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Patent # Description
2018/0254276 SEMICONDUCTOR DEVICE
The semiconductor devise includes a first inverter and a second inverter which is connected thereto in series. Each of the first and the second inverters...
2018/0254275 SPACER FOR TRENCH EPITAXIAL STRUCTURES
The disclosure relates to a structure and methods of forming spacers for trench epitaxial structures. The method includes: forming a spacer material between...
2018/0254274 SPACER FOR TRENCH EPITAXIAL STRUCTURES
The disclosure relates to a structure and methods of forming spacers for trench epitaxial structures. The method includes: forming a spacer material between...
2018/0254273 FINFET WITH UNIFORM SHALLOW TRENCH ISOLATION RECESS
Disclosed herein are processes and structures for uniform STI recessing. A method of making a semiconductor device includes initially forming a dense region of...
2018/0254272 PROCESS ENHANCEMENT USING DOUBLE SIDED EPITAXIAL ON SUBSTRATE
Disclosed examples include semiconductor devices and fabrication methods to fabricate semiconductor wafers and integrated circuits, including forming a first...
2018/0254271 Semiconductor Devices Including Resistors
A semiconductor device is provided including a resistor structure on a semiconductor substrate. The resistor structure includes pad portions and a resistor...
2018/0254270 COMPACT PROTECTION DEVICE FOR PROTECTING AN INTEGRATED CIRCUIT AGAINST ELECTROSTATIC DISCHARGE
An integrated circuit includes a power supply terminal, a reference terminal, and a signal terminal. A first protection device is coupled between the signal...
2018/0254269 CIRCUIT OVERVOLTAGE PROTECTION
An electronic circuit includes an electronic device, an input/output terminal, and a protection device. The electronic device includes a signal terminal to...
2018/0254268 ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND MANUFACTURING METHOD THEREOF
An ESD protection device includes a semiconductor substrate, a well, a gate structure, a first source/drain region, a second source/drain region, a first doped...
2018/0254267 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device that includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a...
2018/0254266 LED LIGHT SOURCE COMPRISING AN ELECTRONIC CIRCUIT
An electroluminescent light source including light-emitting diodes arranged on a substrate made of silicon. The light source integrates an electronic circuit...
2018/0254265 MICRO- OR NANO-WIRE LED LIGHT SOURCE COMPRISING TEMPERATURE MEASUREMENT MEANS
An electroluminescent light source including light-emitting rods of submillimetric size projecting from a substrate and distributed into a plurality of...
2018/0254264 LIGHT-EMITTING COMPONENT AND METHOD FOR PRODUCING A LIGHT-EMITTING COMPONENT
The invention relates to a component with at least one optoelectronic semiconductor chip (42), comprising: --a connection substrate (4), which has an assembly...
2018/0254263 LIGHT-EMITTING DEVICE
A light-emitting device is provided whose color mixing property and light emission efficiency are improved, while white light with high color rendering...
2018/0254262 STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MODULES
In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply...
2018/0254261 SEMICONDUCTOR PACKAGES HAVING ASYMMETRIC CHIP STACK STRUCTURE
A semiconductor package may include first chip stack including first chips which are stacked on a package substrate and offset to form a first reverse stepwise...
2018/0254260 Chip Package Having Die Structures of Different Heights and Method of Forming Same
Structures and formation methods of a chip package are provided. The chip package includes a substrate, a first chip stack attached to the substrate, and a...
2018/0254259 SEMICONDUCTOR DEVICE AND METHOD OF FORMING WLCSP
A semiconductor substrate contains a plurality of semiconductor die with a saw street between the semiconductor die. A plurality of bumps is formed over a...
2018/0254258 METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANUFACTURE OF AN INTEGRATED CIRCUIT
The invention relates to a method for integrating at least one interconnection for the manufacture of an integrated circuit, including a step of depositing at...
2018/0254257 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE
A package structure includes a die, a first insulating layer and a first conductive layer. The die includes a first alignment pattern. The first insulating...
2018/0254256 ELECTRONIC ASSEMBLY USING BISMUTH-RICH SOLDER
Some forms relate to an electronic assembly includes a first substrate that has a copper pad mounted to the first substrate. The electronic assembly further...
2018/0254255 METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
A method for producing a semiconductor package is a method for producing a semiconductor package in which a plurality of semiconductor chips, each of which...
2018/0254254 COPPER PILLAR BUMP STRUCTURE AND MANUFACTURING METHOD THEREFOR
A method for manufacturing a metal bump device includes providing a substrate structure including a substrate and a metal layer having a recess on the...
