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Patent # Description
US-9,961,820 Component replenishment support method and component replenishment support system in component mounting line
Provided are a component replenishment support method, and a component replenishment support system of a component mounting line that are capable of preventing...
US-9,961,819 Auxiliary adhesive dispensing apparatus
An auxiliary adhesive dispensing apparatus is connected to a printed circuit board (PCB) through an opening on a side surface of a shielding cover above the...
US-9,961,818 Electronic component mounting machine including a film thickness gauge
An electronic component mounting machine is provided with a film thickness gage. The film thickness gage is provided with measurement sections. The mounting...
US-9,961,817 Substrate working machine
A substrate working machine that performs mounting work on a circuit substrate is provided. The machine includes a receiving section that receives a first...
US-9,961,816 Electronic apparatus assembly machine and similar assembly machine
A mounting device, which receives electronic circuit components from component supply devices, and mounts the components onto a substrate which is carried into...
US-9,961,815 Series of electronic components stored in a tape, manufacturing method for series of electronic components...
A series of electronic components stored in a tape include a plurality of electronic components each arranged such that a first main surface faces a bottom...
US-9,961,814 Touch panel device and method for assembly of a touch panel display
A method includes providing a touch panel interposer, where providing the touch panel interposer comprises providing a touch panel device, applying a first...
US-9,961,813 Shielded cable
A shielded cable includes signal wires each having a signal conductor covered by an insulator, and a shield conductor comprising a metal foil resin tape...
US-9,961,812 Method and apparatus for creating perfect microwave absorbing skins
A method and apparatus for producing a radio frequency absorber (RFA) or perfect microwave absorber (PMA) skin is described herein. A metamaterial layer may be...
US-9,961,811 Controlling access to components in a server housing to enforce use of a grounding strap
A method includes sensing ambient conditions in a datacenter containing a server, and determining whether the ambient conditions exceed threshold conditions...
US-9,961,810 Display device
A display device includes a display panel unit having a noise generating source, and a metal frame to which the display panel unit is attached. The display...
US-9,961,809 Heat radiation sheet and method for manufacturing of the same
Provided are heat radiation sheet and method of manufacturing the same. The heat radiation sheet comprising: a first protective layer; a first adhesive member...
US-9,961,808 Power electronics system
A power-electronics assembly includes a plurality of power modules each having a body, a power stage disposed in the body and having opposing major sides, and a...
US-9,961,807 Electric power convertor
An electric power converter includes a semiconductor module with a built-in switching element, a cooler that cools the semiconductor module, and a metallic case...
US-9,961,806 Systems and methods for transformer cooling by vertical airflow
Systems and methods for transformer cooling by vertical airflow are described. One embodiment of an air transfer unit includes an assembly frame that includes...
US-9,961,805 Electric component and method for producing same
An electric component has a housing part and a component support which is provided with a conductor path structure. The conductor path structure has an...
US-9,961,804 Cooling apparatus and electronic device
A cooling apparatus includes: a circulation path of coolant; a first pump provided in the circulation path, the first pump including a first inlet and a first...
US-9,961,803 Cooling electronic devices in a data center
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a...
US-9,961,802 Reducing condensation risk within liquid cooled computers
An approach is provided in which a manufacturing test scheduling system predicts a dew point forecast indoor a facility based upon outdoor weather data and...
US-9,961,801 Fan assembly and electric power equipment having the same
A fan assembly includes a first guide, a second guide disposed in a direction vertical to the first guide such that the height of the first guide is adjustable,...
US-9,961,800 Liquid cooling apparatus
Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface...
US-9,961,799 Apparatuses and systems for increasing thermal mass in line card heatsinks
The disclosed apparatus may include (1) a faceplate that facilitates at least one connection between at least one communication cable and a line card that...
US-9,961,798 Package and a method of manufacturing the same
In various embodiments, a package may be provided. The package may include a chip carrier. The package may further include a chip arranged over the chip...
US-9,961,797 Air cooled fuel cell system
An air-cooled electronics module is disclosed. The air-cooled electronics module includes a housing and a heat exchanger disposed within the housing and...
US-9,961,796 Server
A server includes a casing, a fan module, at least two processor holders and an air baffle. The casing has an accommodating space. The fan module is located in...
US-9,961,795 Power supply system for shelving system
A power supply system for shelving system includes a support arm, and an electrical supply device mounted on the mounting plate. The support arm includes a...
US-9,961,794 Housing module and electronic device with circuit board quick-assembling function
A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing...
US-9,961,793 Modular electronic device with improved retention/release features and related assembly methods
An electronic module for a modular electronic device may include improved features for retaining the electronic module relative a frame of the modular...
US-9,961,792 Compact media player
An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output...
US-9,961,791 Seal ring and method for manufacturing seal ring
This seal ring (1) is made of a clad material in which a base material layer (10) and a brazing filler metal layer (11) arranged on a first surface (10b) of the...
US-9,961,790 Printed circuit board (PCB), PCB assembly, and washing machine including the same
A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed...
US-9,961,789 Display device and portable terminal
A display device includes a display panel configured to display an image, a light blocking member under the display panel, a bracket facing the display panel...
US-9,961,788 Non-peripherals processing control module having improved heat dissipating properties
The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to...
US-9,961,787 Multi-standard instrumentation chassis
Chassis for an automated test system including a housing and at least a first and a second backplane in the housing. The first backplane provides electrical...
US-9,961,786 Method and structure for limiting cover deflection in an ECU when exposed to high altitude environments
An engine control unit (ECU) includes a housing, a cover sealingly engaged with the housing, a circuit board disposed in the housing and support structure...
US-9,961,785 Wiring substrate and semiconductor device
A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, and a second wiring layer formed on a second surface of the...
US-9,961,784 Manufacturing method of circuit substrate
A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating...
US-9,961,783 Guided transport path correction
A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error,...
US-9,961,782 Transport path correction techniques and related systems, methods and devices
A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences...
US-9,961,781 Optoelectronic assembly and method for producing an optoelectronic assembly
An optoelectronic assembly may include a substrate, which has a first contact region at a first side thereof, an optoelectronic component arranged on the first...
US-9,961,780 Method for manufacturing resin multilayer board
A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a...
US-9,961,779 Method for producing an electronic assembly
A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the...
US-9,961,778 Liquid immersion transfer of electronics
A liquid immersion transfer process for applying electronics on a 3D object and a system is disclosed. In one embodiment, the process comprises providing a foil...
US-9,961,777 Method for cutting a carrier for electrical components
A trench (20) is introduced into a carrier (10) for electrical components (30) on a first surface (O10a) of the carrier into the material of the carrier (10)....
US-9,961,775 Built-in-electronic-component substrate and manufacturing method therefor
A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining...
US-9,961,774 Wireless communications assembly
A wireless communication assembly includes a first support member carrying a baseband processor and a radio processor, and defining a first mounting surface...
US-9,961,773 Printed circuit board assembly
A printed circuit board assembly includes: a first signal terminal row including a plurality of first signal terminals connected to a plurality of signal...
US-9,961,772 Integrated power electronics assembly module
An integrated power electronics assembly module includes a power unit and a clamping auxiliary circuit board. The power unit includes a power level circuit...
US-9,961,771 Printed circuit boards by massive parallel assembly
A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and...
US-9,961,770 Solder pads, methods, and systems for circuitry components
Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at...
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