Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-9,768,186 Three dimensional memory device having well contact pillar and method of making thereof
A monolithic three dimensional memory device includes a semiconductor substrate having a major surface and a doped well region of a first conductivity type...
US-9,768,185 Non-volatile semiconductor memory device and manufacturing method thereof
This non-volatile semiconductor memory device includes a memory cell array including NAND cell units formed in a first direction vertical to a surface of a...
US-9,768,184 Manufacturing method of semiconductor memory device
A manufacturing method of a semiconductor memory device is provided. The semiconductor memory device can suppress current leakage generated during a programming...
US-9,768,183 Source line formation and structure
An initial etch forms a trench over first contact areas of a plurality of NAND strings, the initial etch also forming individual openings over second contact...
US-9,768,181 Ferroelectric memory and methods of forming the same
Ferroelectric memory and methods of forming the same are provided. An example memory cell can include a buried recessed access device (BRAD) formed in a...
US-9,768,180 Methods and apparatus for three-dimensional nonvolatile memory
A method is provided that includes forming a dielectric material above a substrate, forming a hole in the dielectric material, the hole disposed in a first...
US-9,768,179 Connection structures for routing misaligned metal lines between TCAM cells and periphery circuits
An electronic circuit includes a Ternary Content-Addressable Memory (TCAM) array. The TCAM array includes a plurality of TCAM cells that include a first signal...
US-9,768,178 Semiconductor device, static random access memory cell and manufacturing method of semiconductor device
A semiconductor device includes a substrate, a first semiconductor fin, a second semiconductor fin, an n-type epitaxy structure, a p-type epitaxy structure, and...
US-9,768,177 Method of forming conductive material of a buried transistor gate line and method of forming a buried...
A method of forming conductive material of a buried transistor gate line includes adhering a precursor comprising tungsten and chlorine to material within a...
US-9,768,176 Semiconductor device and method for forming the same
A semiconductor device includes a semiconductor substrate including an active region defined by a device isolation film; a gate electrode filled in the active...
US-9,768,175 Semiconductor devices comprising gate structure sidewalls having different angles
The present disclosure provides a semiconductor device including a substrate, a first active region, a second active region, and a gate structure. The first...
US-9,768,174 Semiconductor device
A semiconductor device for efficiently compressing a large volume of image data is provided. The semiconductor device includes a memory cell array, an analog...
US-9,768,173 Semiconductor structure containing low-resistance source and drain contacts
Semiconductor structures having a source contact and a drain contact that exhibit reduced contact resistance and methods of forming the same are disclosed. In...
US-9,768,172 Semiconductor device with series connected inverters having different number of active regions
The semiconductor device includes a first inverter and a second inverter which is connected thereto in series. Each of the first and the second inverters...
US-9,768,171 Method to form dual tin layers as pFET work metal stack
A method of making a semiconductor device includes growing an interfacial layer on a substrate; depositing a first titanium nitride (TiN) layer on the...
US-9,768,170 Fin field effect transistor and method for fabricating the same
Fin field effect transistors (FinFETs) and method for fabricating the same are disclosed. One of the FinFETs includes a substrate, an insulator, a first gate, a...
US-9,768,169 Semiconductor devices and fabricating methods thereof
Provided is a semiconductor device and a fabricating method thereof. The semiconductor device includes a first trench having a first depth to define a fin, a...
US-9,768,168 Fin-type field effect transistor structure and manufacturing method thereof
A fin-type field effect transistor comprising a substrate, at least one gate structure, spacers and source and drain regions is described. The substrate has a...
US-9,768,167 Method and device for a FinFET
A method of forming a semiconductor device includes providing a semiconductor substrate. The semiconductor substrate includes a plurality of fins formed...
US-9,768,166 Integrated LDMOS and VFET transistors
Embodiments are directed to devices and methods for integrating laterally diffused metal oxide semiconductor (LDMOS) technology on vertical field effect...
US-9,768,165 High isolation switch
An embodiment integrated circuit includes a switch and a conductive line over the switch. The switch includes a gate, a first source/drain region at a top...
