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Patent # Description
US-9,748,478 Memory device and method of manufacturing the same
A memory device includes: a memory layer that is isolated for each memory cell and stores information by a variation of a resistance value; an ion source layer...
US-9,748,477 Method of forming a conductive filament in a living resistive memory device including a pre-forming step to...
A resistive random access memory device includes a first electrode; a solid metal oxide electrolyte; and a second electrode, the first and second electrodes...
US-9,748,476 Method for producing a device
A method for producing a device includes depositing a lower electrode metal and a film whose resistance changes. The film whose resistance changes and the lower...
US-9,748,475 Memory devices including phase change material elements
Memory devices having a plurality of memory cells, with each memory cell including a phase change material having a laterally constricted portion thereof. The...
US-9,748,474 Nano-scale electrical contacts, memory devices including nano-scale electrical contacts, and related structures...
Electrical contacts may be formed by forming dielectric liners along sidewalls of a dielectric structure, forming sacrificial liners over and transverse to the...
US-9,748,473 Quantum well device with lateral electrodes
An apparatus includes a substrate having a planar top surface, a sequence of crystalline semiconductor layers located on the planar surface, and first and...
US-9,748,472 Electronic device and method for fabricating the same
An electronic device including a semiconductor memory is provided. The semiconductor memory includes an interlayer dielectric layer disposed over a substrate,...
US-9,748,471 Perpendicular magnetic memory element having magnesium oxide cap layer
The present invention is directed to an STT-MRAM device comprising a plurality of memory elements. Each of the memory elements includes an MTJ structure that...
US-9,748,470 Storage element and storage apparatus
A storage element includes a layer structure including a storage layer having a direction of magnetization which changes according to information, a...
US-9,748,469 Multilayer actuator and display device comprising the same
Provided is a multilayer actuator and a display device comprising the same with improved driving displacement that includes, for example, a plurality of...
US-9,748,468 Actuator device
Actuator device has a main body with base and superstructure bodies, the device having a plurality of actuators formed from a piezoelectric or electrostrictive...
US-9,748,467 Piezoelectric vibrator
A piezoelectric vibrator element is more stably bonded to reduce the displacement with respect to an external force. The piezoelectric vibrator element is...
US-9,748,466 Wafer scale thermoelectric energy harvester
An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of...
US-9,748,465 Thermoelectric module, heat exchanger, exhaust system and internal combustion engine
A thermoelectric module (13), for converting thermal energy into electric energy, includes a plurality of leg pairs (26), which have each a p-doped ...
US-9,748,464 Athletic activity monitoring device with energy capture
Aspects relate to an energy harvesting device adapted for use by an athlete while exercising. The device may utilize a mass of phase-change material to store...
US-9,748,463 Athletic activity monitoring device with energy capture
Aspects relate to an energy harvesting device adapted for use by an athlete while exercising. The device may utilize a mass of phase-change material to store...
US-9,748,462 Floating heat sink support with conductive sheets and LED package assembly for LED flip chip package
A floating heat sink support with copper sheets for a LED flip chip package may include least two copper sheets and a flexible polymer for fixing the copper...
US-9,748,461 Light emitting diodes with enhanced thermal sinking and associated methods of operation
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a...
US-9,748,460 LED back end assembly and method of manufacturing
An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically...
US-9,748,459 Method for manufacturing improved chip-on-board type light emitting device package and such manufactured...
There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a...
US-9,748,458 Light emitting diode module and method of manufacturing the same
A light emitting diode module includes a substrate, a first soldering section, a second soldering section, a block and a light emitting diode die. The substrate...
US-9,748,457 LED with scattering features in substrate
In one embodiment, the transparent growth substrate of an LED die is formed to have light scattering areas, such as voids formed by a laser. In another...
US-9,748,456 Light emitting structure and a manufacturing method thereof
A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The...
US-9,748,455 Semiconductor element, semiconductor device including the same, and method for manufacturing semiconductor element
To provide a semiconductor element that can have the high adhesion between a substrate made of an oxide or the like and a metal film, a semiconductor element...
US-9,748,454 LED package structure and chip carrier
An LED package structure includes a chip carrier and an LED chip. The chip carrier includes a ceramic substrate, a circuit layer, a ceramic reflective plate...
US-9,748,453 Semiconductor light emitting device having convex portion made with different materials
A semiconductor light emitting device includes a substrate formed of a first material; and a convex portion protruding from the substrate and including: a first...
