip on a holder. The...
2018/0218951 PATTERN FORMATION METHOD, IMPRINT DEVICE, AND COMPUTER-READABLE NON-VOLATILE STORAGE MEDIUM STORING DROP RECIPE...
According to one embodiment, a pattern formation method includes correcting, based on a relationship between a residual film thickness of an imprint pattern...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.