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Patent # Description
US-9,893,042 Semiconductor device and method
A method and device are provided wherein a first semiconductor device and a via are encapsulated with an encapsulant. A redistribution layer connects the first...
US-9,893,041 Method of forming an array of a multi-device unit cell
Backplane-side bonding structures including a common metal are formed on a backplane. Multiple source coupons are provided such that each source coupon includes...
US-9,893,040 Flip-chip structure of group III semiconductor light emitting device
This application refers to a flip-chip structure of Group III semiconductor light emitting device. The flip-chip structure includes: a substrate, a buffer...
US-9,893,039 Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the...
Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass...
US-9,893,038 Light-emitting device having first and second wiring patterns
A light-emitting device includes a base; wiring patterns formed on the base; and light-emitting elements arranged on the base and/or the wiring patterns. The...
US-9,893,037 Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof
A semiconductor chip includes a semiconductor device with an upper surface and a lower surface opposite to the upper surface. The semiconductor device includes...
US-9,893,036 Semiconductor device and manufacturing method of semiconductor device
A semiconductor device includes a first substrate, an aluminum pad, a first nickel electrode, a second substrate, a second nickel electrode, and a connection...
US-9,893,034 Integrated circuit packages with detachable interconnect structures
An integrated circuit package may include a first integrated circuit die having a first bump structure, a second integrated circuit die having a second bump...
US-9,893,033 Off substrate kinking of bond wire
An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding...
US-9,893,032 Fog bonding device and method thereof
A bonding device and bonding method for bonding an FPC film on a display panel through an anisotropic conductor attached to the display panel, the device...
US-9,893,031 Chip mounting structure
Highly reliable chip mounting is accomplished by using a substrate having such a shape that a stress exerted on a flip-chip-connected chip can be reduced, so...
US-9,893,030 Reliable device assembly
Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises...
US-9,893,029 Semiconductor device and method for manufacturing the same
A semiconductor device includes: an integrated circuit having an electrode pad; a first insulating layer disposed on the integrated circuit; a redistribution...
US-9,893,028 Bond structures and the methods of forming the same
A method includes forming a first conductive feature and a second conductive feature, forming a metal pad over and electrically connected to the first...
US-9,893,027 Pre-plated substrate for die attachment
A method for attaching a semiconductor die to a substrate includes providing a substrate that includes an attachment layer at a surface of the substrate. The...
US-9,893,026 Systems, methods and devices for inter-substrate coupling
Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a...
US-9,893,025 High isolation wideband switch
A high isolation wideband switch is disclosed. In one aspect, the switch includes an integrated circuit package having an integrated circuit die with a first...
US-9,893,024 Light emitting device
The present disclosure provides a light emitting device including a serially-connected LED array comprising a plurality of LED cells on a substrate. The...
US-9,893,023 Semiconductor chip with anti-reverse engineering function
A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first...
US-9,893,022 Self-destructive circuits under radiation
Circuits which self-destruct under radiation are provided. In one aspect, a method for creating a radiation-sensitive circuit is provided. The method includes...
US-9,893,021 Packaging devices and methods for semiconductor devices
Packaging devices and methods for semiconductor devices are disclosed. In some embodiments, a packaging device for a semiconductor device includes a packaging...
US-9,893,020 Semiconductor device
In one embodiment, a semiconductor device comprising, a substrate comprising a wiring layer, a first conductive shielding layer disposed on the substrate and...
US-9,893,019 Semiconductor structure, integrated circuit device, and method of forming semiconductor structure
A semiconductor structure, integrated circuit device, and method of forming semiconductor structure are provided. In various embodiments, the semiconductor...
US-9,893,018 Alignment mark for semiconductor device
Semiconductor devices and methods for manufacturing a semiconductor device include a first semiconductor substrate in which a first scribe line region and a...
US-9,893,016 Multilayer wiring board having wiring structure for mounting multiple electronic components and method for...
A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive...
US-9,893,015 Semiconductor device
A semiconductor device includes an element layer, plural source electrodes, plural drain electrodes, plural gate electrodes, a source bus bar, a drain bus bar,...
US-9,893,014 Designable channel FinFET fuse
On-chip, doped semiconductor fuse regions compatible with FinFET CMOS fabrication are formed from the channel regions of selected fins. One or more fin...
US-9,893,013 Semiconductor device and a method of increasing a resistance value of an electric fuse
A semiconductor device having an electric fuse structure which receives an electric current to permit the electric fuse to be cut without damaging portions...
US-9,893,012 Advanced e-fuse structure with hybrid metal controlled microstructure
A structure and method for fabricating an e-Fuse device in a semiconductor device is described. A method for fabricating an e-Fuse device includes providing a...
US-9,893,011 Back-end electrically programmable fuse
A BEOL e-fuse is disclosed which reliably blows in the via and can be formed even in the tightest pitch BEOL layers. The BEOL e-fuse can be formed utilizing a...
US-9,893,010 Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics
A method includes forming a transistor at a surface of a semiconductor substrate, wherein the step of forming the transistor comprises forming a gate electrode,...
US-9,893,009 Duplicate layering and routing
In some embodiments, a semiconductor arrangement comprises a stacked interconnect structure comprising a first interconnect structure and a second interconnect...
US-9,893,008 High voltage polymer dielectric capacitor isolation device
An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed...
US-9,893,007 Packaged semiconductor devices with multi-use input contacts and related methods
A semiconductor device includes a first contact receiving a first voltage, a second contact receiving a second voltage, one or more comparing elements comparing...
US-9,893,006 Semiconductor module
A semiconductor module includes a plurality of semiconductor chips that include gate electrodes on front surfaces, a gate terminal that receives a control...
US-9,893,005 IC package
An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit...
US-9,893,004 Semiconductor interposer integration
Integrated circuits are described which directly connect a semiconductor interposer to a motherboard or printed circuit board by way of large pitch connections....
US-9,893,003 Package substrate and flip-chip package circuit including the same
This disclosure provides a package substrate, a flip-chip package circuit, and their fabrication methods. The package substrate includes: a first wiring layer...
US-9,893,002 Terminal structure and wiring substrate
A terminal structure of a wiring substrate includes a wiring layer, a protective insulation layer including an opening that partially exposes an upper surface...
US-9,893,001 Semiconductor device, corresponding methods of production and use and corresponding apparatus
A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of...
US-9,893,000 Power semiconductor module and method for manufacturing the same
A power semiconductor module includes: a substrate including first, second, and third metal patterns separated from each other, a semiconductor element located...
US-9,892,999 Producing wafer level packaging using leadframe strip and related device
A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a...
US-9,892,998 Package module of power conversion circuit and manufacturing method thereof
The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion...
US-9,892,997 Adaptable molded leadframe package and related method
A semiconductor package includes at least one semiconductor device situated on a leadframe island, a first at least one lead protruding from a first side of the...
US-9,892,996 Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections,...
US-9,892,995 Semiconductor device
A semiconductor device includes a semiconductor substrate. The semiconductor substrate has a first main surface and a second main surface opposite to the first...
US-9,892,994 Graphene based filler material of superior thermal conductivity for chip attachment in microstructure devices
An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are...
US-9,892,993 Semiconductor module having stacked insulated substrate structures
A semiconductor module (100) has a first insulating substrate (11); a first conductor layer (12) provided on a mounting surface of the first insulating...
US-9,892,992 Swaged heat sink and heat sink integrated power module
A swaged heat includes a fin base having an outer periphery, and formed with a first fin insert groove and a second fin insert groove interposing a swage...
US-9,892,991 Connectable package extender for semiconductor device package
A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure...
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