US-9,748,452 Light-emitting element package
One embodiment comprises: a body having a cavity which includes a bottom and sides; a light-emitting element arranged within the cavity of the body; a molding...
US-9,748,451 Radiation-emitting component, transparent material and filler particles, and method of producing same
A radiation-emitting component includes a radiation source; a transparent material disposed in the beam path of the component and including a polymer material...
US-9,748,450 Method of producing an optoelectronic component
A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a mask layer arranged on an upper side of the...
US-9,748,449 Optoelectronic system
An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a first width; an...
US-9,748,448 LED module
An LED module A1 is provided with: a first lead 1 including a die-bonding portion 12 with a mount surface 12a, and a front-end sunk portion 14; a second lead 2...
US-9,748,447 Semiconductor light emitting device
Disclosed is a semiconductor light emitting device including: a plurality of semiconductor layers; and a first electrode which is formed on an exposed region of...
US-9,748,445 Light emitting diode (LED) die module, LED element with the LED die module and method of manufacturing the LED...
A light emitting diode (LED) die module includes an LED die and a guiding layer formed on the LED die. The guiding layer includes a first portion, a second...
US-9,748,444 Light emitting diode having carbon nanotubes
A light emitting diode includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode, a second electrode...
US-9,748,443 Light emitting device
The present disclosure provides a light-emitting device, comprising: a light-emitting stack comprising an active layer, wherein the active layer is configured...
US-9,748,442 Light emitting diodes and associated methods of manufacturing
Light emitting diodes and associated methods of manufacturing are disclosed herein. In one embodiment, a light emitting diode (LED) includes a substrate, a...
US-9,748,441 Dry etching method of manufacturing semiconductor light emitting device substrate
A method of manufacturing a semiconductor light emitting device, including arranging a plurality of particles in a monolayer on a substrate, dry etching the...
US-9,748,440 Semiconductor layer including compositional inhomogeneities
A device comprising a semiconductor layer including a plurality of compositional inhomogeneous regions is provided. The difference between an average band gap...
US-9,748,439 Active matrix light emitting diodes display module with carbon nanotubes control circuits and methods of...
An active matrix light emitting diodes display module integrated with single-walled carbon nanotubes control circuits includes a light emitting diode pixel...
US-9,748,438 Nanostructure semiconductor light emitting device
A nanostructure semiconductor light emitting device includes: a base layer formed of a first-conductivity type nitride semiconductor material; and a plurality...
US-9,748,437 Multicolor LED and method of fabricating thereof
A device includes a support including at least a first area and a second area, and a plurality of first light emitting devices located over the first area of...
US-9,748,436 Semiconductor device and method for manufacturing the same
Disclosed is a semiconductor device comprising a thin film transistor and wirings connected to the thin film transistor, in which the thin film transistor has a...
US-9,748,435 Methods of forming thin-film photovoltaic devices with discontinuous passivation layers
In various embodiments, photovoltaic devices incorporate discontinuous passivation layers (i) disposed between a thin-film absorber layer and a partner layer,...
US-9,748,434 Systems, method and apparatus for curing conductive paste
One embodiment can provide a system for curing conductive paste applied on photovoltaic structures. The system can include a wafer carrier for carrying a...
US-9,748,433 Method for recovering efficacy of solar cell module and portable device thereof
The present disclosure provides a method for recovering the efficacy of solar cell modules and a device thereof. The method includes providing a solar cell...
US-9,748,432 Automated assembly and mounting of solar cells on space panels
The present disclosure provides methods of fabricating a multijunction solar cell panel in which one or more of the steps are performed using an automated...
US-9,748,431 Large scale production of photovoltaic cells and resulting power
The present application discloses systems and methods for manufacturing large PV sheets and conveying large PV sheets away from the PV manufacturing site while...
US-9,748,430 Staircase avalanche photodiode with a staircase multiplication region composed of an AIInAsSb alloy
A staircase avalanche photodiode with a staircase multiplication region composed of an AlInAsSb alloy. The photodiode includes a buffer layer adjacent to a...
US-9,748,429 Avalanche diode having reduced dark current and method for its manufacture
An avalanche diode includes an absorption region in a germanium body epitaxially grown on a silicon body including a multiplication region. Aspect-ratio...
US-9,748,428 Light detection device including a semiconductor light detection element with a through-hole electrode...
A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate,...
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