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Component mounting system
In a component mounting system, a portable operation terminal is wirelessly connectable to mounting machines. The portable operation terminal includes: a...
Electronic component mounting line and electronic component mounting
Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while...
Information carrying card comprising crosslinked polymer composition, and
method of making the same
The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an...
Heat-dissipating EMI/RFI shield
A heat-dissipating EMI/RFI shield (100) has a shield base (110), a shield cap (130), and a heat sink (150). The shield base has at least one sidewall (112)...
A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating...
Cost-effective cooling method for computer system
A computer system using regular IC or 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant...
3D IC computer system
A computer system includes central processing units designed by using reduced instruction set computing (RISC) strategy, dynamic random access memory (DRAM)...
Inflatable data center
A data center can include an inflatable enclosure in which rack computer systems can be installed and can provide computing capacity. The inflatable enclosure...
System and method for directing exhaust from a modular data center
In accordance with embodiments of the present disclosure, a modular fluid-handling system may comprise a fluid-handling unit and an exhaust duct coupled to and...
Vertical tray structure for rack in data center
Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of...
An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first...
Coolant-cooled heat sink configured for accelerating coolant flow
Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to...
Electric power converter
The passage from a cooling medium inlet to a cooling medium outlet of a cooler includes: an upstream cooling portion and a downstream cooling portion for...
Electronic device and method for controlling temperature of electronic
An object of the present invention is to provide an electronic device in which a temperature control using a cooling fan can be made more efficiently and more...
Modular data center deployment method and system for waterborne data
A modular data center build method and system including pre fabricated data center modules comprised of a plurality of racks, a plurality of rack mounted...
Slide for industrial computer rack
A slide for an industrial computer rack includes a telescopic frame, a pair of fastener sets, a slide set, an automatic locking module and a release module. The...
A tray for bearing different storage units includes a main body and a connecting rod. The main body includes a bottom plate, and the bottom plate has a bearing...
Cable backplane system
A cable backplane system includes a plurality of cable connectors interconnected by cables, each cable connector having a header holding signal contacts at a...
Electrical receptacle controller
A circuit board is used with a duplex receptacle electrical outlet. The circuit includes a first connecting pole configured for placement within a first wire...
A wiring module (1) includes a wiring harness (10) including a plurality of wires (11) and connectors (12) fixed to ends of the respective wires (11) and...
Submersible power distribution system and methods of assembly thereof
A submersible power distribution system is provided. The system includes at least one receptacle configured to be exposed to an underwater environment and a...
Display device, and method and apparatus for manufacturing the same
A display device, and a method and apparatus for manufacturing the display device, are provided. The display device includes a cover window including a curved...
Housing for encasing an electronic device
An apparatus and system for housing a device include a housing that is configured such that a device may be fitted within the housing and thereby be protected,...
Holding device adapted to casing of electronic device and electronic
A holding device adapted to a casing of an electronic device is disclosed. The holding device includes a holding body and at least one tenon structure. The...
Alignment mechanism for cabling to a cylinder head
A canister system having a cylindrical housing, having at least one enclosed end, and a modular electronic rack system disposed within the cylindrical housing....
Parallelism stabilization structure of dual-shaft hinge
A parallelism stabilization structure of dual-shaft hinge is installable on a pivotally openable/closable electronic apparatus. The parallelism stabilization...
Hinge structure and electronic device
An exemplary embodiment provides a hinge structure capable of achieving improved durability. The hinge structure includes a hinge pin having a first member and...
Electronic apparatus and controlling method thereof
An electronic apparatus and a controlling method thereof are provided. A fastened mechanism of the electronic apparatus is configured to secure a first housing...
Electronic device with concealed coupling member
An electronic device with a concealed coupling member includes a first shell, a second shell, and at least one locking mechanism. The first shell includes a...
Laminated punched sheet metal electronic enclosure/shield with integrated
An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall...
Stand assembly and electronic apparatus
Stand assembly includes base and first and second stand units. The first stand unit includes first body and extending portion. The first body has first and...
A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be...
Robust consumer electronic device
A method includes providing a molded elastomeric mat having an input protrusion, an output device receiving surface including an output device contact, and a...
Circuit board and method for manufacturing same
A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection...
Transparent conductive film
A transparent conductive film, includes: a transparent substrate, wherein a transparent substrate includes a body and a flexible board, a width of flexible...
Multilayered chip electronic component and board for mounting the same
There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes...
Mounting method of electronic component and electronic component mount
An electronic component is provided with two or more component terminals. A mount board is provided with two or more board terminals. The board terminal is...
Low-profile outdoor lighting module with light emitting diodes
A low-profile lighting module with light-emitting diodes (LEDs) has a water-tight seal between a molded-plastic cover and a printed circuit board (PCB). A...
An electrical connector for electrically connecting a first electronic element to a second electronic element includes an insulating body and multiple...
Method of making a plurality of electronic assemblies
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a...
Electrical equipment, production method thereof and design method of
Electrical equipment 1 includes a chassis 2 that has a bottom portion 3 and side portions 4 and 5, a printed circuit board 10 that is stored in the chassis 2...
Electrically insulating elements and electrically conductive elements
formed from elements having different...
Embodiments of the present invention are directed to electrical devices and methods for fabricating electrical devices using an oxidation process. According to...
Reaction products of heterocyclic nitrogen compounds polyepoxides and
Reaction products of heterocyclic nitrogen compounds, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths,...
Galvanic process for making printed conductive metal markings for chipless
A process for printing a metal wire pattern on a substrate, including: printing a first salt solution including a metal ion that will undergo a reduction...
Method for manufacturing a circuit board with buried element having high
density pin count and the circuit...
A method for manufacturing a circuit board with a buried element having high density pin count, wherein a micro copper window formed in a first circuit by...
Photosensitive element, method for forming resist pattern, and method for
producing printed circuit board
The invention relates to a photosensitive element comprising a support film and a photosensitive layer derived from a photosensitive resin composition formed on...
Carrier board structure
A carrier board structure includes at least one upper magnetic coil, at least one lower magnetic coil, a flexible board, a dielectric layer, at least one...
Wiring board and method for manufacturing the same
A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic...
Mounting structure of chip component and electronic module using the same
An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip...
Multi-layer wire structure for high efficiency wireless communication
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one...