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| Patent # | Description |
|---|---|
| US-9,843,002 |
Organometallic complex, light-emitting element, light-emitting device,
electronic device, and lighting device A novel organometallic complex having high color purity is provided. The organometallic complex includes a structure which includes iridium and a ligand and is... |
| US-9,843,001 |
Blue luminescent compounds There is provided a compound having Formula II ##STR00001## In Formula II: R.sup.1 and R.sup.3 are the same of different and can be alkyl, branched alkyl,... |
| US-9,843,000 |
Heterocyclic compound, light-emitting element, light-emitting device,
electronic device, and lighting device Provided is a novel heterocyclic compound which can be used as a host material for dispersing a light-emitting material in a light-emitting layer of a... |
| US-9,842,999 |
Benzotriazole derivative and an organic electroluminescent device A Benzotriazole derivative represented by the following general formula (1), ##STR00001## wherein, Ar.sup.1 is a monovalent aromatic hydrocarbon group or... |
| US-9,842,998 |
Compound, and light emitting diode and electronic apparatus comprising
same In a novel compound, and a light emitting diode and an electronic apparatus including the same, the novel compound is represented by the following Chemical... |
| US-9,842,997 |
Organic light emitting element and display device An organic light emitting element contains an anode and a cathode, and a light emitting layer arranged between the anode and the cathode. The organic light... |
| US-9,842,996 |
Amine compound having hetero-fused ring and organic electroluminescent
element using amine compound A compound represented by the following formula (1). ##STR00001## |
| US-9,842,995 |
Amine-based compounds and organic light-emitting devices comprising the
same An amine-based compound is represented by Formula 1: ##STR00001## wherein L.sub.1 to L.sub.3, Ar.sub.1 to Ar.sub.3, a1 to a3, and c1 to c3 are as defined in... |
| US-9,842,994 |
Peeling method and method of manufacturing semiconductor device There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a... |
| US-9,842,993 |
Film-forming composition, film formed thereby, and method for
manufacturing organic semiconductor element using... A film-forming composition according to the present invention include fluororesin having a repeating unit of the general formula (1); and a fluorine-containing... |
| US-9,842,992 |
Transistor using piezoresistor as channel, and electronic circuit A transistor includes: a piezoresistor through which carriers conduct; a source that injects the carriers into the piezoresistor; a drain that receives the... |
| US-9,842,991 |
Memory cell with redundant carbon nanotube A configuration for a carbon nanotube (CNT) based memory device can include multiple CNT elements in order to increase memory cell yield by reducing the times... |
| US-9,842,990 |
Semiconductor memory device and method for manufacturing the same According to one embodiment, a semiconductor memory device includes a semiconductor layer, a gate electrode, a metal containing portion, and an insulating... |
| US-9,842,989 |
Magnetic memory with high thermal budget A magnetic memory having a base layer with a wetting layer and seed layer is disclosed. The wetting layer and seed layer promotes FCC structure along the (111)... |
| US-9,842,988 |
Magnetic tunnel junction with low defect rate after high temperature
anneal for magnetic device applications A magnetic tunnel junction is disclosed wherein the reference layer and free layer each comprise one layer having a boron content from 25 to 50 atomic %, and an... |
| US-9,842,987 |
Magnetic tunnel junction memory devices including crystallized
boron-including first magnetic layer on a tunnel... Magnetic memory devices include a magnetic tunnel junction including a free layer, a pinned layer, and a tunnel barrier layer between the free layer and the... |
| US-9,842,986 |
Semiconductor structure and method of forming the same The present disclosure provides a semiconductor structure and a method for manufacturing the same. The semiconductor structure comprises a memory region. The... |
| US-9,842,985 |
Manufacturing method for piezoelectric ceramics Provided are a barium titanate-based piezoelectric ceramics having satisfactory piezoelectric performance and a satisfactory mechanical quality factor... |
| US-9,842,984 |
Piezoelectric element Disclosed is a piezoelectric element wherein a lower electrode made of Pt, a buffer layer made of PLT, and a piezoelectric thin film to be a perovskite... |
| US-9,842,983 |
Piezoelectric multi-layer component A piezoelectric multi-layer component includes a piezoelectric main body, which has an inlet area and an outlet area. In the outlet area or in the inlet area at... |
| US-9,842,982 |
Piezoelectric actuator array A piezoelectric actuator array includes a substrate plate with a number of signal leads and at least one common lead, and a number of piezoelectric bodies... |
| US-9,842,981 |
Hermetically sealed piezoelectric actuator assembly A piezoelectric actuator includes a housing body and lid wherein the housing body defines an open-ended cylindrical interior chamber extending along a... |
| US-9,842,980 |
Resonance apparatus for processing electrical loss using conductive
material and method for manufacturing the same A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The... |
| US-9,842,979 |
Thermoelectric device A thermoelectric device having a flat tube, a first thermoelectric module, and a second thermoelectric module. The thermoelectric modules each have a housing... |
| US-9,842,978 |