US-9,768,164 Multi-gate high voltage device
A high voltage semiconductor device, particularly a device including a number of high breakdown voltage transistors having a common drain, first well, and...
US-9,768,163 Semiconductor device and method for fabricating the same
A semiconductor device includes a first gate pattern and a second gate pattern on a substrate, the first gate pattern having a first height and the second gate...
US-9,768,162 Imprinted semiconductor multiplex detection array
An array of sensor devices, each sensor including a set of semiconducting nanotraces having a width less than about 100 nm is provided. Method for fabricating...
US-9,768,161 FinFET capacitor circuit
A capacitor includes a semiconductor substrate. The capacitor also includes a first terminal having a fin disposed on a surface of the semiconductor substrate....
US-9,768,160 Semiconductor device, electronic circuit and method for switching high voltages
Disclosed is a semiconductor device, an electronic circuit, and a method. The semiconductor device includes a semiconductor body; at least one transistor cell...
US-9,768,159 Electrostatic discharge protection device for high voltage
A circuit for protecting against electrostatic discharge events has a semiconductor substrate (200) of first conductivity embedding a first diode in a well...
US-9,768,158 Static electricity protection circuit, electro-optic device and electronic device
In a static electricity protection circuit according to the invention, a first wiring is electrically connected to a drain of a first p-type transistor and a...
US-9,768,157 Amplifier voltage limiting in radio-frequency devices
Disclosed herein are systems and method for voltage clamping in semiconductor circuits using through-silicon via (TSV) positioning. A semiconductor die is...
US-9,768,156 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with...
An IC includes first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain...
US-9,768,155 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
A semiconductor device has an encapsulant deposited over a first surface of the semiconductor die and around the semiconductor die. A first insulating layer is...
US-9,768,154 Semiconductor package and manufacturing method therefor
Disclosed herein is a semiconductor package that includes: a package substrate having a main surface; a plurality of semiconductor devices mounted on the main...
US-9,768,153 Light-emitting apparatus
A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the...
US-9,768,152 Method for producing a light emitting device
A method for producing a light emitting device includes a first bonding step including disposing a first bonding member a mounting substrate, placing a light...
US-9,768,151 Light-emitting module
Provided is a light-emitting module that achieves high brightness, whose electrode structure is simple and whose brightness distribution has rotational...
US-9,768,150 LED display and method for manufacturing the same
An LED display comprises a first end providing a current, a second end receiving the current, a first LED chip, electrically connected between the first end and...
US-9,768,149 Semiconductor device assembly with heat transfer structure formed from semiconductor material
Semiconductor device assemblies with heat transfer structures formed from semiconductor materials are disclosed herein. In one embodiment, a semiconductor...
US-9,768,148 Stacked memory with interface providing offset interconnects
A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the...
US-9,768,147 Thermal pads between stacked semiconductor dies and associated systems and methods
Systems and methods are described for improved heat dissipation of the stacked semiconductor dies by including metallic thermal pads between the dies in the...
US-9,768,146 Battery protection package and process of making the same
The present invention discloses small-size battery protection packages and provides a process of fabricating small-size battery protection packages. A battery...
US-9,768,145 Methods of forming multi-die package structures including redistribution layers
A semiconductor device and a method of making the same are provided. A first die and a second die are placed over a carrier substrate. A first molding material...
US-9,768,144 Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor...
Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed...
US-9,768,143 Hybrid bonding with through substrate via (TSV)
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a first semiconductor wafer and a...
US-9,768,142 Mechanisms for forming bonding structures
Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also...
US-9,768,141 Removal apparatuses for semiconductor chips
An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the...
US-9,768,140 Method for fabricating package structure
A method for fabricating a package structure is provided, which includes the steps of: providing an encapsulant encapsulating at least an electronic element;...
US-9,768,139 Semiconductor device and semiconductor package
The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor...
US-9,768,138 Improving the strength of micro-bump joints
A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the...
US-9,768,137 Stud bump structure for semiconductor package assemblies
A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the...
US-9,768,136 Interconnect structure and method of fabricating same
An interconnect structure and a method of fabrication of the same are introduced. In an embodiment, a post passivation interconnect (PPI) structure is formed...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.