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Patent # Description
US-9,882,132 Evaporation equipment and evaporating method
The disclosed in the present disclosure is an evaporation equipment and an evaporating method. The evaporation equipment may include: a support, which is...
US-9,882,131 Organic light emitting diode display
An organic light emitting diode display including: a plurality of pixel electrodes formed in a display area of a substrate; a pixel defining layer having an...
US-9,882,130 Apparatus for patterning an article
An apparatus for patterning an article that comprises a first layer of a first material. The apparatus includes a thread, at least one thread guide for guiding...
US-9,882,129 Method of manufacturing a mask frame assembly
A mask frame assembly manufactured via an extension-welding process on a stage, the mask frame assembly includes: a mask frame disposed on a stage, the mask...
US-9,882,128 Method of making an organic thin film transistor
In one aspect, organic thin film transistors are described herein. In some embodiments, an organic thin film transistor comprises a source terminal, a drain...
US-9,882,127 Nonvolatile resistance change element
According to one embodiment, a nonvolatile resistance change element includes a first electrode, a second electrode, a semiconductor layer and a first layer....
US-9,882,126 Phase change storage device with multiple serially connected storage regions
A phase change storage device, Integrated Circuit (IC) chip including the devices and method of manufacturing IC chips with the devices. The device includes a...
US-9,882,125 Selector device for a non-volatile memory cell
Memory cells and methods of forming memory cells are disclosed. The memory cell includes a substrate and a select transistor. The select transistor includes a...
US-9,882,124 Etching method and substrate processing apparatus
An etching method is provided for etching a multilayer film material that includes a metal laminated film having an insulating layer arranged between a first...
US-9,882,123 Perpendicular spin transfer torque memory (STTM) device with enhanced stability and method to form same
Perpendicular spin transfer torque memory (STTM) devices with enhanced stability and methods of fabricating perpendicular STTM devices with enhanced stability...
US-9,882,122 Memory device
According to one embodiment, a memory device includes a stacked structure and a controller. The stacked structure includes a first magnetic layer, a second...
US-9,882,121 Techniques for forming spin-transfer torque memory having a dot-contacted free magnetic layer
Techniques are disclosed for fabricating a self-aligned spin-transfer torque memory (STTM) device with a dot-contacted free magnetic layer. In some embodiments,...
US-9,882,120 Magnetic memory devices including in-plane current layers
A magnetic memory device can include an upper electrode, a lower electrode and a Magnetic Tunnel Junction (MTJ). The MTJ can include a reference magnetic...
US-9,882,119 Magnetic memory device
According to one embodiment, a magnetic memory device includes a first magnetic layer selectively exhibiting a first state in which the first magnetic layer has...
US-9,882,118 Spin control mechanism and spin device
A spin control mechanism includes a spin portion and a first channel portion. The spin portion has a magnetic moment that can be reversed and rotated. The first...
US-9,882,117 Actuator including a dielectric elastomer and electrode films
An actuator capable of preventing occurrence of insulation breakdown while achieving an appropriate operation performance of a dielectric elastomer is provided....
US-9,882,116 Piezoelectric devices and methods for their preparation and use
Methods for fabricating a piezoelectric device are provided. The methods can include providing a substrate and forming a nanocrystalline diamond layer on a...
US-9,882,115 Integrated compliant boundary for piezoelectric bimorph actuator
A piezoelectric bimorph actuator with an integral compliant boundary employs a first piezoelectric element, a second piezoelectric element and a composite layer...
US-9,882,114 De-icing arrangement and method for de-icing a structural element
A de-icing arrangement and a method for de-icing a structural element. The de-icing arrangement includes at least one electromagnetic actuator, a capacitive...
US-9,882,113 Gallium beam lithography for superconductive structure formation
The present invention relates to the use of gallium beam lithography to form superconductive structures. Generally, the method includes exposing a surface to...
US-9,882,112 Multi-qubit device and quantum computer including the same
Multi-qubit devices and quantum computers including the same are provided. The multi-qubit device may include a first layer including a plurality of qubits; a...
US-9,882,111 Thermoelectric devices
This disclosure relates to methods for manufacturing devices capable of functioning as thermoelectric generators and related objects by the process of additive...
US-9,882,110 Thermoelectric device technology
A thermoelectric device for use with solar cells or other heat sources. A substrate has a manufactured surface with a plurality of highland features and lowland...
US-9,882,109 Bi-polar organic semiconductors for thermoelectric power generation
Disclosed are bi-polar semiconductor composites that include at least one organic p-type semiconductor; and at least one organic n-type semiconductor, and...
