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| Patent # | Description |
|---|---|
| US-9,392,736 |
Methods for producing image sensors having multi-purpose architectures A charge-coupled device (CCD) image sensor includes multiple vertical charge-coupled device (VCCD) shift registers and independently-controllable gate... |
| US-9,392,735 |
Magnetic field shielding sheet for digitizer and method of manufacturing
the same and portable terminal device... A magnetic field shielding sheet includes: at least one layer thin magnetic sheet made of a Fe-based amorphous alloy and flake-treated so as to be separated... |
| US-9,392,734 |
Security wrapper for an electronic assembly and methods for forming such a
wrapper A security wrapper for an electronic assembly and methods for forming such a wrapper are provided. A first wrap layer and/or a second wrap layer may be made... |
| US-9,392,733 |
Data center cooling A system includes a substantially sealed, substantially airtight cabinet sized for housing a vertical array of heat-producing units, the cabinet having an... |
| US-9,392,732 |
Electronic control unit and rotating electric machine An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the... |
| US-9,392,731 |
Cooling apparatus with dynamic load adjustment A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to... |
| US-9,392,730 |
Systems, structures and materials for electronic device cooling An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The... |
| US-9,392,729 |
Cooling apparatus Exemplary embodiments of the present disclosure are directed to an apparatus including pipes having internal longitudinal walls dividing the pipes into... |
| US-9,392,728 |
Automatic in situ coolant flow control in LFT heat exchanger In association with a liquid flow through a heat exchanger situated to remove heat from electronic devices, a coolant flow control apparatus is provided. The... |
| US-9,392,727 |
Cooled electronic system A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to... |
| US-9,392,726 |
Airflow control system An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned... |
| US-9,392,725 |
Electronics chassis adaptable for forced air or liquid conduction cooling An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of... |
| US-9,392,724 |
Power supply system comprising a power converter unit and a rack A power supply system having a power converter unit and a rack. The rack has a shelf and a shelf connection device. The power converter unit has a housing and a... |
| US-9,392,723 |
Modular application of peripheral panels as security protection screens
with individual locking mechanisms... A rack-based information handling system (RIHS) includes a rack chassis having at least two opposing side panels which are structurally held in place by one or... |
| US-9,392,722 |
Cable backplane assembly and method An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable... |
| US-9,392,721 |
Sliding mechanism with locking function A sliding mechanism with locking function includes a slide frame and a resilient plate. The slide frame includes opposite front and rear ends and an end plate... |
| US-9,392,720 |
Server rack architecture that facilitates reduced current density A server rack with vertically stacked shelves is disclosed. The shelves are used for housing loads (e.g. servers) and power supply units. Thus, both the power... |
| US-9,392,719 |
Surrounding-buckle type mobile hard drive rack A hard drive rack includes a frame and a buckle arm. The frame includes a plurality of plates and at least one insertion opening. A buckle trough is formed on... |
| US-9,392,718 |
Electronic device An electronic device is provided. The electronic device includes a display module, a support plate on which the display module is disposed, and a plurality of... |
| US-9,392,717 |
Display device According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening... |
| US-9,392,716 |
Driver assembly and method for manufacturing the same A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower... |
| US-9,392,715 |
Display device A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the... |
| US-9,392,714 |
Power semiconductor module and method of manufacturing a power
semiconductor A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming... |
| US-9,392,713 |
Low cost high strength surface mount package A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically... |
| US-9,392,712 |
Electrical module and device using the same An electrical module and a device using the same are provided. The electrical module comprises a base, a composite component and a pressing sheet. The composite... |
| US-9,392,711 |
Electrical junction box with built-in isolation transformer An electrical junction box with a built-in isolation transformer is provided. The junction box includes an interior base portion having at least one opening, a... |
| US-9,392,710 |
Waterproof structure for electronic unit A waterproof structure for an electronic unit includes a sub-case that defines an accommodating portion that accommodates a first terminal, and has a cable... |
| US-9,392,709 |
Cold shrinkable primary joint A splice housing is configured to slide over and engage with a metallic connector that couples together cable conductors in an electrical distribution system.... |
| US-9,392,708 |
Modular enclosure An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure.... |
| US-9,392,707 |
Display device Provided is a display device that is exceptionally easy to assemble. A display device includes an electroconductive housing. A case body accommodates the... |
| US-9,392,706 |
Mobile terminal A mobile terminal may be provided that includes a case having a through window formed in front of the case, an optical sensor arranged in the case toward the... |
| US-9,392,705 |
Wiring board with through wiring A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring... |
| US-9,392,704 |
Method of producing resonant patterns adapted to the implementation of RF
passive functions A method for producing one or more radio-frequency resonant patterns on a printed circuit includes a step of cutting one or more resonant patterns directly into... |
| US-9,392,703 |
Pad structure and mounted structure A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of... |
| US-9,392,702 |
Method of manufacturing surface mount device Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a... |
| US-9,392,701 |
Electronic component package An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one... |
| US-9,392,700 |
Transparent conductive film and preparation method thereof A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is... |
| US-9,392,699 |
Printed circuit board and method of manufacturing the same Disclosed herein are a printed circuit board (PCB) and a method of manufacturing the same. The PCB includes a core layer, metal bumps embedded in the core... |
| US-9,392,698 |
Chip-embedded printed circuit board and semiconductor package using the
PCB, and manufacturing method of the PCB A chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB. The semiconductor... |
| US-9,392,697 |
Package and method of manufacturing package thereof A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous... |
| US-9,392,696 |
Semiconductor package A semiconductor package includes a substrate, a first conductive layer, a second conductive layer, a first surface mount device, a second surface mount device... |
| US-9,392,695 |
Electric component module There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a... |
| US-9,392,694 |
Package, electronic device, method of manufacturing electronic device,
electronic apparatus, and mobile body A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole,... |
| US-9,392,693 |
Method for manufacturing printed circuit board with shallow solder pad An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height... |
| US-9,392,692 |
Wiring substrate having border portion separating two side metallic foils
and manufacturing method of wiring... A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating... |
| US-9,392,691 |
Multi-stacked electronic device with defect-free solder connection A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe,... |
| US-9,392,690 |
Method and structure to improve the conductivity of narrow copper filled
vias Techniques for improving the conductivity of copper (Cu)-filled vias are provided. In one aspect, a method of fabricating a Cu-filled via is provided. The... |
| US-9,392,689 |
Metal-clad laminate, method for producing same, and flexible printed board A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a... |
| US-9,392,688 |
Biomass photosensitive material and method for manufacturing the same, and
printed circuit board A method of forming a biomass photosensitive material is provided, which includes (1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer,... |
| US-9,392,687 |
Circuit board A circuit board includes a multi-layer structure, a ceramic member, and a first conductive layer. The multi-layer structure has a thru-hole penetrating two... |
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