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Patent # Description
US-9,825,001 Light emitting device with light transmissive member and method for manufacturing thereof
A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole,...
US-9,825,000 Semiconductor wire bonding machine cleaning device and method
A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while...
US-9,824,999 Semiconductor die mount by conformal die coating
A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support....
US-9,824,998 Device packaging facility and method, and device processing apparatus utilizing DEHT
Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a...
US-9,824,997 Die package with low electromagnetic interference interconnection
A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die...
US-9,824,996 Semiconductor device having low on resistance
A semiconductor device includes a header, a semiconductor chip fixed to the header constituting a MOSFET, and a sealing body of insulating resin which covers...
US-9,824,995 Flexible circuit leads in packaging for radio frequency devices
A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement...
US-9,824,994 Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods...
A semiconductor device includes: a semiconductor element; a joined member that is joined to the semiconductor element and includes a nickel film; and a joining...
US-9,824,993 Packaging structure
A packaging structure includes a first substrate including a first metal terminal and a first protruding resin portion formed at a first surface; a second...
US-9,824,992 Bump structure having a side recess and semiconductor structure including the same
In some embodiments, the present disclosure relates to a semiconductor structure. The semiconductor structure may have a first conductive structure and a second...
US-9,824,991 Organic thin film passivation of metal interconnections
Electronic assemblies and their manufacture are described. One embodiment relates to a method including depositing an organic thin film layer on metal bumps on...
US-9,824,990 Pad design for reliability enhancement in packages
A package includes a corner, a device die, a molding material molding the device die therein, and a plurality of bonding features. The plurality of bonding...
US-9,824,989 Fan-out package and methods of forming thereof
An embodiment is a package including a molding compound laterally encapsulating a chip with a contact pad. A first dielectric layer is formed overlying the...
US-9,824,988 Fan-out semiconductor package
A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an...
US-9,824,987 Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof
A mechanism of a semiconductor structure with composite barrier layer under redistribution layer is provided. A semiconductor structure includes a substrate...
US-9,824,986 High-frequency device including high-frequency switching circuit
A high-frequency device having a switching circuit including a semiconductor substrate; a first high-frequency input/output terminal; a second high-frequency...
US-9,824,985 Semiconductor device and semiconductor system
A semiconductor device is provided. The semiconductor device includes a seal ring and a noise-absorbing circuit. The noise-absorbing circuit is electrically...
US-9,824,984 Individualised voltage supply of integrated circuits components as protective means against side channel attacks
A semiconductor device, in particular an integrated circuit with protection against side channel attacks, in particular imaging- and probing-based attacks, EMA...
US-9,824,983 Chip carrier, a device and a method
According to various embodiments, a chip carrier may include: a chip supporting region configured to support a chip; a chip contacting region including at least...
US-9,824,982 Structure and fabrication method for enhanced mechanical strength crack stop
Methods for enhancing mechanical strength of back-end-of-line (BEOL) dielectrics to prevent crack propagation within interconnect stacks are provided. After...
US-9,824,981 Semiconductor device and method of producing semiconductor device
A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element...
US-9,824,980 Lead finger locking structure
Various aspects are directed to apparatuses, systems and related methods involving the mitigation of issues relating to thermal expansion and contraction of...
US-9,824,979 Electronic package having electromagnetic interference shielding and associated method
An electronic package includes a substrate having opposing first and second surfaces. Conductive areas are on a first surface of the substrate and include at...
US-9,824,978 Connection patterns for high-density device packaging
Connection patterns for device packaging allow high density circuitry dies to be assembled into packages of manufacturable size. The connection patterns may be...
US-9,824,977 Semiconductor packages and methods of forming the same
In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate...
US-9,824,976 Single-sided power device package
In some examples, a circuit package further includes an insulating layer and a first transistor extending through the insulating layer, where the first...
US-9,824,975 Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
A semiconductor device comprises a first semiconductor die. An encapsulant is disposed around the first semiconductor die. A first stepped interconnect...
US-9,824,974 Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other...
