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Patent # Description
2018/0308732 Combination Vacuum And Over-Pressure Process Chamber And Methods Related Thereto
A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double...
2018/0308731 CONTENT MOVING DEVICE
Reliability in the restriction of the movement of a container is improved. A content moving device 1 includes: a table portion 20 on which a container 50 is...
2018/0308730 PROCESSING APPARATUS, ABNORMALITY DETECTION METHOD, AND STORAGE MEDIUM
A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a...
2018/0308729 Hybrid substrate processing system for dry and wet process and substrate processing method thereof
The substrate can be selectively transferred by a vacuum or edge grip method according to the process characteristics, using a single substrate transfer robot...
2018/0308728 METHOD AND APPARATUS FOR SUBSTRATE TRANSPORT
A substrate processing apparatus includes a linearly elongated substantially hexahedron shaped substrate transport chamber having linearly elongated sides of...
2018/0308727 COMPONENT HANDLING SYSTEM
A component-handling device for removing components from a structured component supply and for depositing the removed components at a receiving device. A first...
2018/0308726 ROD-SHAPED LAMP AND HEAT TREATMENT APPARATUS
Halogen lamps arranged in two, upper and lower, tiers to intersect each other in a lattice pattern are provided under a chamber for receiving a semiconductor...
2018/0308725 LASER ANNEALING APPARATUS
A laser annealing apparatus includes a laser oscillating structure, an oscillator, a beam expanding telescope, a first power meter, and a second power meter....
2018/0308724 APPARATUS AND METHOD FOR PROCESSING WAFER
An apparatus for processing a wafer includes a process chamber, a wafer support, a heat source, and a movable device. The wafer support is in the process...
2018/0308723 SUBSTRATE HEATING DEVICE
A substrate heating device includes: a heating plate for heating a first substrate mounted thereon; a cooling plate installed adjacent to the heating plate and...
2018/0308722 CERAMIC MEMBER
A ceramic heater includes an RF plate having a placement surface on which a wafer is to be placed, and made of a ceramic sintered body in which an RF electrode...
2018/0308721 Frame Cassette for Holding Tape-Frames
According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality...
2018/0308720 SYSTEMS AND METHODS FOR TREATING SUBSTRATES WITH CRYOGENIC FLUID MIXTURES
Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for...
2018/0308719 Liquid Processing Apparatus
A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding...
2018/0308718 SEMICONDUCTOR WAFER PROCESSING CHAMBER
A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet. The chamber exhaust outlet is...
2018/0308717 WATER JET PROCESSING APPARATUS
Disclosed herein is a water jet processing apparatus including a chuck table that holds a workpiece by a holding surface, a high-pressure water injection unit...
2018/0308716 SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING APPARATUS, METHOD FOR MANUFACTURING CLEANED SUBSTRATE AND...
A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member...
2018/0308715 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
In parallel with a substrate heating step, a liquid surface sensor is used to monitor the raising of an IPA liquid film. An organic solvent removing step is...
2018/0308714 Mould, Carrier with Encapsulated Electronic Components, Separated Encapsulated Electronic Component and Method...
The invention relates to a mould for encapsulating electronic components mounted on a carrier, with at least two mould parts which are displaceable relative to...
2018/0308713 Systems And Methods For Improved Delamination Characteristics In A Semiconductor Package
Systems and methods are provided for producing an integrated circuit package, e.g., an SOIC package, having reduced or eliminated lead delamination caused by...
2018/0308712 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this...
2018/0308711 WORKPIECE PROCESSING METHOD
A processing method for a plate-shaped workpiece that has a transparent substrate, a first resin layer stacked on a front surface of the substrate, and a...
2018/0308710 ROUTABLE ELECTROFORMING SUBSTRATE COMPRISING REMOVABLE CARRIER
A routable electroforming substrate for assembling a semiconductor package is manufactured by providing a carrier and plating a patterned first metallic layer...
2018/0308709 TITANIUM SILICIDE REGION FORMING METHOD
A titanium silicide region forming method includes: performing a pretreatment to expose a clean surface of a silicon layer of a workpiece; forming a...
2018/0308708 STRUCTURES, METHODS AND APPLICATIONS FOR ELECTRICAL PULSE ANNEAL PROCESSES
Structures and methods are provided for nanosecond electrical pulse anneal processes. The method of forming an electrostatic discharge (ESD) N+/P+ structure...
2018/0308707 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Provided is a semiconductor manufacturing apparatus including: a container in which a processing chamber is installed; a stage installed in the processing...
2018/0308706 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
When a silicon concentration of a phosphoric acid aqueous solution inside a tank reaches an upper limit value of a specified concentration range, the...
2018/0308705 METHOD OF FABRICATING PATTERN STRUCTURE
A method includes forming mask patterns spaced apart from each other by at least one opening on an etch target layer, filling the opening with a block...
2018/0308704 WAFER ELEMENT WITH AN ADJUSTED PRINT RESOLUTION ASSIST FEATURE
A wafer element fabrication method is provided. The wafer element fabrication method includes forming a device element on a substrate such that the device...