2018/0254253 Package with Different Types of Semiconductor Dies Attached to a Flange
A multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the thermally...
2018/0254252 SEMICONDUCTOR DEVICE
A semiconductor device includes a wiring substrate including a first surface and a second surface opposite to the first surface, a semiconductor chip including...
2018/0254251 ELECTRONIC COMPONENT MOUNTING BOARD AND ELECTRONIC DEVICE
An electronic component mounting board includes an inorganic substrate, a wiring board, and a bond. The inorganic substrate includes an electronic component...
2018/0254250 SUBSTRATE STRUCTURE, ELECTRONIC PACKAGE HAVING THE SAME, AND METHOD FOR FABRICATING THE SAME
A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of...
2018/0254249 SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI) COMPARTMENT SHIELDING FOR COMPONENTS...
A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The...
2018/0254248 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
An electronic device includes a semiconductor memory, wherein the semiconductor memory may include: a cell mat disposed over a substrate, the cell mat...
2018/0254247 THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
A three-dimensional (3D) semiconductor device includes a substrate having a cell array region and a peripheral circuit region. A cell array structure is in the...
2018/0254246 INTEGRATED CIRCUIT DEVICE
An integrated circuit device includes an insulating film on a substrate, a lower wiring layer penetrating at least a portion of the insulating film, the lower...
2018/0254245 WIRING WITH EXTERNAL TERMINAL
Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a pad formation area including a plurality...
2018/0254244 MEMORY AND FABRICATION METHOD THEREOF
A memory and a method for fabricating the memory are provided. The memory includes a bit-line layer on a semiconductor substrate and having bit lines arranged...
2018/0254243 SEMICONDUCTOR PACKAGE AND RELATED METHODS
Implementations of semiconductor packages may include: a prefabricated electrically conductive section; two or more metal oxide semiconductor field effect...
2018/0254242 ENHANCED SELF-ALIGNMENT OF VIAS FOR A SEMICONDUCTOR DEVICE
A method of forming a self-aligned pattern of vias in a semiconductor device comprises etching a pattern of lines that contain notches that are narrower than...
2018/0254241 ISOLATING ELECTRIC PATHS IN SEMICONDUCTOR DEVICE PACKAGES
Methods, systems, and apparatus for reducing power consumption or signal distortions in a semiconductor device package. The semiconductor device package...
2018/0254240 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGING DEVICE, AND METHOD FOR FORMING THE SAME
A semiconductor substrate includes a first dielectric layer, a first patterned conductive layer disposed in the first dielectric layer, a second dielectric...
2018/0254239 FORMING METAL CAP LAYER OVER THROUGH-GLASS-VIAS (TGVs)
Methods for reliable interconnect structures between thin metal capture pads and TGV metallization and resulting devices are provided. Embodiments include...
2018/0254238 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
At least some embodiments of the present disclosure relate to a substrate for packaging a semiconductor device. The substrate includes a first dielectric layer...
2018/0254237 SYSTEM WITH PROVISION OF A THERMAL INTERFACE TO A PRINTED CIRCUIT BOARD
Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for...
2018/0254236 CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING AND USING THEREOF
Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and...
2018/0254235 Structure
An object of the present invention is to provide a structure, particularly, a power semiconductor module, which suppresses a bypass flow of a cooling medium...
2018/0254234 FLEXIBLE INTEGRATED HEAT SPREADER
A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat...
2018/0254233 POWER SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE
The present application relates to a power semiconductor device, including a substrate having a first side and a second side, the first side and the second...
2018/0254232 ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
The disclosure provides an electronic package and a method of manufacturing the same. The method is characterized by encapsulating an electronic component with...
2018/0254231 SEMICONDUCTOR DEVICE, MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR...
A semiconductor device includes: a semiconductor element; a frame which has a first surface, holds the semiconductor element on the first surface, and is...
2018/0254230 METHODS AND APPARATUS PROVIDING A GRADED PACKAGE FOR A SEMICONDUCTOR
Methods and apparatus providing a graded package for a semiconductor are disclosed. An example apparatus includes a die; and a graded package encapsulating the...
2018/0254229 MILLIMETER WAVE SEMICONDUCTOR APPARATUS
A millimeter wave semiconductor apparatus includes: a module substrate including the millimeter wave semiconductor chip mounted thereon; and a waveguide tube...
2018/0254228 SEMICONDUCTOR POWER MODULE AND POWER CONVERSION APPARATUS
A semiconductor power module includes: an insulating substrate including a concave portion provided on a top surface of the insulating substrate; a substrate...
2018/0254227 ELECTRICAL TESTING METHOD OF INTERPOSER
An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the...
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