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Two-step direct bonding processes and tools for performing the same
A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal...
Method for producing a microelectronic device
A method for producing a microelectronic device including a substrate and a stack having at least one electrically conductive layer and at least one dielectric...
Method and device for filling carrier tapes with electronic components
A method for filling a carrier tape (10) with electronic components (12) and for removing and replacing defective electronic components (13) from the carrier...
Electronic component mounting method
In an electronic component mounting method, electronic components are picked up from a component supply unit in which two tray supply mechanisms are arranged,...
Assembly equipment and assembly method thereof
The present invention provides an assembly equipment and an assembly method thereof. The assembly equipment is used for assembling a flexible screen with a...
Panel and method for manufacturing the same
A panel includes a display window and a supporting body integrated with the display window. The display window is made of sapphire and the supporting body is...
Radiation shield standoff
A radiation shield standoff comprises a support section having a mounting surface for an electronic component, with the support section configured to separate...
Mobile device cover with detachable EMF blocker
An EMF blocker having a blocking shield made of a material to sufficiently block EMF radiation emitted from electronic devices. The EMF blocker has necessary...
Provisioning cooling elements for chillerless data centers
Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively...
Thermosiphon systems for electronic devices
A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having...
Heat capture system for electrical components providing electromagnetic
An apparatus includes an electrically-powered component, a hermitically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the...
Electronic device with a fan module
An electronic device includes a case, a mother board disposed on the case and a fan module disposed on the case. The fan module includes a frame, adapters and a...
Computer room air conditioning unit
An enclosed air conditioning unit includes a filter section and a cooling section through which intake air passes before being discharged into a space within a...
Systems and methods for passive cooling of components within electrical
A system includes an electrical enclosure, a first electrical unit, a first electrical module, a first heat spreader, and a heat sink. The first electrical unit...
Power component device
A power component device includes a heat sink having a recess with a base surface and a first side surface. The first side surface of the recess is at a...
Regulation of airflow and performance in information handling systems
after fan failure
A fan control subsystem may control a plurality of fans in an information handling system to cool the information handling system. The fan control subsystem may...
Heat dissipation apparatus
A heat dissipation apparatus includes an insulating plate, a conductive plate located on the insulating plate and a power source with an anode connected with...
Configurable air baffle for directing airflow within information handling
An air baffle for directing air within an information handling system is disclosed. The air baffle includes an open region configured to permit passage of an...
Cooling system for electronic components and led lamp having the same
The present invention is directed to a cooling system (1) for electronic components (4). The cooling system (1) comprises means (7) for producing cyclic air...
Chassis rail stabilizer
A chassis rail stabilizer that may be used to securely support a rack mount rail in a server rack, in particular during transportation of the server rack. The...
A drive apparatus includes a power module, a connector and a heat sink. The connector is used for electric connection to an external side and has a flange,...
Handle locking structure and electronic device having handle locking
The present invention is applied to the field of technologies about a handle structure in an electronic device, and discloses a handle locking structure and an...
An electronic device includes a base plate, a plurality of modules detachably fitted and connected to the base plate, a plurality of mounting members configured...
Housing for receiving electrotechnical components
A housing for receiving electrotechnical components includes a first and a second housing shell having, respectively, a first housing web that forms a sealing...
Device case and method of manufacturing the same
A device case includes: a case body having a side wall and an opening; a lid plate for closing the opening, an end portion of the lid plate being projected from...
Curvature-adjustable curved display device
The present invention relates to a curvature-adjustable curved display device including: a base, a curved display device and an adjusting assembly. The curved...
Dual position latch apparatus
A latch apparatus is provided with a dual action mechanism that can either pivot a cam hook from a first side of the apparatus for securing a sub-chassis into a...
Digital position indicator
Position indicator of the movements of bodies or elements of a tool machine, of the type comprising a numerator body (1), enclosed above and laterally in a...
A display device is provided and includes: a display portion; a storage member configured to house the display portion and including an opening through which...
High density telecommunications systems with cable management and heat
A telecommunications system (10/100) is disclosed herein. The telecommunications system (10/100) includes a chassis (12/112) defining a top end (14/114), a...
Flow-guiding apparatus and electronic device including the flow-guiding
The present invention is applicable to the technical field of heat-radiation structures and discloses a flow-guiding apparatus and an electronic device...
Tamper respondent apparatus
A tamper respondent apparatus having an enclosure comprising of an electrically conductive material layer configured to substantially form continuous...
Display device having display panel and a case that covers an edge of the
Provided is a display device which may include a display panel having a long side in a first direction, a short side in a second direction, and a thickness in a...
An attachment structure 1 includes: a plurality of attaching legs 5, 6, 7 projected from an outer surface of a box main body 2 as the object and overlapped with...
Threaded inserts on weatherproof electrical junction boxes
A weatherproof electrical junction box that includes a molded electrical junction box and an insert is disclosed. Specific implementations may comprise a molded...
Rigid flexible printed circuit board and method of manufacturing the same
A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the...
Vertical conductive unit and manufacturing method thereof
The invention provides a vertical conductive unit. The vertical conductive unit comprises an insulating layer comprising a connecting via, a first conductor, a...
A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out...
Systems and methods for loading of a component
In a component loading system, a circuit board may include a socket, a first plurality of holes, and a second plurality of holes. A frame may include two...
Power module package and method of fabricating the same
Disclosed herein is a power module package including a heat radiating plate including a step difference portion around an edge portion thereof, a semiconductor...
Multilayer wiring board for an electronic device
An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a...
Embedded components in a substrate
An embedded component is formed in a PCB stack by applying an adhesive layer across an entire surface of a copper layer and selectively positioning the...
Vibration damping circuit card assembly
A vibration damping circuit card assembly includes a populated circuit card having a mass M. A closed metal container is coupled to a surface of the populated...
Method of making an electronic device having a thin film resistor formed
on an LCP solder mask and related devices
A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid...
Weaved electrical components in a substrate package core
A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands,...
Printed circuit board of probe card
The present invention relates to a printed circuit board of a probe card. The printed circuit board comprises a first side, a second side, a plurality of plated...
Circuit substrate and electronic device
A circuit substrate which is capable of decreasing the possibility that the amount of solder in the overall mounting land is uneven and reducing formation of a...
Mechanical measures to limit stress and strain in deformable electronics
Mechanical measures strengthen a flexible circuit board or deformable electronic by manipulating the location and/or intensity of the stress concentration or to...
Connection board, optoelectronic component arrangement and illumination
A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated...
Conductive film and preparation method thereof
A conductive film includes a transparent insulating substrate and a conductive mesh formed on the transparent insulating substrate, one of them is imprinted to...