Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2018/0254226 IMAGE DISPLAY DEVICE
A base substrate include a first substrate (110) having a first principal surface (110a) and a second principal surface (110b), and a first wiring member...
2018/0254225 METHOD AND SYSTEM OF MEASURING SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
The measurement method may include obtaining first measurement data from a recess region formed in a semiconductor substrate, obtaining second measurement data...
2018/0254224 HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS OF LIGHT IRRADIATION TYPE
A front surface of a semiconductor wafer is rapidly heated by irradiation of a flash of light. Temperature of the front surface of the semiconductor wafer is...
2018/0254223 SEMICONDUCTOR INGOT INSPECTING METHOD AND APPARATUS, AND LASER PROCESSING APPARATUS
Disclosed herein is an inspecting method for a semiconductor ingot in which modified layers parallel to an upper surface of the ingot and cracks extending from...
2018/0254222 SUBSTRATE PROCESSING SYSTEM, CONTROL DEVICE, AND SUBSTRATE PROCESSING METHOD
Disclosed is a substrate processing system capable of performing an etching processing collectively on a plurality of substrates accommodated in a processing...
2018/0254221 APPARATUS AND METHOD FOR WAFER THINNING IN ADVANCED PACKAGING APPLICATIONS
A system and method are provided for etching semiconductor wafers (integrated circuit substrates) with advanced packaging using a two-step wet etching process....
2018/0254220 TRENCH GATE FIRST CMOS
After forming an interlevel dielectric (ILD) layer over a semiconductor material portion located on a substrate, a gate trench is formed extending through the...
2018/0254219 METHODS OF MANUFACTURING FINFET SEMICONDUCTOR DEVICES
In a method of manufacturing a semiconductor device, first to third active fins are formed on a substrate. Each of the first to third active fins extends in a...
2018/0254218 INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH FABRICATION OF VERTICAL FIELD EFFECT TRANSISTORS
Device and methods are provided for fabricating semiconductor devices in which metal-insulator-metal (MIM) capacitor devices are integrally formed with...
2018/0254217 SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDUCTOR DIE
A first semiconductor substrate contains a first semiconductor material, such as silicon. A second semiconductor substrate containing a second semiconductor...
2018/0254216 SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING
A semiconductor device may comprise a semiconductor die comprising an active surface and contact pads disposed. Conductive interconnects comprising first ends...
2018/0254215 Method for Dicing a Substrate with Back Metal
The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a...
2018/0254214 INTEGRATED CIRCUITS HAVING PARALLEL CONDUCTORS AND THEIR FORMATION
Integrated circuits, as well as methods of their formation, include a first conductive structure at a first level of the integrated circuit, a second...
2018/0254213 MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at...
2018/0254212 Interconnect Structure That Avoids Insulating Layer Damage and Methods of Making the Same
A method for forming an interconnect structure includes forming an insulating layer on a substrate. A damascene opening is formed through a thickness portion...
2018/0254211 ELECTROSTATIC CHUCK DEVICE
An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic...
2018/0254210 WAFER TRANSFER METHOD AND WAFER TRANSFER DEVICE
A wafer transfer method which transfers a wafer with a disc shape to a groove for vertically placing the wafer therein, by use of a wafer holding hand,...
2018/0254209 GAS INJECTION DEVICE
There is provided a gas injection device configured to prevent entry of atmospheric air when charging gas into a FOUP. In order to realize such a gas injection...
2018/0254208 IN-SITU TEMPERATURE MEASUREMENT FOR INSIDE OF PROCESS CHAMBER
Apparatuses and methods for in-situ temperature measurement of a process chamber are described herein. A process chamber includes an infrared (IR) sensor...
2018/0254207 AMBIENT CONTROLLED TRANSFER MODULE AND PROCESS SYSTEM
Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer...
2018/0254206 ROTOR COVER
Implementations described herein generally relate to a processing apparatus having a rotor cover for preheating the process gas. The apparatus includes a...
2018/0254205 SUBSTRATE HEATING DEVICE, SUBSTRATE HEATING METHOD AND COMPUTER-READABLE STORAGE MEDIUM
A substrate heating device includes: heating modules each having a processing vessel within which a heating plate is disposed, an gas inlet port for...
2018/0254204 SUBSTRATE HEATING APPARATUS WITH ENHANCED TEMPERATURE UNIFORMITY CHARACTERISTIC
The present invention relates to a substrate heating apparatus. More specifically, the present invention relates to a substrate heating apparatus including a...
2018/0254203 APPARATUS AND METHOD TO REDUCE PARTICLE FORMATION ON SUBSTRATES IN POST SELECTIVE ETCH PROCESS
The present disclosure generally relates to apparatuses and methods for reducing particle contamination on substrate surfaces. In one example, the apparatus is...
2018/0254202 DISPENSE NOZZLE WITH A SHIELDING DEVICE
Provided is a nozzle system for dispensing a dispense chemical onto a substrate, the system comprising: a nozzle comprising a nozzle body and a nozzle tip; a...