US-9,882,108 Nanostructured layers of thermoelectric materials
This disclosure provides systems, methods, and apparatus related to thermoelectric materials. In one aspect, a method includes providing a plurality of...
US-9,882,107 LED package with covered bonding wire
Provided is an LED package which is unlikely to cause the attenuation of emitted light from an LED element by bonding wires for electrical connection of the LED...
US-9,882,106 Semiconductor device and light-emitting apparatus
A semiconductor device wherein the horizontal spreading of solder at the time of reflow is suppressed and a plurality of devices can be mounted close to each...
US-9,882,105 LED module
An LED module A1 includes an LED chip 1, a lead group 4 including a lead 4A on which the LED chip 1 is mounted and a lead 4B spaced apart from the lead 4A, a...
US-9,882,104 Light emitting device package having LED disposed in lead frame cavities
Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a first cavity in a first region of the body; a...
US-9,882,103 Method for producing light emitting device
A method for producing a light emitting device includes spraying a resin mixture onto a light emitting element using a pulse spraying method to deposit the...
US-9,882,102 Wafer-level light emitting diode and wafer-level light emitting diode package
A light-emitting diode including a semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between...
US-9,882,101 Method of manufacturing light emitting device
A method of manufacturing a light emitting device includes injecting liquid or pasty transparent resin into a sheet forming mold, adding a phosphor to the resin...
US-9,882,100 Light-emitting device having surface structure for limiting directional angle of light
A light-emitting device includes: a photoluminescent layer that emits light; and a light-transmissive layer on which the emitted light is to be incident. At...
US-9,882,099 Semiconductor light emitting device
According to one embodiment, a semiconductor light-emitting device includes a semiconductor layer including a light emitting layer; and a phosphor layer...
US-9,882,098 Light-emitting device package containing oxynitride-based phosphor and lighting apparatus containing same
An embodiment provides a light-emitting device package comprising: a first lead frame; a second lead frame; a light-emitting device electrically connected to...
US-9,882,097 Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an...
An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by...
US-9,882,096 Light emitting diode structure and method for manufacturing the same
An edge lighting light emitting diode (LED) structure and a method of manufacturing the same are provided. The edge lighting LED structure includes a substrate,...
US-9,882,095 Light emitting device and method for fabricating the same
Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light...
US-9,882,094 Light source with inner and outer bodies comprising three different encapsulants
A light-emitting device having an inner reflective body and an outer non-reflective body is disclosed. The inner reflective body defines a reflector configured...
US-9,882,093 Light emitting element
A light emitting element has: first and second conductivity type semiconductor layers, first and second electrodes disposed on the same face side of the first...
US-9,882,092 Light emitting device, electrode structure, light emitting device package, and lighting system
Provided are a light emitting device, an electrode structure, a light emitting device package, and a lighting system. The light emitting device includes a light...
US-9,882,091 Solid state light emitting device and method of manufacturing a solid state light emitting device
A solid state light emitting device includes a light emitting stack (20), a metallization (30), comprising a guard layer (36) of metal, and a dielectric layer...
US-9,882,090 Method for producing an optoelectronic device with a contact area of accurately and reproducibily defined size
A method for producing an optoelectronic component is disclosed. A first layer which has a dielectric to the surface of a semiconductor crystal. A photoresist...
US-9,882,089 Transparent electron blocking hole transporting layer
A light emitting diode includes an active region configured to emit light, a composite electrical contact layer, and a transparent electron blocking hole...
US-9,882,088 III nitride semiconductor light-emitting device
A long-life III nitride semiconductor light emitting device and a method of producing the same. A III nitride semiconductor light-emitting device includes an...
US-9,882,087 Semiconductor material including different crystalline orientation zones and related production process
The invention relates to a manufacturing process of semiconductor material of element III nitride from a starting substrate, the process comprising: the...
US-9,882,086 III-nitride nanowire LED with strain modified surface active region and method of making thereof
A core-shell nanowire device includes an eave region having a structural discontinuity from the p-plane in the upper tip portion of the shell to the m-plane in...
US-9,882,085 Method for separating epitaxial layers from growth substrates, and semiconductor device using same
The present invention relates to a method for separating epitaxial layers and growth substrates, and to a semiconductor device using same. According to the...
US-9,882,084 Vertical structure LEDs
A vertical light emitting diode structure, comprising: a support structure including a support substrate and a metallic layer, the metallic layer being disposed...
US-9,882,083 Semiconductor nanocrystals and compositions and devices including same
A semiconductor nanocrystal capable of emitting light with an improved photoluminescence quantum efficiency. The present invention further relates to...
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