2018/0308703 WAFER ELEMENT WITH AN ADJUSTED PRINT RESOLUTION ASSIST FEATURE
A wafer element fabrication method is provided. The wafer element fabrication method includes forming a device element on a substrate such that the device...
2018/0308702 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a non-insulator structure, at least one carbon nano-tube (CNT), a dielectric layer, and a graphene-based conductive layer. The...
2018/0308701 METHODS AND APPARATUS FOR FORMING SMOOTH AND CONFORMAL COBALT FILM BY ATOMIC LAYER DEPOSITION
Provided herein are atomic layer deposition (ALD) methods of depositing cobalt in a feature. The methods involve two-step surface treatments during an ALD...
2018/0308700 SEMICONDUCTOR DEVICE
A semiconductor device includes a substrate, a dielectric layer and a floating gate. The dielectric layer disposed on the substrate. The floating gate disposed...
2018/0308699 GATE FILL UTILIZING REPLACEMENT SPACER
A method of forming a semiconductor structure includes forming outer spacers surrounding a dummy gate, the dummy gate being disposed over a channel stack...
2018/0308698 APPARATUS AND METHOD FOR NEUTRON TRANSMUTATION DOPING OF SEMICONDUCTOR WAFERS
In various embodiments, a method of processing one or more semiconductor wafers is provided. The method includes positioning the one or more semiconductor...
2018/0308697 SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
Present disclosure provides a method for manufacturing a semiconductor wafer with an epitaxial layer at a front surface of the semiconductor wafer, including...
2018/0308696 LOW CONTACT RESISTANCE GRAPHENE DEVICE INTEGRATION
An electronic device has a graphene layer having one or more atomic layers of graphene, with low resistance contacts that includes a carbon-doped metal layer...
2018/0308695 ATOMIC LAYER ETCH, REACTIVE PRECURSORS AND ENERGETIC SOURCES FOR PATTERNING APPLICATIONS
Methods and apparatuses for patterning carbon-containing material over a layer to be etched are provided herein. Methods involve trimming carbon-containing...
2018/0308694 Selective Deposition Of Tungsten For Simplified Process Flow Of Tungsten Oxide Pillar Formation
Methods comprising depositing a film material to form an initial film in a trench in a substrate surface are described. The film is treated to expand the film...
2018/0308693 SILICON-BASED DEPOSITION FOR SEMICONDUCTOR PROCESSING
A method for processing a stack with a carbon based patterned mask is provided. The stack is placed in an etch chamber. A silicon oxide layer is deposited by...
2018/0308692 CRYSTALLINE TRANSITION METAL DICHALCOGENIDE FILMS AND METHODS OF MAKING SAME
Methods of making molybdenum sulfide (MoS.sub.2) on a stretchable substrate are disclosed. The method includes magnetron sputtering MoS.sub.2 onto a...
2018/0308691 POROUS FIN AS COMPLIANT MEDIUM TO FORM DISLOCATION-FREE HETEROEPITAXIAL FILMS
A method for forming a heteroepitaxial layer includes forming an epitaxial grown layer on a monocrystalline substrate and patterning the epitaxial grown layer...
2018/0308690 DENSIFYING FILMS IN SEMICONDUCTOR DEVICE
Methods of densifying films, cross-linking films, and controlling the stress of films are provided herein. Methods include forming a removable film on a...
2018/0308689 System and Method of Forming a Porous Low-K Structure
The present disclosure involves forming a porous low-k dielectric structure. A plurality of conductive elements is formed over the substrate. The conductive...
2018/0308688 FILM DEPOSITION METHOD
A film deposition method is provided. In the method, an aminosilane gas is adsorbed on a surface of a substrate including a recess pattern. Next, a silicon...
2018/0308687 EUV PHOTOPATTERNING AND SELECTIVE DEPOSITION FOR NEGATIVE PATTERN MASK
Process and apparatus for forming a negative patterning mask in the context of EUV patterning uses a selective deposition process to deposit a metal oxide or...
2018/0308686 SOURCE/DRAIN PERFORMANCE THROUGH CONFORMAL SOLID STATE DOPING
A method for improving source/drain performance through conformal solid state doping and its resulting device are disclosed. Specifically, the doping takes...
2018/0308684 A METHOD OF PRODUCING A TWO-DIMENSIONAL MATERIAL
A method of producing graphene or other two-dimensional material such as graphene including heating the substrate held within a reaction chamber to a...
2018/0308683 Wafer Washing Method, and Liquid Chemical Used in Same
To provide a water-repellent protective film-forming liquid chemical used in a process of cleaning a wafer by means of a cleaning machine whose liquid contact...
2018/0308682 METHOD AND APPARATUS FOR A SEMICONDUCTOR-ON-HIGHER THERMAL CONDUCTIVE MULTI-LAYER COMPOSITE WAFER
A method for fabricating a cost-effective semiconductor on higher-thermal conductive multilayer (ML) composite wafer, the method comprising the steps of:...
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