Die (110) and/or undiced wafers and/or multichip modules (MCMs) are attached on top of an interposer (120) or some other structure (e.g. another integrated...
US-9,824,973 Integrated circuit devices having through-silicon via structures and methods of manufacturing the same
Integrated circuit (IC) devices are provided including a substrate having a first sidewall defining a first through hole that is a portion of a through-silicon...
US-9,824,972 Contacts for semiconductor devices and methods of forming thereof
A method for a method of forming a semiconductor device includes providing a semiconductor substrate having a bottom surface opposite a top surface with...
US-9,824,971 Semiconductor device allowing metal layer routing formed directly under metal pad
A semiconductor device may include a metal pad and a first specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor...
US-9,824,970 Methods that use at least a dual damascene process and, optionally, a single damascene process to form...
Disclosed are methods of forming integrated circuit (IC) structures with hybrid metallization interconnects. A dual damascene process is performed to form...
US-9,824,969 Semiconductor structure and methods of forming the same
A semiconductor structure and the method of forming the same are provided. The method of forming a semiconductor structure includes forming a recess feature in...
US-9,824,968 Method, system and computer readable medium using stitching for mask assignment of patterns
A method comprises: accessing data representing a layout of a layer of an integrated circuit (IC) comprising a plurality of polygons defining circuit patterns...
US-9,824,967 Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric
A resistor structure composed of a metal liner is embedded within a MOL dielectric material and is located, at least in part, on a surface of a doped...
US-9,824,966 Three-dimensional memory device containing a lateral source contact and method of making the same
A sacrificial film and an alternating stack of insulating layers and sacrificial material layers are sequentially formed over a substrate. A memory stack...
US-9,824,965 Isolation device
An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality...
US-9,824,964 Package substrate, package structure including the same, and their fabrication methods
This disclosure provides a package substrate, a package structure including the same and their fabrication methods. The package substrate comprises: a first...
US-9,824,963 Wiring board, and semiconductor device
A wiring board includes: a core substrate including: a metal plate having first through holes; a first insulating layer covering an upper surface and a lower...
US-9,824,962 Local dense patch for board assembly utilizing laser structuring metallization process
Methods of forming microelectronic package structures are described. Those methods/structures may include forming a high density region on a board comprising a...
US-9,824,961 Semiconductor device
A semiconductor device includes a substrate, a semiconductor element, a terminal and a solder outflow prevention part. The semiconductor element is fixed on one...
US-9,824,960 Lead frame and method for manufacturing same
Provided is a lead frame including: one or more solder bonding regions containing copper material or copper plating; and a molding resin adhesion region...
US-9,824,959 Structure and method for stabilizing leads in wire-bonded semiconductor devices
A semiconductor device having a leadframe including a pad (101) surrounded by elongated leads (110) spaced from the pad by a gap (113) and extending to a frame,...
US-9,824,958 Chip carrier structure, chip package and method of manufacturing the same
Various embodiments provide a chip carrier structure. The chip carrier structure may include a structured metallic chip carrier; encapsulating material at least...
US-9,824,957 Semiconductor device and method for manufacturing the same
A semiconductor device includes: a semiconductor chip including a main surface electrode; a first mounting lead; a second mounting lead; a connection lead which...
US-9,824,956 Surface-mount semiconductor device having exposed solder material
A process for manufacturing surface-mount semiconductor devices, in particular of the Quad-Flat No-Leads Multi-Row type, comprising providing a metal leadframe,...
US-9,824,955 Semiconductor device
An ESD protection device including a Si substrate with an ESD protection circuit formed at the surface of the substrate; pads formed on the Si substrate; a...
US-9,824,954 Semiconductor package comprising stacked integrated circuit chips having connection terminals and through...
An integrated circuit device comprises N stacked first integrated circuit chips each of which includes a first circuit and N stacked second integrated circuit...
US-9,824,953 Mounting and environmental protection device for an IGBT module
A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom...
US-9,824,952 Light emitting device package strip
Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting...
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