2018/0254201 METHOD FOR PROCESSING A SUBSTRATE HAVING A DISK-SHAPE WITH A SINGLE-WAFER TYPE PROCESS DEVICE
A single-wafer substrate processing device is provided which does not spill a processing liquid and the vapors thereof to an exterior when directly supplying...
2018/0254200 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus according to an exemplary embodiment to the present disclosure includes: a main body which has therein a processing space...
2018/0254199 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a holding device that holds a substrate horizontally, a rotation device that rotates the holding device such that the...
2018/0254198 MOLD
A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first...
2018/0254197 METHOD OF ENCAPSULATING A SUBSTRATE
A method of encapsulating a substrate is disclosed, in which the substrate has at least the following layers: a CMOS device layer, a layer of first...
2018/0254196 POLISHING METHOD, POLISHING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM
A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate...
2018/0254195 PULSING RF POWER IN ETCH PROCESS TO ENHANCE TUNGSTEN GAPFILL PERFORMANCE
Methods and apparatuses for filling features with metal materials such as tungsten-containing materials in a substantially void-free manner are provided. In...
2018/0254194 GETTERING LAYER FORMATION AND SUBSTRATE
An integrated circuit (IC) device may include a substrate having an active device layer. The integrated circuit may also include a first defect layer. The...
2018/0254193 POLISHING SLURRY FOR COBALT-CONTAINING SUBSTRATE
The invention is an aqueous slurry useful for chemical mechanical polishing a semiconductor substrate having cobalt or cobalt alloy containing features...
2018/0254192 METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT AND PROCESSING SYSTEM
According to a mode of the present invention, a method of manufacturing an electronic component includes: preparing a component main-body 110 including a first...
2018/0254191 PROCESS FOR PERFORMING SELF-LIMITED ETCHING OF ORGANIC MATERIALS
A method and apparatus for selectively etching an organic material on a substrate is described. The method and apparatus includes forming a first ...
2018/0254189 HIGH-CHI BLOCK COPOLYMERS WITH TUNABLE GLASS TRANSITION TEMPERATURES FOR DIRECTED SELF-ASSEMBLY
Directed self-assembly (DSA) using block copolymers (BCPs) is emerging as a viable alternative to photolithography for creating features 10 nm and smaller....
2018/0254188 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
A semiconductor device includes a gate structure extending in a second direction on a substrate, a source/drain layer disposed on a portion of the substrate...
2018/0254187 CHARGE-TRAP LAYER SEPARATION AND WORD-LINE ISOLATION IN A 3-D NAND STRUCTURE
In a 3D NAND device, the charge trap region of a memory cell is formed as a separate charge-trap "island." As a result, the charge-trap region of one memory...
2018/0254186 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MANUFACTURING SAME
A method for manufacturing a semiconductor device includes introducing a group III element to a part of a substrate containing silicon and carbon; introducing...
2018/0254185 REDUCTION IN THE ANNEALING TEMPERATURE OF AN IGZO LAYER OBTAINED BY SOL GEL
The present application relates to a method for forming an active zone of metal oxide for an electronic component including the formation of a stack of IXZO...
2018/0254184 NANOWIRE EPITAXY ON A GRAPHITIC SUBSTRATE
A composition of matter comprising at least one nanowire on a graphitic substrate, said at least one nanowire having been grown epitaxially on said substrate,...
2018/0254183 METHOD OF PREPARING NITROGEN-DOPED GRAPHENE
An exemplary method of preparing nitrogen-doped graphene whereby it is possible to synthesize graphene having an improved surface coverage and a uniform single...
2018/0254182 SURFACE TREATMENT METHOD AND SURFACE TREATMENT LIQUID
To provide a surface treatment method capable of highly hydrophobizing (silylating) a surface of a treatment target while deterioration of polyvinyl chloride...
2018/0254181 METHOD OF MANUFACTURING RUTHENIUM WIRING
A first aspect of the present disclosure provides a ruthenium wiring manufacturing method of manufacturing a ruthenium wiring by filling a recess, with respect...
2018/0254180 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus of an exemplary embodiment includes a liquid processing unit, a detection unit, and a post-processing unit. The liquid...
2018/0254179 Surface-Selective Atomic Layer Deposition Using Hydrosilylation Passivation
Methods for selectively depositing films by atomic layer deposition are disclosed. Substrate surfaces are passivated by hydrosilylation to prevent deposition...
2018/0254178 METHOD AND DEVICE FOR ION MOBILITY SEPARATION
Methods and devices for ion separations or manipulations in gas phase are disclosed. The device includes a non-planar surface having a first, second and third...
2018/0254177 FABRICATION OF MASS SPECTROMETRY SURFACE
Disclosed herein are compositions for ionizing a target and methods for making the compositions. In some embodiments, the compositions can include a structured...
2018/0254176 APPARATUS AND METHOD FOR MASS SPECTROMETRY
An apparatus for mass spectrometry comprises a portion generator (10) for creating localized analyte portions in synchronization with trigger pulses, a...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.