Vehicle including thermoelectric generator A vehicle includes an internal combustion engine (ICE) selectable between a running state and a non-running state. A thermoelectric generator (TEG) is in... |
| US-9,842,977 |
Circuit board and method of manufacture An electrical circuit board assembly (ECBA) preferably having at least one LED component and having a substrate that includes a plurality of raised pads formed... |
| US-9,842,976 |
Vertical light emitting devices with nickel silicide bonding and methods
of manufacturing Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a... |
| US-9,842,975 |
Light emitting device package A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a... |
| US-9,842,974 |
Light emitting device including a connection wiring The present invention relates to a light emitting device. The light emitting device according to an embodiment of the present invention comprises: a light... |
| US-9,842,973 |
Method of manufacturing ceramic LED packages with higher heat dissipation Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED... |
| US-9,842,972 |
Radiation-emitting semiconductor component A radiation-emitting semiconductor component includes a semiconductor body having an active layer which emits electromagnetic radiation of a first wavelength... |
| US-9,842,971 |
Electronic component mounting substrate and light emission device using
same There is provided an electronic component mounting substrate which excels in resistance to migration, and is thus capable of maintaining high thermal... |
| US-9,842,970 |
Light emitting device A light emitting device has; a light emitting element, a light reflecting member that is disposed so as to cover the lateral surfaces of the light emitting... |
| US-9,842,969 |
Light-emitting device having transparent package and manufacturing method The present disclosure provides a method for forming a light-emitting device and a light-emitting device formed thereby. The method comprises the steps of... |
| US-9,842,968 |
LED package A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer,... |
| US-9,842,967 |
Nitride semiconductor light emitting element Provided is a nitride semiconductor light emitting element in which deep-level light emission is suppressed, monochromaticity is improved, and light is emitted... |
| US-9,842,966 |
Nano-structured semiconductor light-emitting element There is provided a nanostructure semiconductor light emitting device including a base layer formed of a first conductivity-type semiconductor, a first... |
| US-9,842,965 |
Textured devices Epitaxial growth methods and devices are described that include a textured surface on a substrate in a liquid crystal device. Geometry of the textured surface... |
| US-9,842,964 |
Method for producing a semiconductor layer sequence A method for producing a semiconductor layer sequence is disclosed. In an embodiment the includes growing a first nitridic semiconductor layer at the growth... |
| US-9,842,963 |
GaN-based LED epitaxial structure and preparation method thereof A GaN-based LED epitaxial structure comprises a non-doped GaN buffer layer, an undoped GaN layer, an N-type GaN layer, an InGaN/GaN superlattice quantum well... |
| US-9,842,962 |
Nanostructured hybrid particle, manufacturing method thereof, and device
including the nanostructured hybrid... A nanostructured hybrid particle, a manufacturing method thereof, and a device including the nanostructured hybrid particle are disclosed. The nanostructured... |
| US-9,842,961 |
Light emitting device and method of fabricating the same A method of fabricating a light-emitting device including the steps of forming a first resin including a phosphor on a light-emitting diode chip mounted on a... |
| US-9,842,960 |
Method of manufacturing nanostructure semiconductor light-emitting device According to an example embodiment, a method of manufacturing a nanostructure semiconductor light-emitting device includes forming nanocores of a... |
| US-9,842,959 |
Method for producing a microsystem having pixels A Method for producing a microsystem (1) with pixels includes: producing a thermal silicon oxide layer on the surface of a silicon wafer as a base layer (5) by... |
| US-9,842,958 |
Ultrananocrystalline diamond contacts for electronic devices A method of forming electrical contacts on a diamond substrate comprises producing a plasma ball using a microwave plasma source in the presence of a mixture of... |
| US-9,842,957 |
AlGaAs/GaAs solar cell with back-surface alternating contacts (GaAs BAC
solar cell) The disclosure provides a solar cell design featuring p-or-n type GaAs with alternating p-n junction regions on the back-surface of the cell, opposite incident... |
| US-9,842,956 |
System and method for mass-production of high-efficiency photovoltaic
structures One embodiment of the invention can provide a system for fabricating a photovoltaic structure. During fabrication, the system can form a sacrificial layer on a... |
| US-9,842,955 |
Photovoltaic system and the manufacturing method thereof A photovoltaic system consists of a waveguide body, luminescent dyes and a photovoltaic cell. Luminescent dyes and their aggregated particulates with larger... |
| US-9,842,954 |
Radiation collection apparatus with flexible stationary mirror A stationary radiation focusing device focuses incident radiation onto a movable radiation receiving element. The radiation focusing device is a curved mirror... |
| US-9,842,953 |
Solar battery rectangular conductor, method for fabricating same and solar
battery lead wire A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the... |
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